公开(公告)号：EP0493103A3

公开(公告)日：1993-04-14

申请号：EP91312002.8

申请日：1991-12-23

Applicant: XEROX CORPORATION

Inventor： Mikkelsen, James C. ,  Meuli, William ,  Bruce, Richard ,  Ho, Jackson

IPC: H05K3/34 ,  H05K1/14

CPC classification number: H05K1/142 ,  G09F9/35 ,  H01R4/02 ,  H01R12/52 ,  H05K1/117 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/36 ,  H05K2201/09154 ,  H05K2203/049 ,  Y10T29/49149

Abstract: A method for electrically connecting planar element substrates (12) to form an array (10) by forming conductive bridges (16) between metal pads (14) located on the surface of array elements (12). The conductive bridges (16) are formed to be nearly coplanar with the planar elements (12) and are made to connect the end faces (14b) of pads (14) which are fused to the planar substrate (12). Metal wire (16a), solder (16b-c), a conductive polymer (16d), or a suspension of conductive particles in paste (16e) are used to form the bridges. The bridges (16) have a low profile, occupy a very small area and reduce the need for highly accurate alignment of adjacent substrates (12) within the tiled array (10) before electrical connections are formed. These low profile bridges (16) are especially advantageous tn that they allow a protective plastics or similar cover sheet, or a liquid crystal laminate, to be surface mounted on the adjacent array (10) without causing detrimental surface blemishes or ridges. The small area of the bridges (16) greatly reduces the non-transmitting area of the visual display. The bridges (16), being substantially narrower than the pads (14) which they connect, are more likely to connect the intended pads (14) and less likely to "short" pads (14) which are not in accurate alignment.

公开(公告)号：EP0493103B1

公开(公告)日：1996-03-20

申请号：EP91312002.8

申请日：1991-12-23

Applicant: XEROX CORPORATION

Inventor： Mikkelsen, James C. ,  Meuli, William ,  Bruce, Richard ,  Ho, Jackson

IPC: H05K3/34 ,  H05K1/14

CPC classification number: H05K1/142 ,  G09F9/35 ,  H01R4/02 ,  H01R12/52 ,  H05K1/117 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/36 ,  H05K2201/09154 ,  H05K2203/049 ,  Y10T29/49149

公开(公告)号：EP0493103A2

公开(公告)日：1992-07-01

申请号：EP91312002.8

申请日：1991-12-23

Applicant: XEROX CORPORATION

Inventor： Mikkelsen, James C. ,  Meuli, William ,  Bruce, Richard ,  Ho, Jackson

IPC: H05K3/34 ,  H05K1/14

CPC classification number: H05K1/142 ,  G09F9/35 ,  H01R4/02 ,  H01R12/52 ,  H05K1/117 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/36 ,  H05K2201/09154 ,  H05K2203/049 ,  Y10T29/49149

Abstract: A method for electrically connecting planar element substrates (12) to form an array (10) by forming conductive bridges (16) between metal pads (14) located on the surface of array elements (12). The conductive bridges (16) are formed to be nearly coplanar with the planar elements (12) and are made to connect the end faces (14b) of pads (14) which are fused to the planar substrate (12). Metal wire (16a), solder (16b-c), a conductive polymer (16d), or a suspension of conductive particles in paste (16e) are used to form the bridges. The bridges (16) have a low profile, occupy a very small area and reduce the need for highly accurate alignment of adjacent substrates (12) within the tiled array (10) before electrical connections are formed. These low profile bridges (16) are especially advantageous tn that they allow a protective plastics or similar cover sheet, or a liquid crystal laminate, to be surface mounted on the adjacent array (10) without causing detrimental surface blemishes or ridges. The small area of the bridges (16) greatly reduces the non-transmitting area of the visual display. The bridges (16), being substantially narrower than the pads (14) which they connect, are more likely to connect the intended pads (14) and less likely to "short" pads (14) which are not in accurate alignment.

Abstract translation: 一种用于通过在位于阵列元件（12）的表面上的金属焊盘（14）之间形成导电桥（16）来电连接平面元件基板（12）以形成阵列（10）的方法。 导电桥16被形成为与平面元件12大致共平面，并且被制成连接熔接到平面基板12的焊盘14的端面14b。 金属线（16a），焊料（16b-c），导电聚合物（16d）或导电颗粒在糊料（16e）中的悬浮液）用于形成桥。 桥梁（16）具有低轮廓，占据非常小的面积，并且在电连接形成之前减少了对平铺阵列（10）内的相邻基板（12）进行高精度对准的需要。 这些薄型桥梁（16）特别有利的是，它们允许保护性塑料或类似的覆盖片或液晶层压板被表面安装在相邻阵列（10）上，而不会引起有害的表面瑕疵或脊。 桥梁（16）的小区域大大减少了视觉显示器的不透光区域。 比其连接的焊盘（14）基本上窄的桥（16）更可能连接预期的焊盘（14），并且不太可能连接不准确对准的“短”焊盘（14）。