Headphone sealing cup
    1.
    发明授权

    公开(公告)号:US11678104B2

    公开(公告)日:2023-06-13

    申请号:US17488808

    申请日:2021-09-29

    Applicant: EPOS Group A/S

    CPC classification number: H04R1/1083 H04R1/1008

    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.

    Headset
    2.
    外观设计
    Headset 有权

    公开(公告)号:USD1036414S1

    公开(公告)日:2024-07-23

    申请号:US29811370

    申请日:2021-10-13

    Applicant: EPOS Group A/S

    Abstract: FIG. 1 is a perspective view of the headset showing the new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top view thereof;
    FIG. 7 is a bottom view thereof;
    FIG. 8 is a perspective view thereof;
    FIG. 9 is a front view thereof;
    FIG. 10 is a rear view thereof;
    FIG. 11 is a left side view thereof;
    FIG. 12 is a right side view thereof;
    FIG. 13 is a top view thereof;
    FIG. 14 is a bottom view thereof;
    FIG. 15 is a second embodiment of a headset showing the new design;
    FIG. 16 is a front view thereof;
    FIG. 17 is a rear view thereof;
    FIG. 18 is a left side view thereof;
    FIG. 19 is a right side view thereof;
    FIG. 20 is a top view thereof;
    FIG. 21 is a bottom view thereof;
    FIG. 22 is a perspective view thereof;
    FIG. 23 is a front view thereof;
    FIG. 24 is a rear view thereof;
    FIG. 25 is a left side view thereof;
    FIG. 26 is a right side view thereof;
    FIG. 27 is a top view thereof; and,
    FIG. 28 is a bottom view thereof.
    The broken lines depict portions of the headset that form no part of the claimed design.
    The broken lines in the drawings are for purposes of illustration and form no part of the claimed design.

    Microphone
    3.
    外观设计

    公开(公告)号:USD1024033S1

    公开(公告)日:2024-04-23

    申请号:US29811199

    申请日:2021-10-12

    Applicant: EPOS Group A/S

    Abstract: FIG. 1 is a perspective view of the microphone showing our new design;
    FIG. 2 is a front elevation view thereof;
    FIG. 3 is a rear elevation view thereof;
    FIG. 4 is a right side elevation view thereof;
    FIG. 5 is a left side elevation view thereof;
    FIG. 6 is a top view thereof; and,
    FIG. 7 is a bottom view thereof.
    The broken lines in the drawings are for purposes of illustration and form no part of the claimed design.

    HEADPHONE SEALING CUP
    4.
    发明申请

    公开(公告)号:US20220103931A1

    公开(公告)日:2022-03-31

    申请号:US17488808

    申请日:2021-09-29

    Applicant: EPOS Group A/S

    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.

    Headphone sealing cup
    5.
    发明授权

    公开(公告)号:US12133044B2

    公开(公告)日:2024-10-29

    申请号:US18307029

    申请日:2023-04-26

    Applicant: EPOS Group A/S

    CPC classification number: H04R1/1083 H04R1/1008

    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.

    Headset
    6.
    外观设计
    Headset 有权

    公开(公告)号:USD1006789S1

    公开(公告)日:2023-12-05

    申请号:US29811208

    申请日:2021-10-12

    Applicant: EPOS Group A/S

    Abstract: FIG. 1 is a perspective view of the headset according to a first embodiment;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top view thereof;
    FIG. 7 is a bottom view thereof;
    FIG. 8 is a perspective view of the headset according to a second embodiment;
    FIG. 9 is a front view thereof;
    FIG. 10 is a rear view thereof;
    FIG. 11 is a left side view thereof;
    FIG. 12 is a right side view thereof;
    FIG. 13 is a top view thereof;
    FIG. 14 is a bottom view thereof;
    FIG. 15 is a perspective view of the headset according to a third embodiment;
    FIG. 16 is a front view thereof;
    FIG. 17 is a rear view thereof;
    FIG. 18 is a left side view thereof;
    FIG. 19 is a right side view thereof;
    FIG. 20 is a top view thereof; and,
    FIG. 21 is a bottom view thereof.
    The broken lines in the drawings are for purposes of illustration and form no part of the claimed design.

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