公开(公告)号：US06727494B2

公开(公告)日：2004-04-27

申请号：US09837124

申请日：2001-04-18

Applicant: Ying-Chuan Lin

Inventor： Ying-Chuan Lin

IPC: H01J4900

CPC classification number: G01N1/40 ,  G01N1/32 ,  G01N1/4044 ,  G01N2033/0095 ,  Y10T436/11 ,  Y10T436/113332 ,  Y10T436/117497

Abstract: A method and an apparatus for detecting contaminating species such as metal particles on a wafer edge from a semiconductor fabrication process are disclosed. In the method, a wafer is suspended and rotated in a container with a volume of solvent at a bottom portion of the container such that only an edge portion of the wafer is exposed to the solvent. After the wafer is turned in the solvent such that the entire edge portion of the wafer has been exposed to the solvent, the solvent may be removed for analyzing in an electronic instrument for detecting the species of contaminating particles. The apparatus further includes a wafer mounting device for supporting the wafer which can be adjusted in height to suit wafers of different diameters.

Abstract translation: 公开了一种用于从半导体制造工艺检测晶片边缘上的污染物质如金属颗粒的方法和装置。 在该方法中，将晶片悬挂并在具有容器体积的溶剂的容器中旋转，使得只有晶片的边缘部分暴露于溶剂。 在溶剂中转动晶片使得晶片的整个边缘部分已经暴露于溶剂之后，可以在用于检测污染颗粒的种类的电子仪器中去除溶剂用于分析。 该装置还包括用于支撑可以调节高度以适应不同直径的晶片的晶片的晶片安装装置。