Abstract:
La composition d'un echantillon (52) est determinee par reference a une valeur standard enregistree en utilisant les memes dispositifs de chauffage (56) et detecteur (58) que ceux utilises pour enregistrer la valeur standard, en analysant l'echantillon seulement lorsque sa temperature a atteint un equilibre, et en compensant les differences de temperature ambiante et initiale; une commande precise du dispositif de chauffage est assuree en maintenant une tension constante sur un circuit en serie consistant en un dispositif de chauffage (56) et une charge de resistance (81) egale a la resistance du dispositif de chauffage; le dispositif de chauffage est pulse dans une sequence de test initial pour chauffer le systeme au-dessus de la temperature ambiante de telle sorte que les pertes de chaleur a l'atmosphere soient sensiblement les memes d'un test a un autre, un systeme d'isolation dynamique (66, 68, 70) elimine les pertes de chaleur de l'echantillon en cours de test- un test ameliore base sur la temperature detectee de l'echantillon immediatement apres arret du dispositif de chauffage detecte la presence de falsification de tungstene; un detecteur a infrarouge compense (138-146) elimine le besoin d'un detecteur de temperature a contact direct; des tests permettent de determiner plusieurs caracteristiques physiques d'un echantillon inconnu.
Abstract:
A high output, narrow band thermally energized radiation source comprises a rare earth oxide radiator member that has a cross-sectional dimension in the range of five to thirty micrometers, the rare earth oxide radiator member, when heated to about 1700°C, having a concentrated radiated flux over the 400-2500 nanometer wavelength range such that at least 50% of the radiated flux is within a spectra band that is less than 400 nanometers wide.
Abstract:
Bei einem Verfahren zum pyrometrischen Messen der wahren Temperatur mit Emissionsausgleich durch Zustrah len und Mehrfachreflexion ist im Abstand von der Meßgut oberfläche eine Ergänzungsfläche (2) mit einer Meßöffnung (3) angeordnet, durch die ein Meßstrahl der Optik eines Pyrometers (4) zugeführt wird.
Abstract:
Arrangement for calibration of at least one radiation-sensitive detector means, whereby the arrangement comprises an aperture (90), and at least one reference body (50, 60, 600) which emits radiation with a measurable intensity. The arrangement further comprises a deflection member (160, 170, 620) which deflects radiation from the reference body, and at least one radiation-sensitive detector means (30) which detects the radiation value and generates an output signal dependent on the detected radiation value. The deflection member is arranged to reproduce the aperture (90) on the reference body (50, 60, 600) and the deflection member (160, 170, 620) deflects the radiation such that the midpoint of the reproduction of the aperture (90) remains on substantially the same surface of the reference body (50, 60, 600) during that time period in which the detector means receives radiation which is transmitted from the reference body and which passes through the aperture (90).
Abstract:
The invention relates to an arrangement for recording an IR-image of an object, comprising a focal plane array (FPA) (18) of IR-detectors and an optic (1-7) which images the object on the focal plane IR-detector array. At least one temperature reference (10, 11) is arranged in the beam path to the focal IR-detector array. At least one IR-reference detector (12, 13) is allotted to reference purposes among the IR-detector elements in this array. Each temperature reference is coordinated with at least one of the IR-reference detector elements, so that each of the IR-reference detector elements is impinged upon by radiation deriving essentially solely from one of the temperature references. An IR-detector reference output signal is intended to be produced for each temperature reference. Each IR-reference output signal is intended to set an individual reference level for the output signals from the remaining IR-detector elements in the IR-detector array.
Abstract:
A thermal imager testing device (10) incorporates a pattern plate (32) with patterns (P0, P1, P2 and P3) cut through it. Patterns (P0 and P1) are of like spatial frequency, whereas patterns (P2 and P3) have respective relatively higher spatial frequencies. The patterns (P0 to P3) are like structured and like oriented, and they underlie blackbodies (34, 26, 28 and 30) respectively. Temperature differentials between the blackbodies (34 and 26 to 30) are maintained at constant values by temperature control circuits. The temperature of blackbody (34) is adjustable. The pattern plate (32) and underlying blackbodies are viewed by a thermal imager under test. The temperature of the blackbody (34) is adjusted until pattern (P0) is just discernable as cold relative to the pattern plate (32). If the thermal imager performance is acceptable patterns (P1 to P3) are then just discernable as hot relative to the pattern plate (32).
Abstract:
An infrared (IR) simulator is disclosed in which an array of pixels is defined on an insulative substrate by resistor bridges which contact the substrate at spaced locations and are separated from the substrate, and thereby thermally insulated therefrom, between the contact locations. Semiconductor drive circuits on the substrate enable desired current flows through the resistor bridges in response to input control signals, thereby establishing the appropriate IR radiation from each of the pixels. The drive circuits and also at least some of the electrical lead lines are preferably located under the resistor bridges. A thermal reflector below each bridge shields the drive circuit and reflects radiation to enhance the IR output. The drive circuits employ sample and hold circuits which produce a substantially flicker-free operation, with the resistor bridges being impedance matched with their respective drive circuits. The resistor bridges may be formed by coating insulative base bridges with a resistive layer having the desired properties, and overcoating the resistive layers with a thermally emissive material. The array is preferably formed on a silicon-on-sapphire (SOS) wafer.