公开(公告)号：US12089331B2

公开(公告)日：2024-09-10

申请号：US17314131

申请日：2021-05-07

Applicant: Aplus Semiconductor Technologies Co., Ltd.

Inventor： Cheng-Neng Chen ,  Sui-Ho Tsai ,  Yun-Nan Wang ,  Chiao-Hui Wang

IPC: H05K1/14 ,  C23C14/34 ,  C23C14/58 ,  C23C18/16 ,  C23C28/02 ,  C25D5/02 ,  C25D5/10 ,  G03F7/004 ,  G03F7/20 ,  H05K1/11

CPC classification number: H05K1/147 ,  C23C14/34 ,  C23C14/5873 ,  C23C18/1637 ,  C23C28/023 ,  C25D5/022 ,  C25D5/10 ,  G03F7/0041 ,  G03F7/2016 ,  H05K1/11 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0341

Abstract: A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

公开(公告)号：US12016132B2

公开(公告)日：2024-06-18

申请号：US17041158

申请日：2019-03-27

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Kayo Hashizume ,  Masamichi Yamamoto

IPC: H05K3/38 ,  H05K1/03

CPC classification number: H05K3/382 ,  H05K1/03 ,  H05K2201/032 ,  H05K2203/095 ,  H05K2203/1131

Abstract: A base material for a printed circuit board includes a base film having an insulating property, and a sintered body layer including metal particles and layered on at least one surface of the base film. The sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film. The embedment ratio of the sintered particles is greater than or equal to 10% and less than or equal to 90%.

公开(公告)号：US20240074058A1

公开(公告)日：2024-02-29

申请号：US18164748

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAEKWANG LEE ,  HYUN A LEE ,  DOHYUNG KIM ,  DONGMIN JANG ,  JINWOO JANG

IPC: H05K1/11 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K1/117 ,  H05K3/18 ,  H05K3/28 ,  H05K1/09 ,  H05K2201/032 ,  H05K2201/0347 ,  H05K2201/09381 ,  H05K2201/099

Abstract: A module board includes a substrate having a wire pattern on a surface, a protection layer covering the surface of the substrate so as to expose one edge region of the substrate surface, and a plurality of tab terminals connected to the wire pattern and arranged on one edge region. Each tab terminal has a width larger than a width of the wire pattern. Each tab terminal has a pattern layer. A protection layer is on the pattern layer at a region where each tab terminal is connected to the wire pattern, and a plating layer is on a remainder of the pattern layer.

公开(公告)号：US11778723B2

公开(公告)日：2023-10-03

申请号：US17645455

申请日：2021-12-22

Applicant: Self Electronics Co., Ltd. ,  Wanjiong Lin ,  Self Electronics USA Corporation

Inventor： Zai Le ,  Sheng Zhang ,  Lihong Tong

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K1/18 ,  H05K2201/032

Abstract: A circuit board has a main board with a base material of insulating material, at least one metal base copper clad laminate, and each metal base copper clad laminate is provided with at least one component and a pin connected with the main board. The circuit board and the driving power supply with the circuit board have simple structure and low manufacturing cost, and are convenient for automatic manufacturing. The power device can be directly mounted on the metal substrate through the automation equipment, so that the metal substrate can realize the function of the heat sink, thereby improving the production efficiency and reducing the process quality hidden danger; at the same time, the grounding problem of the metal substrate is solved, and the EMC problem is avoided.

公开(公告)号：US11733731B2

公开(公告)日：2023-08-22

申请号：US16983225

申请日：2020-08-03

Applicant: Cambrios Film Solutions Corporation

Inventor： Yi-Chen Tsai ,  Wei-Chia Fang ,  Chun-Hung Chu ,  Chung-Chin Hsiao

IPC: G06F1/16 ,  H05K1/02

CPC classification number: G06F1/1616 ,  H05K1/0277 ,  H05K2201/032

Abstract: A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.

公开(公告)号：US20180324943A1

公开(公告)日：2018-11-08

申请号：US15773797

申请日：2016-10-12

Applicant: FUJIKURA LTD.

