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公开(公告)号：US12289865B2
公开(公告)日：2025-04-29
申请号：US17981182
申请日：2022-11-04
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Chun-Te Wu , Ching-Ming Yang , Yu-Wei Chiu , Tze-Yang Yeh
IPC: H05K7/20 , F28F13/00 , H01L23/373 , H01L23/427 , H01L23/44
Abstract: A two-phase immersion-cooling heat-dissipation composite structure. The heat-dissipation composite structure includes a heat dissipation base, a plurality of high-thermal-conductivity fins, and at least one high-porosity solid structure. The heat dissipation base has a first surface and a second surface that face away from each other. The second surface of the heat dissipation base is in contact with a heating element immersed in a two-phase coolant. The first surface of the heat dissipation base is connected to the high-thermal-conductivity fins. The at least one high-porosity solid structure is located at the first surface of the heat dissipation base, and is connected and alternately arranged between side walls of two adjacent ones of the high-thermal-conductivity fins. Each of the high-porosity solid structure includes a plurality of closed holes and a plurality of open holes.
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2.发明授权公开(公告)号：US12108574B2
公开(公告)日：2024-10-01
申请号：US17981466
申请日：2022-11-06
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Chun-Te Wu , Ching-Ming Yang , Yu-Wei Chiu , Tze-Yang Yeh
CPC classification number: H05K7/2039 , H05K7/203
Abstract: A two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fin surface is connected with the plurality of fins. More than half of the fins are functional fins, and at least one side surface of each of the functional fins and the fin surface have an included angle therebetween that is from 80 degrees to 100 degrees. A center line average roughness (Ra) of the side surface is less than 3 μm, and a ten-point average roughness (Rz) of the side surface is not less than 12 μm.
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3.发明授权公开(公告)号：US11037857B1
公开(公告)日：2021-06-15
申请号：US16711747
申请日：2019-12-12
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Tzu-Hsuan Wang , Tze-Yang Yeh , Chun-Lung Wu
IPC: H01L23/373 , H01L25/07 , H01L23/00 , H01L25/18
Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. The first copper layer and the second copper layer are disposed on the thermally-conductive and electrically-insulating layer at intervals. The first layer of chips and the second layer of chips are disposed on the first bonding layer and the second bonding layer, respectively. The number of chips of the first layer of chips is larger than that of the second layer of chips such that the first copper layer has a greater thickness than the second copper layer.
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公开(公告)号：US12140386B2
公开(公告)日：2024-11-12
申请号：US17903993
申请日：2022-09-06
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Ching-Ming Yang , Tze-Yang Yeh
Abstract: The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.
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公开(公告)号：US12092406B2
公开(公告)日：2024-09-17
申请号：US17978944
申请日：2022-11-01
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Ching-Ming Yang , Chun-Te Wu , Tze-Yang Yeh
CPC classification number: F28F3/02 , F28D15/02 , F28F3/025 , F28F3/027 , F28F2215/04
Abstract: A two-phase immersion-type heat dissipation structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate and a plurality of non-vertical fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the non-vertical fins, a cross-sectional contour of one of the non-vertical fins has a top end point and a bottom end point connected with the fin surface, and the top and bottom end points are opposite to each other. A length of a cross-sectional contour line defined from the top end point to the bottom end point is greater than a perpendicular line length of a perpendicular line defined from the top end point to the fin surface.
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Patent Agency Ranking
公开(公告)号：US12048119B2
公开(公告)日：2024-07-23
申请号：US17685388
申请日：2022-03-03
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Chi-An Chen , Tze-Yang Yeh
CPC classification number: H05K7/203 , F28F3/022 , F28F21/04 , F28F21/084 , H05K7/20409
Abstract: An immersion-type liquid cooling heat dissipation sink is provided. The immersion-type liquid cooling heat dissipation sink includes a heat dissipation substrate layer and a surface film layer. The surface film layer is formed on the heat dissipation substrate layer. The heat dissipation substrate layer is a porous substrate that is immersed in an immersion-type coolant. A contact angle between the surface film layer and the immersion-type coolant is less than a contact angle between the heat dissipation substrate layer and the immersion-type coolant. A thickness of the surface film layer is less than an effective thickness of 5 μm.
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7.发明授权公开(公告)号：US12274032B2
公开(公告)日：2025-04-08
申请号：US17945065
申请日：2022-09-14
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Tze-Yang Yeh , Ching-Ming Yang , Chun-Te Wu
IPC: H05K7/20
Abstract: A two-phase immersion-type heat dissipation structure having high density heat dissipation fins is provided. The two-phase immersion-type heat dissipation structure having high density heat dissipation fins includes a heat dissipation substrate, a plurality of sheet-like heat dissipation fins, and a reinforcement structure. A bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant. The plurality of sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. An angle between at least one of the sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60° to 120°. At least one of the sheet-like heat dissipation fins has a length from 50 mm to 120 mm, a width from 0.1 mm to 0.35 mm, and a height from 2 mm to 8 mm.
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公开(公告)号：US12262511B2
公开(公告)日：2025-03-25
申请号：US18097665
申请日：2023-01-17
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Chun-Te Wu , Ching-Ming Yang , Yu-Wei Chiu , Tze-Yang Yeh
Abstract: A two-phase immersion-type heat dissipation device is provided. The two-phase immersion-type heat dissipation device includes a heat dissipation substrate and a plurality of reinforced fins. The heat dissipation substrate has a first surface and a second surface configured to be in contact with a heating element. The first surface is opposite to the second surface and is arranged away from the heating element. The plurality of reinforced fins are integrally formed on the first surface of the heat dissipation substrate, and a thickness of each of the plurality of reinforced fins is less than 1 mm. According to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate.
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公开(公告)号：US12156376B2
公开(公告)日：2024-11-26
申请号：US17978943
申请日：2022-11-01
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Ching-Ming Yang , Chun-Te Wu , Tze-Yang Yeh
Abstract: A two-phase immersion-type heat dissipation structure having a porous structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, a plurality of fins, and a reinforcement frame. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fins are integrally formed on the fin surface. A porous structure is covered onto at least one portion of the fin surface and at least one portion of the plurality of fins, and has a porosity of from 10% to 50% and a thickness that is from 0.1 mm to 1 mm. The reinforcement frame is bonded to the heat dissipation substrate and surrounds another one portion of the plurality of fins.
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公开(公告)号：US11895778B2
公开(公告)日：2024-02-06
申请号：US17552907
申请日：2021-12-16
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Shih-Hsi Tai , Tung-Ho Tao , Tze-Yang Yeh
CPC classification number: H05K3/061 , H05K1/0207 , H05K2201/0166
Abstract: An etching method for manufacturing a substrate structure having a thick electrically conductive layer, and a substrate structure having a thick electrically conductive layer are provided. The etching method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, an electrically conductive layer, and a non-photosensitive polymer masking layer, removing one part of the non-photosensitive polymer masking layer and one part of the electrically conductive layer by a machining process to form at least one electrically conductive recess having the electrically conductive layer exposed, forming a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, removing a reserved part of the electrically conductive layer between a bottom wall of the electrically conductive recess and a bottom surface of the electrically conductive layer, and removing a remaining part of the non-photosensitive polymer masking layer.
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