公开(公告)号：US20240357746A1

公开(公告)日：2024-10-24

申请号：US18326031

申请日：2023-05-31

Applicant: INNODISK CORPORATION

Inventor： CHIH-CHIEH KAO

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.

公开(公告)号：US12013584B2

公开(公告)日：2024-06-18

申请号：US17540692

申请日：2021-12-02

Applicant: TE Connectivity Solutions GmbH

Inventor： Benjamin Michael Grab ,  Henry Burton Piper, III ,  Soren Grinderslev

IPC: H04B10/00 ,  G02B6/42 ,  H05K1/18

CPC classification number: G02B6/428 ,  G02B6/4292 ,  H05K1/18 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/10356 ,  H05K2201/10401

Abstract: A contact comprising: (a) a contact housing, said contact housing being narrower than a cavity of a connector such that said contact housing is laterally movable within said cavity; (b) an optical interface for receiving a ferrule of a mating connector contact; (c) optoelectrical circuitry optically connected to said optical interface, wherein said optical interface and said optoelectrical circuitry are held rigidly in relation to each other within said contact housing; and (d) an electrical interface electrically connected to said optoelectrical circuitry and configured for electrical connection to a circuit board, wherein said electrical interface comprising at least a flexible cable to provide compliance between said optoelectrical circuitry and said circuit board.

公开(公告)号：US20240023244A1

公开(公告)日：2024-01-18

申请号：US18128477

申请日：2023-03-30

Applicant: Inventus Power, Inc.

Inventor： Elijah Brett Goldin ,  Ilyas Ayub ,  William Mark Batts ,  Anvin Joe Manadan ,  Timothy James Vallaro ,  Bryan Rossman ,  Daniel Paul Rose ,  Kevin James Zwart ,  Marcelo Nicosia ,  Horace C. Rodriguez

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/18 ,  H01M50/209 ,  H01M50/502

CPC classification number: H05K1/118 ,  H05K1/117 ,  H05K3/303 ,  H05K1/181 ,  H01M50/209 ,  H01M50/502 ,  H01M2220/30 ,  H05K2201/10037 ,  H05K2203/107 ,  H05K2201/09072

Abstract: A molded housing of a conformal wearable battery (CWB) encloses an electronic component and include an electrically conductive contact component embedded within an exterior wall to conduct electricity between an interior and an exterior of the casing. A flexible printed circuit board assembly (PCBA) for a conformal wearable battery (CWB) is enclosed in a cavity within the molded housing and includes attachment sections for a plurality of battery cells that are arranged in a grid-like pattern on a same side of the flexible PCBA. A visco-elastic shock-absorbing member installed between the upper and lower portion of the flexible PCBA when configured in a folded configuration. Each battery cell is joined to the flexible PCBA via a welding process. Each battery cell has a visco-elastic shock-absorbing member attached individually to each battery cell of the plurality of battery cells. When folded to fit within the cavity of the molded housing, the flexible PCBA forms a three-dimensional grid of physical components comprising at least the battery cell modules.

公开(公告)号：US20230317705A1

公开(公告)日：2023-10-05

申请号：US17707366

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Carlton Hanna ,  Bernd Waidhas ,  Georg Seidemann ,  Stephan Stoeckl ,  Pouya Talebbeydokhti ,  Stefan Reif ,  Eduardo De Mesa ,  Abdallah Bacha ,  Mohan Prashanth Javare Gowda ,  Lizabeth Keser

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H05K1/18

CPC classification number: H01L25/18 ,  H01L23/5384 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H05K1/181 ,  H01L2225/06572 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1094 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.

