Abstract:
The disclosed spray deposition systems and methods use spray charging and discharging techniques to assist with digital deposition of spray droplets on a substrate. For example, the disclosed systems and methods have a charging system that generates spray droplets from a spray generator and charges the droplets. Focusing electrodes help to collimate the droplets into a tight droplet stream and, optionally, steering electrodes help direct the tight droplet stream. A charge removal system neutralizes or removes the charge from the droplets, either during the deposition of the droplets on a substrate or after the droplets have been deposited on a substrate.
Abstract:
A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader.
Abstract:
The disclosed spray deposition systems and methods use spray charging and discharging techniques to assist with digital deposition of spray droplets on a substrate. For example, the disclosed systems and methods have a charging system that generates spray droplets from a spray generator and charges the droplets. Focusing electrodes help to collimate the droplets into a tight droplet stream and, optionally, steering electrodes help direct the tight droplet stream. A charge removal system neutralizes or removes the charge from the droplets, either during the deposition of the droplets on a substrate or after the droplets have been deposited on a substrate.
Abstract:
A system and method are provided for using magnetic elements to secure thin wires precisely in an injection molding process in a manner that matches a three-dimensional shape of the an injection molded product produced by the injection molding (overmolding) process. The thin wires are substantially immobilized in a manner that is designed to generally overcome the tendency of the thin wires, which have little mechanical strength, to normally deflect during an injection molding process by employing the magnetic forces produced by embedded magnets. Magnets are integrated into either the cavity or core of a mold structure and the thin wires are placed on those magnets to keep the wires in place during an injection molding process that allows the thin wires to be overmolded. A balance of the core and/or cavity of the mold will be formed of a non-magnetic material.