公开(公告)号：US20250095917A1

公开(公告)日：2025-03-20

申请号：US18885815

申请日：2024-09-16

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： CHUN-CHIH LIN ,  HSIN HSIEN YEH

IPC: H01F41/10 ,  H01F27/28 ,  H01F27/29 ,  H01F27/30 ,  H01F41/06

Abstract: An inductive component and a method for fabricating the same are provided. The method includes: filling a mold with a first magnetic powder to form a base layer; forming a cavity in the base layer; inserting a coil corresponding to the cavity; filling the mold with a second magnetic powder to form a cover layer, in which the cover layer fills a space between the cavity and the corresponding coil and covers the base layer and the coil; executing a compression molding process to form a to-be-sliced package and taking the to-be-sliced package out; slicing the to-be-sliced package to obtain a to-be-packaged body; and forming a protective layer and an electrode part electrically connected to the coil on a surface of the to-be-packaged body.

公开(公告)号：US20250095909A1

公开(公告)日：2025-03-20

申请号：US18885824

申请日：2024-09-16

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： SHU-PU YANG ,  SHOU-YI TSAO ,  WEN-HUI CHANG

IPC: H01F27/29 ,  H01F27/24 ,  H01F27/28

Abstract: A vertically-wound inductor and a method for fabricating the same are provided. The vertically-wound inductor includes an inductor body, a coil, a first external electrode, a second external electrode and an intermediate layer. The coil includes a first coil portion and a second coil portion that are arranged opposite to each other and have a first gap therebetween. The first external electrode and the second external electrode are arranged on an outer surface of the inductor body, the first external electrode is connected to the first coil portion, and the second external electrode is connected to the second coil portion. The intermediate layer is located in the first gap and has a through hole. The first coil portion is connected to the second coil portion, and a direction of a central magnetic field is parallel to an arrangement direction of the first and second external electrodes.

公开(公告)号：US20240404741A1

公开(公告)日：2024-12-05

申请号：US18502087

申请日：2023-11-06

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： HUNG-CHIH LIANG ,  PIN-YU CHEN ,  HANG-CHUN LU ,  YA-WEN YANG ,  SHIH-KAI HUANG ,  YU-TING HSU ,  WEI-ZHI HUANG

IPC: H01F17/04 ,  H01F27/29

Abstract: A common mode filter includes a first iron core, a second iron core, a first coil, and a second coil. The first iron core includes two first electrode portions and two second electrode portions. The second iron core is disposed above the first iron core, and the first iron core and the second iron core are adhered to each other. All surfaces of the second iron core are coated with an insulating layer. The first coil is wound around the first iron core and the second iron core. The second coil is wound around the first iron core and the second iron core.

公开(公告)号：US20240194388A1

公开(公告)日：2024-06-13

申请号：US18317891

申请日：2023-05-15

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： CHAU-CHYUN CHUNG ,  CHI-FENG LI ,  HSIN HSIEN YEH

IPC: H01F27/255 ,  H01F27/28 ,  H01F41/02

CPC classification number: H01F27/255 ,  H01F27/28 ,  H01F41/0246

Abstract: A composite inductor includes a coil structure and a magnetic packaging structure. The coil structure has a through hole, and the coil structure is embedded in the magnetic packaging structure. The magnetic packaging structure contains at least a first magnetic body and a second magnetic body. Based on a total thickness of the magnetic packaging structure being 100%, a thickness of each of the first magnetic body and the second magnetic body is higher than or equal to 16%.

公开(公告)号：US11800633B2

公开(公告)日：2023-10-24

申请号：US17523018

申请日：2021-11-10

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： Hung-Chih Liang ,  Pin-Yu Chen ,  Hsiu-Fa Yeh ,  Hang-Chun Lu ,  Ya-Wan Yang ,  Yu-Ting Hsu

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/1003 ,  H05K2201/10416

Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.

