公开(公告)号：US12181664B2

公开(公告)日：2024-12-31

申请号：US18089532

申请日：2022-12-27

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Jhih Luo ,  Chia-Hsin Chao ,  Wei-Cheng Chao

IPC: G02B27/00 ,  G02B1/00 ,  G02B3/08 ,  G02B27/01 ,  G02B27/18

Abstract: A head-mounted augmented reality stereo vision optical film, including a light transmitting display layer, an optical projection layer, and an eye tracking layer, is provided. The light transmitting display layer has multiple pixel units. The optical projection layer has multiple light guide units. The light guide unit includes a pinhole configured corresponding to at least one of the pixel units. The eye tracking layer has multiple micro sensing elements.

公开(公告)号：US09692509B2

公开(公告)日：2017-06-27

申请号：US14975864

申请日：2015-12-21

Applicant: Industrial Technology Research Institute

Inventor： Chia-Hsin Chao ,  Yen-Hsiang Fang ,  Ming-Hsien Wu

IPC: H04B10/116 ,  H05B33/08

CPC classification number: H04B10/116 ,  H05B33/0845

Abstract: A driving method of a light emitting device including visible light emitting elements is provided. In a first visible light communication mode, a first portion of the visible light emitting elements is driven and a second portion of the visible light emitting elements is idled for the first portion of the visible light emitting elements having a first current density. In a second visible light communication mode, each of the visible light emitting elements is driven so as to have a second current density. An illumination brightness difference of the light emitting device between the first visible light communication mode and the second visible light communication mode is smaller than 15%.

公开(公告)号：US20160172253A1

公开(公告)日：2016-06-16

申请号：US14954993

申请日：2015-11-30

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Chia-Hsin Chao

IPC: H01L21/66 ,  H01L33/48 ,  H01L21/683 ,  H01L33/00

CPC classification number: H01L21/67144 ,  G01R31/2635 ,  H01L21/6835 ,  H01L22/20 ,  H01L22/22 ,  H01L24/75 ,  H01L24/81 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/12 ,  H01L33/62 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2933/0066

Abstract: A picking-up and placement process for electronic devices comprising: (a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion; (b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and (c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate.

Abstract translation: 一种用于电子设备的拾取和放置过程，包括：（a）提供具有形成在其上的多个电子设备的第一基板，所述电子设备被布置成阵列，并且每个电子设备包括磁性部分; （b）通过从电可编程磁性模块产生的磁力，有选择地从第一基板拾取电子设备的部分; 和（c）将由电可编程磁性模块拾取的电子设备的部件与第二基板接合。

公开(公告)号：US09281451B2

公开(公告)日：2016-03-08

申请号：US13762395

申请日：2013-02-08

Applicant: Industrial Technology Research Institute

Inventor： Wen-Yung Yeh ,  Kuo-Tung Tiao ,  Chia-Hsin Chao ,  Hsi-Hsuan Yen ,  Ming-Hsien Wu ,  Jui-Ying Lin ,  Ying-Chien Chu

IPC: H01L33/48 ,  H01L25/075 ,  H01L23/00 ,  H01L33/20 ,  H01L33/60 ,  F21K99/00 ,  F21Y101/02 ,  F21Y113/02

CPC classification number: H01L33/48 ,  F21K9/90 ,  F21Y2113/20 ,  F21Y2115/10 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.

Abstract translation: 发光元件的制造方法。 提供基板。 多个第一凹部和多个第二凹部形成在基板上，其中每个第一凹部的体积与每个第二凹部的体积不同。 提供了多个第一发光二极管芯片和多个第二发光二极管芯片，其中每个第一发光二极管芯片的体积对应于每个第一凹部的体积，并且每个第二发光二极管芯片的体积 对应于每个第二凹部的体积。 将第一发光二极管芯片移动到基板上，使得第一发光二极管芯片进入第一凹部，并且将第二发光二极管芯片移动到基板上，使得第二发光二极管芯片进入第一凹部 。

公开(公告)号：US20160020578A1

公开(公告)日：2016-01-21

申请号：US14864810

申请日：2015-09-24

Applicant: Industrial Technology Research Institute

Inventor： Jui-Ying Lin ,  Yen-Hsiang Fang ,  Chia-Hsin Chao ,  Yao-Jun Tsai ,  Yi-Chen Lin

IPC: H01S5/024 ,  H01S5/02 ,  H01S5/34 ,  H01S5/026

CPC classification number: H01L23/481 ,  G02B6/12 ,  G02B6/34 ,  G02B2006/12061 ,  H01L21/30604 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L25/167 ,  H01L27/0255 ,  H01L29/861 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29294 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48148 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2224/80805 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2933/0066 ,  H01S5/0208 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/34 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.

