公开(公告)号：US20240222187A1

公开(公告)日：2024-07-04

申请号：US18397372

申请日：2023-12-27

Applicant: ASM IP Holding B.V.

Inventor： Aniket Chitale ,  Felix Rabinovich ,  Gary Urban Keppers ,  Han Ye ,  Bradley Wayne Evans ,  Wentao Wang ,  Gregory Rosendahl ,  Amin Azimi

IPC: H01L21/687 ,  C23C16/44 ,  C23C16/458

CPC classification number: H01L21/68792 ,  C23C16/4412 ,  C23C16/4581 ,  H01L21/68785

Abstract: A shaft member includes a cylindrical body formed from a ceramic material and having a drive segment, a frustoconical segment, and an end key segment. The drive segment extends about a rotation axis, the frustoconical segment is offset from the drive segment along the rotation axis, and the end key segment extends axially from the frustoconical segment and is axially separated from the drive segment by the frustoconical segment of the shaft member. The end key segment has a first circumferential facet and a second circumferential facet circumferentially opposite the first circumferential facet to fix the shaft member in rotation about the rotation axis relative to a support member seated when the end key segment is slidably received within an end key socket defined within the support member. Process kits, semiconductor processing systems, and methods of making semiconductor processing systems are also described.

公开(公告)号：US20250137722A1

公开(公告)日：2025-05-01

申请号：US18928383

申请日：2024-10-28

Applicant: ASM IP Holding B.V.

Inventor： Felix Rabinovich ,  Terry Parde ,  Gary Urban Keppers ,  Amin Azimi ,  Alicia Almeda ,  Fauhmee Oudeif

IPC: F27B17/00 ,  B28B11/02 ,  B28D1/02 ,  B28D1/14 ,  B28D1/18

Abstract: A chamber body includes a ceramic weldment having an upper wall, a sidewall, and a lower wall. The upper wall is coupled to the sidewall by a sidewall-to-upper wall weld and includes an upper wall rib segment coupled to an upper wall plate by an upper wall rib segment weld. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld. The lower wall has a lower wall plate portion and a lower wall rib portion extending therefrom both formed from a singular ceramic workpiece using a subtractive manufacturing technique, the lower wall plate portion thereby defining a lower wall unwelded ribbed region including a plurality of lower wall rib segments defined by the lower wall rib portion of the lower wall. Chamber arrangements, semiconductor processing systems, and methods of making ceramic weldments for chamber bodies in chamber arrangement and semiconductor processing systems are also described.

公开(公告)号：US20250137723A1

公开(公告)日：2025-05-01

申请号：US18928413

申请日：2024-10-28

Applicant: ASM IP Holding B.V.

Inventor： Felix Rabinovich ,  Terry Parde ,  Gary Urban Keppers ,  Amin Azimi ,  Alicia Almeda ,  Fauhmee Oudeif ,  Amir Kajbafvala ,  Arun Murali ,  Frederick Aryeetey ,  Alexandros Demos ,  Nayna Khosla ,  Caleb Miskin ,  Hichem M'Saad ,  Shivaji Peddeti ,  Steven Reiter

IPC: F27B17/00 ,  B28B11/02 ,  B28D1/02 ,  B28D1/14 ,  B28D1/18

Abstract: A chamber body includes a ceramic weldment having a lower wall, a sidewall, and an upper wall. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld and the upper wall is coupled to the sidewall by a sidewall-to-upper wall weld. The upper wall has an upper wall plate portion and an upper wall rib portion extending therefrom formed from a singular quartz workpiece using a subtractive manufacturing technique, the upper wall further having a unwelded ribbed region overlying the lower wall. Chamber arrangements, semiconductor processing systems and related methods of making chamber bodies and depositing material layers onto substrates supported within chamber bodies are also described.

公开(公告)号：US20230235428A1

公开(公告)日：2023-07-27

申请号：US18100048

申请日：2023-01-23

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath ,  Shaofeng Chen ,  Gary Urban Keppers ,  Felix Rabinovich

IPC: C22C1/02 ,  C22C21/08 ,  B22D21/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: C22C1/026 ,  C22C21/08 ,  B22D21/007 ,  H01L21/67167 ,  H01L21/68707 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

Abstract: A substrate handling chamber body is formed from a castable aluminum alloy including a manganese (Mn) constituent and an iron (Fe) constituent. The castable aluminum alloy has a manganese (Mn) constituent-to-iron (Fe) constituent ratio that between about 1.125 and about 1.525 to limit microporosity and shrinkage porosity within the castable aluminum alloy forming the substrate handling chamber body. Semiconductor processing systems and methods of making substrate handling chamber bodies for semiconductor processing systems are also described.