Abstract:
There is provided a personal navigation system, including a head-mounted orientation sensor, a coordinate position sensor, a head-mounted display, and a processor receiving an input from the head-mounted orientation sensor and an input from the coordinate position sensor and providing a visually sensible output for displaying on the head-mounted display.
Abstract:
Inspection of workpieces traveling along a production line includes on-line inspection of the workpieces at an upstream inspection station to detect possible flaws without interrupting the progression of workpieces along the production line. Possible flaws in the inspected workpieces are imaged, and images of possible flaws are stored in a memory in a way that associates a stored image with the workpiece containing the possible flaw. Off-line, a stored image is retrieved from the memory before the workpiece with which the image is associated reaches a downstream sorting station. The retrieved image is displayed on a monitor for verifying, by visual inspection, whether the possible flaw in the workpiece with which the retrieved image is associated, is valid. Workpieces are diverted at the downstream sorting station in response to vertification of flaws.
Abstract:
There is provided an electro-optical system, including at least two spaced-apart units, a head-mounted display (HIVID) unit, having a video signal source, a display source for displaying video signals from the display source, an optical module for projecting video signals from the display source into a user's eye, a driving electronic module, a power supply, and a portable control unit. The two spaced-apart units communicate by a narrowband wireless channel.
Abstract:
A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a faultless pixel or of a pixel that is defective or suspect to be defective. An apparatus is also provided for the determination of such defects, which comprises a stage for supporting a wafer, a laser source generating a beam that is directed onto the wafer, collecting optics and photoelectric sensors for collecting the laser light scattered by the wafer in a number of directions and generating corresponding analog signals, an A/D converter deriving from said signals digital components defining pixel signatures, and selection systems for identifying the signatures of suspect pixels and verifying whether the suspect pixels are indeed defective.
Abstract:
A binary map of an object having edges is produced by first producing a digital grey scale image of the object with a given resolution, and processing the grey scale image to produce a binary map of the object at a resolution greater than said given resolution. Processing of the grey scale image includes the step of convolving the 2-dimensional digital grey scale image with a filter function related to the second derivative of a Gaussian function forming a 2-dimensional convolved image having signed values. The location of an edge in the object is achieved by finding zero crossings between adjacent oppositely signed values. Preferably, the zero crossings are achieved by an interpolation process that produces a binary bit map of the object at a resolution greater than the resolution of the grey scale image. The nature of the Gaussian function whose second derivative is used in the convolution with the grey scale image, namely its standard deviation, is empirically selected in accordance with system noise and the pattern of the traces on the printed circuit board such that the resulting bit map conforms as closely as desired to the lines on the printed circuit board.
Abstract:
A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a faultless pixel or of a pixel that is defective or suspect to be defective. An apparatus is also provided for the determination of such defects, which comprises a stage for supporting a wafer, a laser source generating a beam that is directed onto the wafer, collecting optics and photoelectric sensors for collecting the laser light scattered by the wafer in a number of directions and generating corresponding analog signals, an A/D converter deriving from the signals digital components defining pixel signatures, and selection systems for identifying the signatures of suspect pixels and verifying whether the suspect pixels are indeed defective.
Abstract:
A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a faultless pixel or of a pixel that is defective or suspect to be defective. An apparatus is also provided for the determination of such defects, which comprises a stage for supporting a wafer, a laser source generating a beam that is directed onto the wafer, collecting optics and photoelectric sensors for collecting the laser light scattered by the wafer in a number of directions and generating corresponding analog signals, an A/D converter deriving from the signals digital components defining pixel signatures, and selection systems for identifying the signatures of suspect pixels and verifying whether the suspect pixels are indeed defective.
Abstract:
A method is provided for the detection of defects on a semiconductor wafer by checking individual pixels on the wafer, collecting the signature of each pixel, defined by the way in which it responds to the light of a scanning beam, and determining whether the signature is that of a faultless pixel or of a pixel that is defective or suspect to be defective. An apparatus is also provided for the determination of such defects, which comprises a stage for supporting a wafer, a laser source generating a beam that is directed onto the wafer, collecting optics and photoelectric sensors for collecting the laser light scattered by the wafer in a number of directions and generating corresponding analog signals, an A/D converter deriving from the signals digital components defining pixel signatures, and selection systems for identifying the signatures of suspect pixels and verifying whether the suspect pixels are indeed defective.
Abstract:
There is provided an electro-optical system, including at least two spaced-apart units, a head-mounted display (HMD) unit, having a video signal source, a display source for displaying video signals from the display source, an optical module for projecting video signals from the display source into a user's eye, a driving electronic module, a power supply, and a portable control unit. The two spaced-apart units communicate by a narrowband wireless channel.
Abstract:
There is provided a personal navigation system, including a head-mounted orientation sensor, a coordinate position sensor, a head-mounted display, and a processor receiving an input from the head-mounted orientation sensor and an input from the coordinate position sensor and providing a visually sensible output for displaying on the head-mounted display.