中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

502 records (took 0.018 seconds)

    Electronic Prototyping
    1.
    发明公开
    Electronic Prototyping 审中-公开

    公开(公告)号：US20230389175A1

    公开(公告)日：2023-11-30

    申请号：US17849305

    申请日：2022-06-24

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Stephen Edward HODGES ,  Michal J. MOSKAL ,  Gabriel D'AMONE ,  James Alexander DEVINE ,  Thomas Jaudon BALL ,  Jonathan Paul DE HALLEUX

    IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30

    CPC classification number: H05K1/0287 ,  H05K1/181 ,  H05K3/306 ,  H05K2201/09954 ,  H05K2201/1034

    Abstract: The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.

    PRINTED CIRCUIT BOARD AND DISK DEVICE
    2.
    发明公开
    PRINTED CIRCUIT BOARD AND DISK DEVICE 审中-公开

    公开(公告)号：US20230309224A1

    公开(公告)日：2023-09-28

    申请号：US17899385

    申请日：2022-08-30

    Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

    Inventor： Kazuyoshi AKUTSU

    IPC: H05K1/11 ,  H05K1/02 ,  G11B5/82

    CPC classification number: H05K1/111 ,  H05K1/0295 ,  G11B5/82 ,  H05K2201/09954

    Abstract: According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.

    ULTRA-SMALL LED ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME
    6.
    发明申请
    ULTRA-SMALL LED ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME 有权
    超小型LED电极组件及其制造方法

    公开(公告)号：US20160148911A1

    公开(公告)日：2016-05-26

    申请号：US14903858

    申请日：2014-07-08

    Applicant: PSI CO., LTD.

    Inventor： Young Rag Do

    IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

    Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

    Abstract translation: 提供了一种纳米级LED组件及其制造方法。 首先，独立制造的纳米级LED器件可以对准并连接到彼此不同的两个电极，以解决将具有纳米单元的纳米级LED器件耦合到彼此不同的两个电极的限制 站立状态。 此外，由于LED器件和电极设置在同一平面上，所以可以提高LED器件的光提取效率。 此外，可以调整纳米级LED器件的数量。 第二，由于纳米尺度的LED器件不能立即连接到上电极和下电极，而是要被连接到在同一平面上彼此不同的两个电极，所以光提取效率可以非常改善 。 此外，由于在LED器件的表面上形成单独的层以防止LED器件和电极电短路，所以可以使LED电极组件的缺陷最小化。 此外，为了准备LED装置的非常罕见的缺陷的发生，可以将多个LED器件连接到电极以保持纳米级LED电极组件的原始功能。

    Light emitting device including a light emitting element mounted on a sub-mount
    9.
    发明授权
    Light emitting device including a light emitting element mounted on a sub-mount 有权
    发光装置，其包括安装在副安装座上的发光元件

    公开(公告)号：US09119304B2

    公开(公告)日：2015-08-25

    申请号：US13566291

    申请日：2012-08-03

    Applicant: Yu-Sik Kim ,  Woo-Sung Han

    Inventor： Yu-Sik Kim ,  Woo-Sung Han

    IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L25/075

    CPC classification number: H05K1/0295 ,  H01L25/0753 ,  H01L2224/16225 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/173

    Abstract: A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes.

    Abstract translation: 提供一种适用于可安装在其上的设备的AC和DC操作的子座，包括这种子座的发光设备以及制造这种子座的方法。 子座包括具有第一表面和第二表面的基底基底，第一表面上的导电图案，第二表面上的第一和第二对第一和第二电极以及在第一和第二表面之间延伸穿过基底的通孔。 导电图案包括第一组安装部分和沿着第一对第一和第二电极之间的第一电路径的两个通孔部分，以及第二组安装部分和沿第二电路的第二组电路之间的两个通孔部分 第一和第二电极，通孔部分将导电图案的各个部分连接到相应的电极。

Patent Agency Ranking