公开(公告)号：US09343870B2

公开(公告)日：2016-05-17

申请号：US14501751

申请日：2014-09-30

Applicant: Applied Optoelectronics, Inc.

Inventor： Jun Zheng ,  Klaus Alexander Anselm ,  Huanlin Zhang ,  Hung-Lun Chang

IPC: H01S5/00 ,  H01S5/024 ,  H01S5/026 ,  H01S5/042 ,  H01S5/20 ,  H01S5/10 ,  H01S5/12 ,  H01S5/40 ,  G02B6/12 ,  H04B10/50

CPC classification number: H01S5/02453 ,  G02B6/12 ,  G02B6/12014 ,  G02B2006/12164 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/02461 ,  H01S5/0261 ,  H01S5/0268 ,  H01S5/0287 ,  H01S5/0612 ,  H01S5/22 ,  H01S5/4087 ,  H01S2301/176 ,  H04B10/40 ,  H04J14/0282

Abstract: A semiconductor laser diode with integrated heating generally includes a lasing region and a heating region integrated into the same semiconductor structure or chip. The lasing region and the heating region include first and second portions, respectively, of the semiconductor layers forming the semiconductor structure and include first and second portions, respectively, of the active regions formed by the semiconductor layers. Separate laser and heater electrodes are electrically connected to the respective lasing and heating regions for driving the respective lasing and heating regions with drive currents. The heating region may thus be driven independently from the lasing region, and heat may be conducted through the semiconductor layers from the heating region to the lasing region allowing the temperature to be controlled more efficiently.

Abstract translation: 具有集成加热的半导体激光二极管通常包括激光区域和集成在同一半导体结构或芯片中的加热区域。 激光区域和加热区域分别包括形成半导体结构的半导体层的第一和第二部分，并且分别包括由半导体层形成的有源区的第一和第二部分。 单独的激光和加热器电极电连接到相应的激光和加热区域，以用驱动电流驱动相应的激光和加热区域。 因此，加热区域可以独立于激光区域被驱动，并且热可以通过半导体层从加热区域传导到激光区域，从而能够更有效地控制温度。

公开(公告)号：US20160041343A1

公开(公告)日：2016-02-11

申请号：US14883970

申请日：2015-10-15

Applicant: Applied Optoelectronics, Inc.

Inventor： I-Lung HO ,  Stefan J. MURRY ,  Che-Shou (Richard) YEH

IPC: G02B6/38

CPC classification number: G02B6/3825 ,  G02B6/38 ,  G02B6/3807 ,  G02B6/3869 ,  G02B6/3874 ,  G02B6/3877 ,  G02B6/3879 ,  G02B6/42 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4292 ,  G02B6/4293

Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

Abstract translation: 多通道光收发器包括多通道发射器光子组件（TOSA），多通道接收器光子组件（ROSA）和直接链接到多通道TOSA和多通道的双光纤类型直接链路适配器 带光纤的ROSA。 双纤维型直接连接适配器还被配置为接收可插入的光学连接器，诸如LC连接器，其安装在包括用于将光信号传送到收发器的光纤的光纤的光纤端部。 因此，双光纤类型直接链路适配器为光收发器提供光输入和输出，用于由ROSA接收并由TOSA传输的光信号。 多通道光收发器可以用在波分复用（WDM）光学系统中，例如在WDM无源光网络（PON）中的光线路终端（OLT）中。

公开(公告)号：US20160041202A1

公开(公告)日：2016-02-11

申请号：US14452715

申请日：2014-08-06

Applicant: Applied Optoelectronics, Inc.

Inventor： Luohan Peng ,  Darren Tucker ,  Justin Lii ,  David Hendricks

IPC: G01R1/44 ,  G01R1/067

CPC classification number: G01R1/44 ,  G01R1/06722 ,  G01R31/2635 ,  G01R31/2863 ,  G01R31/2877

Abstract: A test fixture generally includes a thermoelectric cooler (TEC) configured to regulate the temperature of a device under test (DUT). The test fixture may further include a device carrier configured to secure the DUT in a desired position relative to the TEC and a spring-operated pin configured to generate a desired contact pressure between the DUT and the TEC. The desired contact pressure may be selected to achieve a thermal coupling between the DUT and the TEC that maintains the temperature of the DUT at a desired operation level.

Abstract translation: 测试夹具通常包括被配置为调节被测器件（DUT）的温度的热电冷却器（TEC）。 测试夹具还可以包括被配置为将DUT固定在相对于TEC的期望位置的设备载体，以及被配置为在DUT和TEC之间产生期望的接触压力的弹簧操作的引脚。 可以选择期望的接触压力以实现DUT和TEC之间的热耦合，其将DUT的温度保持在期望的操作水平。

公开(公告)号：US09236949B1

公开(公告)日：2016-01-12

申请号：US14312930

申请日：2014-06-24

Applicant: Applied Optoelectronics, Inc.

