Headphone sealing cup
    1.
    发明授权

    公开(公告)号:US11678104B2

    公开(公告)日:2023-06-13

    申请号:US17488808

    申请日:2021-09-29

    Applicant: EPOS Group A/S

    CPC classification number: H04R1/1083 H04R1/1008

    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.

    HEADPHONE SEALING CUP
    2.
    发明申请

    公开(公告)号:US20220103931A1

    公开(公告)日:2022-03-31

    申请号:US17488808

    申请日:2021-09-29

    Applicant: EPOS Group A/S

    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.

    Headphone sealing cup
    3.
    发明授权

    公开(公告)号:US12133044B2

    公开(公告)日:2024-10-29

    申请号:US18307029

    申请日:2023-04-26

    Applicant: EPOS Group A/S

    CPC classification number: H04R1/1083 H04R1/1008

    Abstract: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.

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