公开(公告)号：AU2005227167B2

公开(公告)日：2010-12-23

申请号：AU2005227167

申请日：2005-02-23

Applicant: ZIPTRONIX INC

Inventor： FOUNTAIN GAIUS G JR ,  ENQUIST PAUL M ,  PETTEWAY CARL T

IPC: H01L23/495

Abstract: A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

公开(公告)号：AU2005227167A1

公开(公告)日：2005-10-06

申请号：AU2005227167

申请日：2005-02-23

Applicant: ZIPTRONIX INC

Inventor： FOUNTAIN GAIUS G JR ,  ENQUIST PAUL M ,  PETTEWAY CARL T

IPC: H01L23/495

Abstract: A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

公开(公告)号：CA2558507A1

公开(公告)日：2005-10-06

申请号：CA2558507

申请日：2005-02-23

Applicant: ZIPTRONIX INC

Inventor： FOUNTAIN GAIUS G JR ,  PETTEWAY CARL T ,  ENQUIST PAUL M

IPC: H01L21/67 ,  H01L23/495

Abstract: A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

公开(公告)号：WO2005091868A3

公开(公告)日：2009-03-26

申请号：PCT/US2005005641

申请日：2005-02-23

Applicant: ZIPTRONIX INC ,  ENQUIST PAUL M ,  FOUNTAIN GAIUS G JR ,  PETTEWAY CARL T

Inventor： ENQUIST PAUL M ,  FOUNTAIN GAIUS G JR ,  PETTEWAY CARL T

IPC: H01L23/495

CPC classification number: H01L21/67333 ,  H01L2924/0002 ,  Y10S414/135 ,  Y10S414/14 ,  Y10S414/141 ,  H01L2924/00

Abstract: A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

Abstract translation: 一种华夫饼包装置，包括在所述构件的表面中具有凹部以容纳来自至少一个半导体晶片的模具的构件。 该元件与半导体晶片处理设备和/或半导体晶片处理兼容。 优选地，构件容纳来自半导体晶片的至少大部分管芯。 此外，提供了一种半导体器件组装方法，其从单个华夫饼包装置中去除裸片，将来自单个华夫饼包装置的管芯放置在半导体封装上，以从放置的管芯组装集成电路所需的所有管芯部件，并将 放置在半导体封装中以形成集成电路。 提供了另一种半导体器件组装方法，其从至少一个华夫饼包装置去除管芯，将来自至少一个华夫饼包装置的管芯放置在半导体封装上，以从集成电路所需的放置的管芯器件组件中组装，并将 放置在半导体封装中以形成集成电路。

公开(公告)号：EP1721335A4

公开(公告)日：2011-01-05

申请号：EP05713952

申请日：2005-02-23

Applicant: ZIPTRONIX INC

Inventor： ENQUIST PAUL M ,  FOUNTAIN GAIUS G JR ,  PETTEWAY CARL T

IPC: H01L23/495 ,  A47J45/00 ,  B65G47/00 ,  H01L21/44

CPC classification number: H01L21/67333 ,  H01L2924/0002 ,  Y10S414/135 ,  Y10S414/14 ,  Y10S414/141 ,  H01L2924/00