公开(公告)号：EP1040210A1

公开(公告)日：2000-10-04

申请号：EP98959227.4

申请日：1998-11-21

Applicant: Korea Institut of Science and Technology

Inventor： KOH, Seok-Keun, ,  JUNG, Hyung, Jin, ,  CHOI, Won, Kook, ,  KIM, Ki Hwan, ,  HA, Sam Chul, ,  KIM, Cheol Hwan,Kaenari 2-cha Apt. 204-905 ,  CHOI, Sung-Chang,

IPC: C23C16/44

CPC classification number: C23C16/30 ,  B05D1/62 ,  B05D5/083 ,  B05D2201/00 ,  B05D2203/30 ,  C23C16/503

Abstract: According to the present invention, there is provided a method for surface processing by plasma polymerization of a surface of a metal by using a DC discharge plasma, comprising the steps of: positioning an anode electrode which is substantially of metal to be surface-processed and a cathode electrode in a chamber; maintaining a pressure in the chamber at a predetermined vacuum level; blowing an unsaturated aliphatic hydrocarbon monomer gas or a fluorine-containing monomer gas at a predetermined pressure and a non-polymerizable gas at a predetermined pressure into the chamber; and applying a voltage to the electrodes in order to obtain a DC discharge, whereby to obtain a plasma consisting of positive and negative ions and radicals generated from the unsaturated aliphatic hydrocarbon monomer gas or the fluorine containing monomer gas and the non-polymerizable gas, and then forming a polymer with hydrophilicity or hydrophobicity on the surface of the anode electrode by plasma deposition, and also provided a method for surface processing by plasma polymerization of a surface of a material including a metal, a ceramic or a polymer by using an RF discharge plasma.