公开(公告)号：US20240215202A1

公开(公告)日：2024-06-27

申请号：US18513650

申请日：2023-11-20

Applicant: TMY Technology Inc.

Inventor： Pei-Hung Kuo

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K7/20436 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/032

Abstract: A package structure includes a substrate having a bearing surface, an electronic component disposed on the bearing surface and having a first height, at least one heat conductor disposed on the bearing surface and having a second height, an encapsulant disposed on the bearing surface and having a side covering the electronic component and the at least one heat conductor and a third height, and a heat dissipation structure disposed on the encapsulant. The third height is greater than or equal to the first height and the second height. A surrounding area where the substrate is in contact with the electronic component is a heat-generating area, and the at least one heat conductor is disposed in the heat-generating area.