公开(公告)号：JPH1139628A

公开(公告)日：1999-02-12

申请号：JP16460498

申请日：1998-06-12

Applicant: IBM

Inventor： SIMMONS RANDALL GEORGE ,  VICTOR WIN SHUN SHUM

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/00 ,  G11B21/16 ,  G11B21/21 ,  H05K1/02 ,  H05K1/05

Abstract: PROBLEM TO BE SOLVED: To provide a transducer suspension system provided with stuck electric leads. SOLUTION: This transducer suspension system has a transducer head, a lamination member and a load beam. The lamination member 112 is consisting of one support layer 158, at least two electric insulating layers 152, 156 and at least two conductive layers 150, 154. Respective electric leads are directly formed on the lamination layer so that they become directly above or under at least other one electric lead. Electric leads being at upper sides can perform the same noise cancellation as that of twisted pair lines. Moreover, it is possible to accommodate more numerous electric leads by the same suspension width by sticking the electric leads while providing spparations equivalent to a thickness D2 with respect to the minimum distance D1 to be needed in an etching processing. The insulating layer includes, for example, polyimide and the conductive layer can include, for example, copper. Further, a pattern can be formed by coating photoresist on the upper surface of the layer 150 and by exposing it with a light.

公开(公告)号：JPH1055511A

公开(公告)日：1998-02-24

申请号：JP9909197

申请日：1997-04-16

Applicant: IBM

Inventor： ERPELDING A DAVID ,  PATTANAIK SURYA ,  SIMMONS RANDALL GEORGE

IPC: G11B5/39 ,  G11B5/40 ,  G11B5/48 ,  H05K1/00 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To protect an MR head having an MR sensor against the damage generated by the presence of an electric field having static electricity by discharge. SOLUTION: The MR head is provided with shunts in the positions immediate near the terminals of adjacent conductive leads 18, 19 heading toward the MR sensor on the MR head across these leads. Solder overhanging parts of at least one of selected shapes are arranged adjacently to the leads in order to facilitate the removal of the shunts by causing the reflow of solder. These overhanging parts include limitation overhanging parts 30, 32 which play the role of limiting the solder within the shunt regions when the shunts are formed and an assignment part 32 which acts to transfer the solder from the shunt regions to an assigned position at the time of the next reflow of the solder and to give rise to physical breakdown in the shunt accordingly. The need for the physical removal of the solder material is eliminated.