公开(公告)号：US20230103251A1

公开(公告)日：2023-03-30

申请号：US17707915

申请日：2022-03-29

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： MING-CHIEH CHIU ,  SHAN-CHENG WU

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29

Abstract: An inductive device is provided. The inductive device includes a laminated body and two external electrodes. The laminated body includes an insulator and a plurality of conductive wiring layers stacked in a first direction. The conductive wiring layers are embedded within the insulator, and any two adjacent ones of the conductive wiring layers are electrically connected to each other to form a coiled conductor extending spirally. The external electrodes are disposed on the laminated body and electrically connected to the coiled conductor, and the external electrodes are spaced apart from each other. Each of the external electrodes includes a base plate, a lateral wall, and a plurality of stress dispersing structures extending toward the coiled conductor and protruding from at least one of the base plate and the lateral wall, and the stress dispersing structures are spaced apart from each other and engaged with the laminated body.

公开(公告)号：US20220076875A1

公开(公告)日：2022-03-10

申请号：US17463686

申请日：2021-09-01

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： YI-CHUN JIN ,  MING-CHIEH CHIU

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/32

Abstract: A thin film inductor and a manufacturing method thereof are provided. The thin film inductor includes a coil assembly, a first magnetic layer, and a second magnetic layer. The coil assembly includes a substrate, a first conductive wire, and a second conductive wire. The first and second conductive wires electrically connected to each other are disposed on first and second surfaces of the substrate, and each have a plurality of winding turns. The first and second conductive wires are embedded in the first and second magnetic layers, respectively. A part of the first magnetic layer fills into a gap between any two adjacent winding turns of the first conductive wire, and a part of the second magnetic layer fills into a gap between any two adjacent winding turns of the second conductive wire.

公开(公告)号：US20220406513A1

公开(公告)日：2022-12-22

申请号：US17697942

申请日：2022-03-18

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： MING-CHIEH CHIU

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F41/12

Abstract: A thin film inductor is provided. The thin film inductor includes a first coil assembly, a first magnetic layer, and a second magnetic layer. The first coil assembly includes a first substrate and two first electrically conductive circuits respectively arranged on two surfaces of the first substrate that are opposite to each other. The first magnetic layer and the second magnetic layer are respectively arranged on the two surfaces of the first substrate that are opposite to each other, and the two first electrically conductive circuits are respectively embedded in the first magnetic layer and the second magnetic layer. The first substrate has a first non-circuit layout, and the first electrically conductive circuit is arranged around the first non-circuit layout. A ratio between an area of the first non-circuit layout and an area of the first substrate is 0.1 or more.

公开(公告)号：US20220068547A1

公开(公告)日：2022-03-03

申请号：US17402717

申请日：2021-08-16

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： MING-CHIEH CHIU

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/12 ,  H01F41/04

Abstract: An inductance device is provided. The inductance device includes a laminated body, a plurality of conductive fillers, a first external electrode, and a second external electrode. The laminated body includes a plurality of insulators and patterned conductors alternately stacked. The laminated body has a bottom surface, a top surface, a first side surface, and a second side surface, the latter two of which are both connected between the bottom and top surface. The conductive fillers distributed in the insulators each pass through corresponding one of the insulators to connect two adjacent ones of the patterned conductors and form a spirally coiled conductor. The first and second external electrodes are respectively formed at the first and second side surfaces. Inner surfaces of the first and second external electrode are respectively connected to uppermost and lowermost ones of the patterned conductors, and are curved surfaces.