公开(公告)号：US11743566B2

公开(公告)日：2023-08-29

申请号：US18074883

申请日：2022-12-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Sang Song

IPC: H04N23/54 ,  H05K1/14 ,  H01F7/08 ,  H01F7/126 ,  H04N23/55 ,  H04N23/57 ,  H04N23/68 ,  H05K1/18 ,  H04N23/51 ,  G02B26/00

CPC classification number: H04N23/54 ,  H01F7/081 ,  H01F7/126 ,  H04N23/55 ,  H04N23/57 ,  H04N23/687 ,  H05K1/147 ,  H05K1/181 ,  G02B26/004 ,  H04N23/51 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10151

Abstract: A sensor driving device includes a first substrate; a second substrate disposed on the first substrate; and an image sensor. The second substrate includes a body having first and second lateral surfaces; a first protrusion part protruding from the first lateral surface; and a second protrusion part protruding from the second lateral surface. The first protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The second protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The first extension parts are disposed parallel to an optical axis of the image sensor. The second extension part of the first protrusion part is closer to the second extension part of the second protrusion part than to the first extension part of the second protrusion part.

公开(公告)号：US20230232536A1

公开(公告)日：2023-07-20

申请号：US18188997

申请日：2023-03-23

Applicant: KYOCERA Corporation

Inventor： Yukio MORITA ,  Noboru KITAZUMI

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/183 ,  H05K1/021 ,  H05K1/184 ,  H05K1/188 ,  H05K2201/09036 ,  H05K2201/09072

Abstract: An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

公开(公告)号：US11696409B2

公开(公告)日：2023-07-04

申请号：US16325659

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Tin Poay Chuah ,  Min Suet Lim ,  Hoay Tien Teoh ,  Mooi Ling Chang ,  Chin Lee Kuan

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/184 ,  H05K1/111 ,  H05K1/113 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K1/183 ,  H05K2201/0305 ,  H05K2201/09072 ,  H05K2201/10454

Abstract: A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via.

公开(公告)号：US20190148856A1

公开(公告)日：2019-05-16

申请号：US15812756

申请日：2017-11-14

Applicant: Amazon Technologies, Inc.

Inventor： William Mische

IPC: H01R12/71 ,  H01R12/73 ,  H01R13/52 ,  H01R43/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01R12/716 ,  H01R12/721 ,  H01R12/722 ,  H01R12/73 ,  H01R13/52 ,  H01R43/002 ,  H05K1/036 ,  H05K1/115 ,  H05K1/142 ,  H05K1/144 ,  H05K1/148 ,  H05K1/184 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: Printed circuit boards (PCBs) may include embedded lateral connectors. The embedded lateral connectors may be configured to enable components to quickly couple to or plug into a PCB, thus saving time to form connections. The embedded lateral connectors may also reduce weight and/or size by avoiding need for bulky tradition collections with conventional components (e.g., solders, external pin connectors, etc.). The connectors may include male connectors, female connectors, and/or mounting connectors. The connectors may be configured to connect multiple PCBs together, such as using a stacked configuration, which may enable reducing a volume of space needed in a housing for the PCBs.

公开(公告)号：US20180242454A1

公开(公告)日：2018-08-23

申请号：US15900031

申请日：2018-02-20

Applicant: LG CHEM, LTD.

Inventor： Jin Oh Yang ,  Suk Jin Song ,  Young Su Son ,  Jae Young Jang

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/18 ,  H05K1/0204 ,  H05K1/111 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10901

Abstract: The present disclosure relates to a printed circuit board connected to a battery, and more particularly, to a printed circuit board having an improved structure connected to an electrode led out from a battery.

公开(公告)号：US09974177B2

公开(公告)日：2018-05-15

申请号：US14781603

申请日：2014-01-30

Applicant: OSRAM GmbH

Inventor： Thomas Preuschl ,  Peter Sachsenweger

IPC: H05K7/00 ,  H05K1/18 ,  F21V15/01 ,  F21V17/10 ,  F21V19/00 ,  F21V23/06 ,  H05K3/32 ,  F21K9/90 ,  F21K9/20 ,  F21V23/00 ,  F21V29/00 ,  F21V29/507 ,  F21Y105/00 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y115/15

CPC classification number: H05K1/18 ,  F21K9/20 ,  F21K9/90 ,  F21V15/01 ,  F21V17/10 ,  F21V17/101 ,  F21V19/0035 ,  F21V23/006 ,  F21V23/06 ,  F21V29/20 ,  F21V29/507 ,  F21V29/70 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  H05K1/182 ,  H05K3/32 ,  H05K2201/0311 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10962

Abstract: Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.