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公开(公告)号：US06249034B1
公开(公告)日：2001-06-19
申请号：US09280434
申请日：1999-03-29
Applicant: Zong-Fu Li
Inventor： Zong-Fu Li
IPC: H01L310232
CPC classification number: H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L31/0216 , H01L31/02327
Abstract: By forming a microlens of negative photoresist, economical microlens fabrication processes may be used which, in some embodiments, may achieve microlenses having good optical clarity and high thermal stability. In one embodiment, a positive photoresist may be used as a pattern mask to transfer a pattern to the negative photoresist. The microlenses may be formed by dry etching the positive photoresist which acts as a mask to transfer a pattern to the underlying negative photoresist. At the same time a scratch protection layer may be formed over regions not overlying optical sensors.
Abstract translation: 通过形成负光致抗蚀剂的微透镜，可以使用经济的微透镜制造工艺，其在一些实施例中可以实现具有良好光学透明度和高热稳定性的微透镜。 在一个实施例中，正光致抗蚀剂可以用作图案掩模以将图案转印到负光致抗蚀剂。 微透镜可以通过干法蚀刻作为掩模的正性光致抗蚀剂来形成，以将图案转移到下面的负光致抗蚀剂。 同时可以在不覆盖光学传感器的区域上形成刮擦保护层。
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公开(公告)号：US06169283A
公开(公告)日：2001-01-02
申请号：US09052899
申请日：1998-03-31
Applicant: Edward J. Bawolek , Kabul Sengupta , Zong-Fu Li
Inventor： Edward J. Bawolek , Kabul Sengupta , Zong-Fu Li
IPC: H01L3104
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/1462 , H01L27/14685 , H01L2924/0002 , H01L2924/00
Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.
Abstract translation: 一种图像感测装置，包括成像传感器，具有相对的侧部的封装以及耦合到相对的侧部并且覆盖成像传感器的顶侧部分的红外光选择元件，所述选择元件包括塑料元件和染料。
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公开(公告)号：US06169280A
公开(公告)日：2001-01-02
申请号：US09473110
申请日：1999-12-28
Applicant: Edward J. Bawolek , Kabul Sengupta , Zong-Fu Li , Curtis Corum
Inventor： Edward J. Bawolek , Kabul Sengupta , Zong-Fu Li , Curtis Corum
IPC: H01J502
CPC classification number: H01L31/0203
Abstract: An image sensing device including a package having opposing side portions, an imaging sensor having a top side portion, and a light selective element coupled to the opposing side portions and overlying the top side portion of the imaging sensor.
Abstract translation: 一种图像感测装置，包括具有相对侧部的封装，具有顶侧部分的成像传感器和耦合到相对侧部并且覆盖成像传感器的顶侧部分的光选择元件。
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公开(公告)号：US20080116589A1
公开(公告)日：2008-05-22
申请号：US11601266
申请日：2006-11-17
Applicant: Zong-Fu Li , David England , Bobby Nikjou , Joseph T. Dibene , Hong Xie , Jason Zhang
Inventor： Zong-Fu Li , David England , Bobby Nikjou , Joseph T. Dibene , Hong Xie , Jason Zhang
CPC classification number: H01L23/3128 , H01L21/563 , H01L23/3677 , H01L25/0657 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/06572 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H05K1/0262 , H05K1/182 , H05K2201/09072 , H05K2201/10734 , H01L2924/00
Abstract: An integrated voltage regulator may be provided on the bottom of a ball grid array processor package. This may be done despite the fact that conventionally integrated voltage regulator chips are too thick to fit in the area normally available between the motherboard and the ball grid array package because that area is defined by solder balls of a necessarily limited height which is conventionally believed to be too small to accommodate the integrated voltage regulator.
Abstract translation: 集成电压调节器可以设置在球栅阵列处理器封装的底部。 尽管传统集成的电压调节器芯片太厚以至于不能装配在主板和球栅阵列封装之间通常可用的区域中，但是由于通常被认为是有限的高度的焊球限定了该区域 太小，不能容纳集成稳压器。
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公开(公告)号：US06573503B1
公开(公告)日：2003-06-03
申请号：US09660806
申请日：2000-09-13
Applicant: Edward J. Bawolek , Kabul Sengupta , Zong-Fu Li
Inventor： Edward J. Bawolek , Kabul Sengupta , Zong-Fu Li
IPC: H01L3700
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/1462 , H01L27/14685 , H01L2924/0002 , H01L2924/00
Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.