Inventor： Yasuo Fukuda ,  Takayuki Okamura

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K1/14

CPC classification number: H05K1/0281 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/147 ,  H05K2201/032 ,  H05K2201/0332

Abstract: A printed wiring board includes: an insulating base material; a first conductive layer disposed on a main surface of the insulating base material in a first region and a second region defined on a plane along the main surface; a second conductive layer disposed on a main surface of the first conductive layer in the first region; and an insulating layer disposed on the main surface of the first conductive layer in the second region. The ratio of a first evaluation value E1 to a second evaluation value E2 is 0.91 or more and 0.99 or less. The first evaluation value E1 is an evaluation value of strength of a first laminated part in the first region and the second evaluation value E2 is an evaluation value of strength of a second laminated part in the second region.

公开(公告)号：US20180270953A1

公开(公告)日：2018-09-20

申请号：US15464123

申请日：2017-03-20

Applicant: Intel Corporation

Inventor： Frank Truong ,  Dilan Seneviratne

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/06 ,  H05K3/46

CPC classification number: H05K3/06 ,  H05K1/09 ,  H05K1/111 ,  H05K1/116 ,  H05K3/061 ,  H05K3/068 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/032

Abstract: Embodiments herein relate to creating a high-aspect ratio opening in a package. Embodiments may include applying a first laminate layer on a side of a substrate, applying a seed layer to at least part of the laminate layer, building up one or more copper pads on the seed layer, etching the seed layer to expose a portion of the first laminate layer, applying a second laminate layer to fill in around the sides of one or more copper pads, and removing part of the buildup copper pads. Other embodiments may be described and/or claimed.

公开(公告)号：US09930773B2

公开(公告)日：2018-03-27

申请号：US15188453

申请日：2016-06-21

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/46 ,  G06F1/16

CPC classification number: H05K1/0272 ,  G06F1/1613 ,  H01R12/59 ,  H01R12/77 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/03 ,  H05K1/092 ,  H05K1/148 ,  H05K3/10 ,  H05K3/1275 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/055 ,  H05K2201/09009 ,  H05K2201/09736 ,  H05K2203/0776

Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

公开(公告)号：US20170273182A1

公开(公告)日：2017-09-21

申请号：US15503637

申请日：2015-09-01

Applicant: LG CHEM, LTD.

Inventor： Chee-Sung PARK ,  Cheol-Hee PARK ,  Ha Na LEE ,  Ha Nah JEONG ,  Jae Hyun KIM ,  Hsin Hee JUN ,  Eun Kyu SEONG ,  Su Jeong LEE

IPC: H05K1/09 ,  H05K3/10 ,  C23C18/20 ,  C08K3/22 ,  C08J7/12 ,  C23C18/16 ,  H05K1/03 ,  H05K3/18

CPC classification number: H05K1/09 ,  C08J7/123 ,  C08J2369/00 ,  C08K3/22 ,  C08K2003/2248 ,  C08K2003/2293 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/2013 ,  C23C18/204 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00 ,  H05K1/0353 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/032

Abstract: The present invention relates to a composition for forming a conductive pattern which allows micro conductive patterns to be formed on various polymeric resin products or resin layers by a very simplified process, a method for forming a conductive pattern using the composition, and a resin structure having the conductive pattern. The composition for forming a conductive pattern comprises: a polymeric resin; and a nonconductive metallic compound including a first metal, a second metal and a third metal, wherein the nonconductive metallic compound has a three-dimensional structure including a plurality of first layers (edge-shared octahedral layers) having a structure in which octahedrons comprising two metals from among the first metal, the second metal and the third metal which share the edges thereof with one another are two-dimensionally connected to one other, and a second layer which includes a metal of a different type from the first layer and is arranged between adjacent first layers, and wherein a metallic core including the first metal, the second metal or the third metal or an ion thereof is formed from the nonconductive metallic compound by electromagnetic radiation.

公开(公告)号：US20170130354A1

公开(公告)日：2017-05-11

申请号：US15127433

申请日：2015-03-12

Applicant: Atotech Deutschland GmbH

Inventor： Tadahiro NISHIGAWA ,  Jun HIGUCHI ,  Hitoshi ISHIKAWA

IPC: C25D5/34 ,  H05K1/02 ,  H05K3/42 ,  C25D3/38 ,  H05K3/46

CPC classification number: C25D5/34 ,  C25D3/38 ,  C25D5/56 ,  H05K1/0296 ,  H05K3/424 ,  H05K3/427 ,  H05K3/467 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.