公开(公告)号：US20230317592A1

公开(公告)日：2023-10-05

申请号：US17711749

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Brandon Christian Marin ,  Hamid R. Azimi ,  Sri Chaitra Jyotsna Chavali ,  Tarek A. Ibrahim ,  Wei-Lun K Jen ,  Rahul Manepalli ,  Kevin T. McCarthy

IPC: H01L23/498

CPC classification number: H01L23/49894 ,  H01L23/49822 ,  H01L23/49827

Abstract: In one embodiment, a package substrate includes a substrate core, buildup layers, and one or more conductive traces. The substrate core includes at least one dielectric layer with hollow glass fibers. The buildup layers include dielectric layers below and above the substrate core.

公开(公告)号：US10078204B2

公开(公告)日：2018-09-18

申请号：US14229909

申请日：2014-03-29

Applicant: Intel Corporation

Inventor： Nilanjan Z. Ghosh ,  Kevin T. McCarthy ,  Zhiyong Wang ,  Deepak Goyal ,  Changhua Liu ,  Leonel R. Arana

IPC: G01J3/28 ,  G01J3/04 ,  G01J3/44 ,  G02B21/00 ,  G01N21/65 ,  G01N21/84 ,  G01N21/95 ,  G01N21/21

CPC classification number: G02B21/008 ,  G01J3/44 ,  G01N21/21 ,  G01N21/65 ,  G01N21/8422 ,  G01N21/9501 ,  G01N2021/656 ,  G02B21/0064

Abstract: Embodiments include devices, systems and processes for using a combined confocal Raman microscope for inspecting a photo resist film material layer formed on the top surface of a layer of a substrate package, to detect border defects between regions of light exposed (e.g., cured) and unexposed (e.g., uncured) resist film material. Use of the confocal Raman microscope may provide a 3D photo-resist chemical imaging and characterization technique based on combining (1) Raman spectroscopy to identify the borders between regions of light exposed and unexposed resist along XY planes, with (2) Confocal imaging to select a Z-height of the XY planes scanned. Such detection provides fast, high resolution, non-destructive in-line inspection, and improves technical development of polymerization profiles of the resist film material.