公开(公告)号：US20150108508A1

公开(公告)日：2015-04-23

申请号：US14586847

申请日：2014-12-30

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Chia-Hsin Chao ,  Yen-Hsiang Fang ,  Yi-Chen Lin ,  Ying-Chien Chu ,  Mu-Tao Chu

IPC: H01L31/173

CPC classification number: H01L31/173 ,  G02F1/157 ,  G02F2001/13324 ,  G02F2201/44 ,  H01L27/3209 ,  H01L27/3211 ,  H01L27/322 ,  H01L27/3227 ,  H01L27/3232 ,  H01L27/3246 ,  H01L27/3272 ,  H01L27/3283 ,  H01L51/5284 ,  H01L2251/5323

Abstract: A display panel comprising a substrate, a meshed shielding pattern, a plurality of light-emitting devices and a solar cell is provided. The substrate has a first surface and a second surface opposite to the first surface, the substrate comprises a first circuit layer disposed over the first surface and a second circuit layer disposed over the second surface. The meshed shielding pattern is disposed on first surface of the substrate to define a plurality of pixel regions over the substrate. The light-emitting devices are disposed on the first surface of the substrate and electrically connected to the first circuit layer, and at least one of the light-emitting devices is disposed in one of the pixel regions. The solar cell is disposed on the second surface of the substrate and electrically connected to the second circuit layer.

Abstract translation: 提供了包括基板，网状屏蔽图案，多个发光装置和太阳能电池的显示面板。 衬底具有与第一表面相对的第一表面和第二表面，衬底包括设置在第一表面上的第一电路层和设置在第二表面上的第二电路层。 网状屏蔽图案设置在基板的第一表面上以在基板上限定多个像素区域。 发光装置设置在基板的第一表面上并电连接到第一电路层，并且至少一个发光装置设置在一个像素区域中。 太阳能电池设置在基板的第二表面上并电连接到第二电路层。

公开(公告)号：US11810484B2

公开(公告)日：2023-11-07

申请号：US17483812

申请日：2021-09-24

Applicant: Industrial Technology Research Institute

Inventor： Chia-Hsin Chao ,  Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Po-Hsun Wang ,  Li-Chun Huang

IPC: G09F9/302 ,  G09G3/32 ,  H01L27/15 ,  H01L27/142 ,  H01L33/62

CPC classification number: G09F9/3026 ,  G09G3/32 ,  H01L27/142 ,  H01L27/156 ,  H01L33/62 ,  G09G2300/026

Abstract: A spliced display including a transparent substrate, a plurality of micro (light-emitting diodes) LEDs, and a plurality of light sensors is provided. The transparent substrate has a display surface and a back surface opposite to each other. The driving backplanes are disposed on the back surface of the transparent substrate to be spliced with each other. The micro LEDs are disposed on the driving backplanes respectively and located between the micro LEDs and the transparent substrate. Each of the driving backplanes is corresponding to parts of the micro LEDs. The light sensors are disposed on the transparent substrate and located between the driving backplanes and the transparent substrate. Each of the light sensors is adjacent to at least two of the micro LEDs, and at least one of the at least two of the micro LEDs is adjacent to two of the light sensor.

公开(公告)号：US11803052B2

公开(公告)日：2023-10-31

申请号：US17229846

申请日：2021-04-13

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Jhih Luo ,  Chia-Hsin Chao ,  Chun-Wen Chu ,  Ching-Ya Yeh

IPC: G02B27/00 ,  G02B27/01

CPC classification number: G02B27/0093 ,  G02B27/0172 ,  G02B2027/014

Abstract: A head-mounted eye tracking system including an optical combiner, an eye tracker and a signal processor is provided. The optical combiner includes an optical coupler. The eye tracker is at least partially disposed on the optical combiner and is suitable for sensing an eyeball movement of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are suitable for emitting tracking beams. The plurality of sensing devices are suitable for receiving the tracking beams reflected by the eyeball of the wearer. The signal processor is signally connected to the eye tracker.

公开(公告)号：US11244937B2

公开(公告)日：2022-02-08

申请号：US16706799

申请日：2019-12-08

Applicant: Industrial Technology Research Institute

Inventor： Wei-Sheng Su ,  Chia-Hsin Chao ,  Mao-Chi Lin ,  Yen-Hsiang Fang ,  Li-Chun Huang ,  Ming-Hsien Wu

IPC: G09G3/32 ,  G02B5/08 ,  H01L25/16 ,  H01L23/498 ,  H01L23/544

Abstract: A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.

公开(公告)号：US20210375982A1

公开(公告)日：2021-12-02

申请号：US17385954

申请日：2021-07-27

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Chia-Hsin Chao ,  Yen-Hsiang Fang

IPC: H01L27/15

Abstract: A display array including a semiconductor stacked layer, an insulating layer, a plurality of electrode pads, and a driving backplane is provided. The semiconductor stacked layer has a plurality of light emitting regions arranged along a reference plane. The insulating layer is disposed to an outer surface of the semiconductor stacked layer and contacts the semiconductor stacked layer. The insulating layer has a plurality of openings respectively corresponding to the plurality of light emitting regions. The electrode pads are disposed to the insulating layer and are respectively electrically connect the plurality of light emitting regions through the plurality of openings. The driving backplane is disposed to the semiconductor stacked layer and electrically connected to the plurality of electrode pads, wherein a light emitting material layer of the semiconductor stacked layer has consistency along an extension direction of the reference plane.