Abstract translation: 一种图像感测装置，包括成像传感器，具有相对的侧部的封装以及耦合到相对的侧部并且覆盖成像传感器的顶侧部分的红外光选择元件，所述选择元件包括塑料元件和染料。
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Patent Agency Ranking
公开(公告)号：US06433844B1
公开(公告)日：2002-08-13
申请号：US09902012
申请日：2001-07-09
Applicant: Zong-Fu Li
Inventor： Zong-Fu Li
IPC: G02F11335
Abstract: The making and use of color microlenses in color image sensors and color display devices is described and claimed. The color microlenses combine the function of a colorless microlens and a color filter into a single structure simplifying the fabrication of, and increasing the reliability of display devices and image sensors using the described color microlenses.
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公开(公告)号：US6072232A
公开(公告)日：2000-06-06
申请号：US219186
申请日：1998-12-21
Applicant: Zong-Fu Li , Kabul Sengupta , Deborah L. Thompson
Inventor： Zong-Fu Li , Kabul Sengupta , Deborah L. Thompson
IPC: G02B5/20 , H01L27/14 , H01L27/146 , H01L31/0203 , H05K3/34 , H01L23/02 , H01L23/22
CPC classification number: H01L31/0203 , H01L27/14601 , H01L27/14618 , H01L27/14683 , H01L2224/48247 , H01L2924/10253
Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
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公开(公告)号：US06646808B2
公开(公告)日：2003-11-11
申请号：US10284929
申请日：2002-10-31
Applicant: Zong-Fu Li
Inventor： Zong-Fu Li
IPC: G02B300
CPC classification number: H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L31/0216 , H01L31/02327
Abstract: By forming a microlens of negative photoresist, economical microlens fabrication processes may be used which, in some embodiments, may achieve microlenses having good optical clarity and high thermal stability. In one embodiment, a positive photoresist may be used as a pattern mask to transfer a pattern to the negative photoresist. The microlenses may be formed by dry etching the positive photoresist which acts as a mask to transfer a pattern to the underlying negative photoresist. At the same time a scratch protection layer may be formed over regions not overlying optical sensors.
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公开(公告)号：US06410359B1
公开(公告)日：2002-06-25
申请号：US09817639
申请日：2001-03-26
Applicant: Kevin M. Connolly , Jung S. Kang , Berni W. Landau , James E. Breisch , Akira Kakizawa , Joseph W. Parks, Jr. , Mark A. Beiley , Zong-Fu Li , Cory E. Weber , Shaofeng Yu
Inventor： Kevin M. Connolly , Jung S. Kang , Berni W. Landau , James E. Breisch , Akira Kakizawa , Joseph W. Parks, Jr. , Mark A. Beiley , Zong-Fu Li , Cory E. Weber , Shaofeng Yu
IPC: H01L2100
Abstract: Leakage current may be reduced in trench isolated semiconductor devices by providing a buffer between the trench isolation and an active area. For example, with a trench isolated photodiode, a buffer of opposite conductivity type may be provided between the trench and the diffusion that forms the p-n junction of the photodiode.
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公开(公告)号：US06215165B1
公开(公告)日：2001-04-10
申请号：US09310423
申请日：1999-05-12
Applicant: Kevin M. Connolly , Jung S. Kang , Berni W. Landau , James E. Breisch , Akira Kakizawa , Joseph W. Parks, Jr. , Mark A. Beiley , Zong-Fu Li , Cory E. Weber , Shaofeng Yu
Inventor： Kevin M. Connolly , Jung S. Kang , Berni W. Landau , James E. Breisch , Akira Kakizawa , Joseph W. Parks, Jr. , Mark A. Beiley , Zong-Fu Li , Cory E. Weber , Shaofeng Yu
IPC: H01L310232
CPC classification number: H01L31/103 , H01L27/1463
Abstract: Leakage current may be reduced in trench isolated semiconductor devices by providing a buffer between the trench isolation and an active area. For example, with a trench isolated photodiode, a buffer of opposite conductivity type may be provided between the trench and the diffusion that forms the p-n junction of the photodiode.
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