ADHESIVE, ADHESIVE-BACKED MEMBER, AND METHOD FOR CONNECTING BETWEEN MEMBERS
    4.
    发明申请
    ADHESIVE, ADHESIVE-BACKED MEMBER, AND METHOD FOR CONNECTING BETWEEN MEMBERS 审中-公开
    粘合剂,粘合剂,以及连接成员之间的方法

    公开(公告)号:US20160298008A1

    公开(公告)日:2016-10-13

    申请号:US15037690

    申请日:2014-11-20

    Inventor: Yoshihiko Tasaka

    Abstract: A method for joining between members, the method comprising: forming an adhesive layer by applying onto a first member surface a liquid composition containing a thermosetting resin not having a radiation-polymerizable functional group, a hardener, a first polymerizable compound having a radiation-polymerizable functional group and a heat-curable functional group, a second polymerizable compound having a radiation-polymerizable functional group and not having a heat-curable functional group, and a thermally expanding capsule; semi-solidifying the adhesive layer by irradiating radiation onto the adhesive layer; disposing a second member above the semi-solidified adhesive layer so as to oppose the first member surface; and joining the first member and the second member by heating to expand and solidify the semi-solidified adhesive layer.

    Abstract translation: 一种在构件之间接合的方法,所述方法包括:通过在第一构件表面上施加含有不具有可辐射聚合官能团的热固性树脂的液体组合物,硬化剂,具有可放射聚合的第一可聚合化合物 官能团和热固化性官能团,具有可辐射聚合官能团且不具有可热固化官能团的第二可聚合化合物和热膨胀胶囊; 通过将辐射照射到粘合剂层上来使粘合剂层半固化; 在所述半固化粘合剂层之上设置第二构件以与所述第一构件表面相对; 并且通过加热将第一构件和第二构件接合以使半固化粘合剂层膨胀和固化。

    POLISHING SHEET AND POLISHING METHOD
    5.
    发明申请

    公开(公告)号:US20200306933A1

    公开(公告)日:2020-10-01

    申请号:US16954633

    申请日:2019-01-02

    Abstract: Object: To provide a polishing sheet capable of efficiently polishing a hard material such as a metal product so as to form a smooth surface with minimal unevenness. Solution: A polishing sheet (10) including: a substrate (11); a plurality of three-dimensional elements (12) containing abrasive grains and a binding material; and an intermediate layer (13) provided between the three-dimensional elements (12) and the substrate (11) so as to join the substrate (11) and the three-dimensional elements (12), wherein a Youngs modulus of the substrate (11) at 25° C. is not less than 3.0×109Pa; and a Youngs modulus of the intermediate layer (13) at 25° C. is not less than 1.0×107Pa and not greater than 5.0×108Pa.

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