Abstract:
A method of curing a curable composition includes: providing the curable composition; providing a substrate having a primer disposed on at least a portion thereof, wherein the primer comprises at least one immobilized polyvalent metal compound for free-radically curing the curable composition; and contacting the curable composition with the primer, thereby causing at least partial curing of the curable composition. The curable composition includes at least one free-radically polymerizable compound and a beta-dicarbonyl compound. The method can be used for adhesive bonding of substrates and preparation of various articles.
Abstract:
A method of curing a curable composition includes contacting the free-radically curable composition with the solid primer layer thereby causing at least partial curing of the curable composition. The solid primer layer includes a binder material, optional beta-dicarbonyl compound, and an organic peroxide. The curable composition includes at least one free-radically polymerizable compound, a polyvalent metal compound, and a quaternary ammonium halide. The method can be used for adhesive bonding of substrates and preparation of various articles.
Abstract:
The present disclosure relates to a curable precursor of an adhesive composition, wherein the curable precursor comprises (a) a radically (co)polymerizable compound, (b) a vanadium compound, (c) a beta-dicarbonyl compound, and (d) a quaternary ammonium halide. The present disclosure further relates to a method of curing the said curable precursor.
Abstract:
A method for joining between members, the method comprising: forming an adhesive layer by applying onto a first member surface a liquid composition containing a thermosetting resin not having a radiation-polymerizable functional group, a hardener, a first polymerizable compound having a radiation-polymerizable functional group and a heat-curable functional group, a second polymerizable compound having a radiation-polymerizable functional group and not having a heat-curable functional group, and a thermally expanding capsule; semi-solidifying the adhesive layer by irradiating radiation onto the adhesive layer; disposing a second member above the semi-solidified adhesive layer so as to oppose the first member surface; and joining the first member and the second member by heating to expand and solidify the semi-solidified adhesive layer.
Abstract:
Object: To provide a polishing sheet capable of efficiently polishing a hard material such as a metal product so as to form a smooth surface with minimal unevenness. Solution: A polishing sheet (10) including: a substrate (11); a plurality of three-dimensional elements (12) containing abrasive grains and a binding material; and an intermediate layer (13) provided between the three-dimensional elements (12) and the substrate (11) so as to join the substrate (11) and the three-dimensional elements (12), wherein a Youngs modulus of the substrate (11) at 25° C. is not less than 3.0×109Pa; and a Youngs modulus of the intermediate layer (13) at 25° C. is not less than 1.0×107Pa and not greater than 5.0×108Pa.
Abstract:
A method of curing a curable composition includes: providing the curable composition; providing a substrate having a primer disposed on at least a portion thereof, wherein the primer comprises at least one immobilized polyvalent metal compound for free-radically curing the curable composition; and contacting the curable composition with the primer, thereby causing at least partial curing of the curable composition. The curable composition includes at least one free-radically polymerizable compound and a beta-dicarbonyl compound. The method can be used for adhesive bonding of substrates and preparation of various articles.
Abstract:
A method of curing a curable composition includes contacting the free-radically curable composition with the solid primer layer thereby causing at least partial curing of the curable composition. The solid primer layer includes a binder material, optional beta-dicarbonyl compound, and an organic peroxide. The curable composition includes at least one free-radically polymerizable compound, a polyvalent metal compound, and a quaternary ammonium halide. The method can be used for adhesive bonding of substrates and preparation of various articles.