公开(公告)号：US20230103251A1

公开(公告)日：2023-03-30

申请号：US17707915

申请日：2022-03-29

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： MING-CHIEH CHIU ,  SHAN-CHENG WU

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29

Abstract: An inductive device is provided. The inductive device includes a laminated body and two external electrodes. The laminated body includes an insulator and a plurality of conductive wiring layers stacked in a first direction. The conductive wiring layers are embedded within the insulator, and any two adjacent ones of the conductive wiring layers are electrically connected to each other to form a coiled conductor extending spirally. The external electrodes are disposed on the laminated body and electrically connected to the coiled conductor, and the external electrodes are spaced apart from each other. Each of the external electrodes includes a base plate, a lateral wall, and a plurality of stress dispersing structures extending toward the coiled conductor and protruding from at least one of the base plate and the lateral wall, and the stress dispersing structures are spaced apart from each other and engaged with the laminated body.

公开(公告)号：US11223130B2

公开(公告)日：2022-01-11

申请号：US16784252

申请日：2020-02-07

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： Yen-Ming Chen ,  Chang-Ching Lin ,  Yung-Sheng Chang ,  Sheng-Che Chang

IPC: H01Q1/38 ,  H01Q9/04

Abstract: An antenna structure includes a feeding layer, a resonation layer, and a ground layer. The feeding layer is configured for receiving an antenna feeding signal. The resonation layer is disposed at an area surrounding the feeding layer. A first predetermined distance is defined between the resonation layer and the feeding layer. The ground layer is disposed at a side of the feeding layer and the resonation layer. A second predetermined distance is defined between the ground layer and resonation layer. The ground layer includes a first support portion and a second support portion. The ground layer is not electrically connected to the feeding layer. The resonation layer is electrically connected to the first support portion and the second support portion of the ground layer.

公开(公告)号：US20210249773A1

公开(公告)日：2021-08-12

申请号：US16784252

申请日：2020-02-07

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： YEN-MING CHEN ,  CHANG-CHING LIN ,  YUNG-SHENG CHANG ,  SHENG-CHE CHANG

IPC: H01Q9/04

Abstract: An antenna structure includes a feeding layer, a resonation layer, and a ground layer. The feeding layer is configured for receiving an antenna feeding signal. The resonation layer is disposed at an area surrounding the feeding layer. A first predetermined distance is defined between the resonation layer and the feeding layer. The ground layer is disposed at a side of the feeding layer and the resonation layer. A second predetermined distance is defined between the ground layer and resonation layer. The ground layer includes a first support portion and a second support portion. The ground layer is not electrically connected to the feeding layer. The resonation layer is electrically connected to the first support portion and the second support portion of the ground layer.

公开(公告)号：US20250006424A1

公开(公告)日：2025-01-02

申请号：US18667676

申请日：2024-05-17

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： CHUN-CHIH LIN ,  SHOU-YI TSAO

IPC: H01F41/04 ,  H01F27/02 ,  H01F27/28

Abstract: A method for producing a magnetic device is provided. The magnetic device produced by the method includes a main body that is integrally formed. The method includes a preparing process, a coil assembling process, a placing process, and a forming process. The preparing process is implemented by producing a bottom seat and a lid. The coil assembling process is implemented by fixing a coiling to the bottom seat for formation of a first semi-finished product. The placing process is implemented by placing the first semi-finished product into a mold and placing the lid onto the first semi-finished product for formation of a second semi-finished product. The forming process is implemented by pressurizing the second semi-finished product, such that the bottom seat and the lid are melted and connected to each other to form the main body. The coil is correspondingly encompassed by the main body.

公开(公告)号：US12094648B1

公开(公告)日：2024-09-17

申请号：US18383514

申请日：2023-10-25

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： Chun-Chih Lin ,  Shou-Yi Tsao

IPC: H01F7/06 ,  H01F27/02 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01F41/04 ,  H01F27/02 ,  H01F27/28

Abstract: A magnetic device and a method for producing the same are provided. The magnetic device produced by the method includes a main body that is integrally formed. The method includes a preparing process, a coil assembling process, a placing process, and a forming process. The preparing process is implemented by producing a bottom seat and a lid. The coil assembling process is implemented by fixing a coiling to the bottom seat for formation of a first semi-finished product. The placing process is implemented by placing the first semi-finished product into a mold and placing the lid onto the first semi-finished product for formation of a second semi-finished product. The forming process is implemented by pressurizing the second semi-finished product, such that the bottom seat and the lid are melted and connected to each other to form the main body. The coil is correspondingly encompassed by the main body.