公开(公告)号：US07916495B2

公开(公告)日：2011-03-29

申请号：US12049493

申请日：2008-03-17

Applicant: Chun-Line Huang

Inventor： Chun-Line Huang

IPC: H05K7/10

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2203/058 ,  Y02P70/611 ,  Y02P70/613

Abstract: A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically connected to the first and second conductive parts of the SMD component, respectively. Each of the first and second pad units includes a main portion and a first extension portion. The first extension portion is extended from a first sidewall of the main portion and includes a first border, a second border and a third border. The second border and the third border of the first extension portion are parallel with each other for facilitating alignment of the first and second conductive parts of the SMD component with respect to the first pad unit and the second pad unit.

Abstract translation: 通用焊盘与具有不同尺寸的多个SMD部件一起使用。 每个SMD组件包括第一导电部分和第二导电部分。 通用焊盘包括第一焊盘单元和第二焊盘单元。 第一和第二焊盘单元分别电连接到SMD部件的第一和第二导电部分。 第一和第二垫单元中的每一个包括主要部分和第一延伸部分。 第一延伸部分从主要部分的第一侧壁延伸并且包括第一边界，第二边界和第三边界。 第一延伸部分的第二边界和第三边界彼此平行，以便于SMD部件的第一和第二导电部分相对于第一焊盘单元和第二焊盘单元的对准。

公开(公告)号：US20080316724A1

公开(公告)日：2008-12-25

申请号：US12049493

申请日：2008-03-17

Applicant: Chun-Line Huang

Inventor： Chun-Line Huang

IPC: H05K7/00

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2203/058 ,  Y02P70/611 ,  Y02P70/613

Abstract: A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically connected to the first and second conductive parts of the SMD component, respectively. Each of the first and second pad units includes a main portion and a first extension portion. The first extension portion is extended from a first sidewall of the main portion and includes a first border, a second border and a third border. The second border and the third border of the first extension portion are parallel with each other for facilitating alignment of the first and second conductive parts of the SMD component with respect to the first pad unit and the second pad unit.

Abstract translation: 通用焊盘与具有不同尺寸的多个SMD部件一起使用。 每个SMD组件包括第一导电部分和第二导电部分。 通用焊盘包括第一焊盘单元和第二焊盘单元。 第一和第二焊盘单元分别电连接到SMD部件的第一和第二导电部分。 第一和第二垫单元中的每一个包括主要部分和第一延伸部分。 第一延伸部分从主要部分的第一侧壁延伸并且包括第一边界，第二边界和第三边界。 第一延伸部分的第二边界和第三边界彼此平行，以便于SMD部件的第一和第二导电部分相对于第一焊盘单元和第二焊盘单元的对准。