公开(公告)号：US11658081B2

公开(公告)日：2023-05-23

申请号：US17326829

申请日：2021-05-21

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Yoichi Isozumi ,  Takafumi Betsui ,  Shuuichi Kariyazaki

IPC: H01L21/66 ,  H01L25/065 ,  H01L23/538 ,  H01L23/64

CPC classification number: H01L22/32 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/647 ,  H01L25/0655

Abstract: A semiconductor apparatus includes a mounting board, a system on chip (SOC) package and a memory package which are provided on the mounting board. The SOC package includes a semiconductor chip and a package substrate on which the semiconductor chip is mounted. The semiconductor apparatus further includes a signal wiring line through which a signal between the semiconductor chip and the memory package is transmitted, being provided on the package substrate and in the mounting board and a measurement terminal connected to the signal wiring line on main surface of the package substrate.