Inventor： Yi Wang ,  Huanlin Zhang

IPC: H04B10/00 ,  H04B10/58 ,  H04B10/50 ,  H04B10/40 ,  H04J14/02

CPC classification number: H04B10/58 ,  H04B10/40 ,  H04B10/504

Abstract: An optical transceiver generally includes an injection locked (IL) laser configured to generate a transmit (Tx) optical signal for transmission over an optical network and a laser driver circuit configured to modulate the IL laser based on a Tx data signal. The Tx data signal may be provided to the optical transceiver for transmission over the optical network. The Tx data signal may include a crossing point level associated with a transition between a first signal level and a second signal level. The optical transceiver may also include a crossing point control circuit configured to apply distortion to the Tx data signal, the distortion to increase the crossing point level.

Abstract translation: 光收发器通常包括被配置为产生用于通过光网络传输的发射（Tx）光信号的注入锁定（IL）激光器和被配置为基于Tx数据信号来调制IL激光器的激光器驱动器电路。 Tx数据信号可以被提供给光收发器以在光网络上传输。 Tx数据信号可以包括与第一信号电平和第二信号电平之间的转变相关联的交叉点电平。 光收发器还可以包括交叉点控制电路，其被配置为向Tx数据信号施加失真，该失真增加了交叉点电平。

公开(公告)号：US20150243558A1

公开(公告)日：2015-08-27

申请号：US14190765

申请日：2014-02-26

Applicant: Applied Optoelectronics, Inc.

Inventor： Klaus Alexander Anselm ,  Rajesh Bikky ,  Stephen Hu ,  Greg Pickrell ,  Nahid Sultana ,  Jae Yoon Um ,  Chia Chen David Wong

IPC: H01L21/78 ,  H01L21/308

CPC classification number: H01S5/00 ,  H01S5/0202 ,  H01S5/0203

Abstract: An improved scribe etch process for semiconductor laser chip manufacturing is provided. A method to etch a scribe line on a semiconductor wafer generally includes: applying a mask layer to a surface of the wafer; photolithographically opening a window in the mask layer along the scribe line; etching a trench in the wafer using a chemical etchant that operates on the wafer through the window opening, wherein the chemical etchant selectively etches through crystal planes of the wafer to generate a V-groove profile associated with the trench; and cleaving the wafer along the etched trench associated with the scribe line through application of a force to one or more regions of the wafer.

Abstract translation: 提供了一种用于半导体激光器芯片制造的改进的刻划蚀刻工艺。 蚀刻半导体晶片上的划线的方法通常包括：将掩模层施加到晶片的表面; 沿着划线光刻地在掩模层中打开窗口; 使用通过窗口在晶片上操作的化学蚀刻剂来蚀刻晶片中的沟槽，其中化学蚀刻剂选择性蚀刻晶片的晶面以产生与沟槽相关联的V形槽轮廓; 以及通过向所述晶片的一个或多个区域施加力而沿着与所述划线相关联的所述蚀刻沟槽切割所述晶片。

公开(公告)号：US09083468B2

公开(公告)日：2015-07-14

申请号：US13975867

申请日：2013-08-26

Applicant: Applied Optoelectronics, Inc.

Inventor： Jun Zheng ,  Yi Wang ,  I-Lung Ho

IPC: H04B10/40 ,  H01S5/024 ,  H04B10/50

CPC classification number: H04B10/503 ,  H01S5/02216 ,  H01S5/02415 ,  H01S5/02453 ,  H01S5/02461 ,  H01S5/12 ,  H04B10/40 ,  H04J14/02

Abstract: A heated laser package generally includes a laser diode, a heating resistor and a transistor in a single laser package. The heating resistor and transistor form a heating circuit and may be located on a submount adjacent to the laser diode. The transistor is configured to control the drive current to the heating resistor and any additional heat generated by the transistor may contribute to the heating of the laser diode and thus increase the thermal efficiency of the system. The heated laser package may be used in a temperature controlled multi-channel transmitter optical subassembly (TOSA), which may be used in a multi-channel optical transceiver. The optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

Abstract translation: 加热的激光器封装通常包括激光二极管，加热电阻器和单个激光器封装中的晶体管。 加热电阻器和晶体管形成加热电路并且可以位于与激光二极管相邻的基座上。 晶体管被配置为控制到加热电阻器的驱动电流，并且由晶体管产生的任何额外的热量可能有助于激光二极管的加热，从而提高系统的热效率。 加热的激光器封装可以用在可以在多通道光收发器中使用的温度控制的多通道发射机光学子组件（TOSA）中。 光收发器可以用在波分复用（WDM）光学系统中，例如在WDM无源光网络（PON）中的光线路终端（OLT）中。

公开(公告)号：US20140241726A1

公开(公告)日：2014-08-28

申请号：US13774125

申请日：2013-02-22

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： I-Lung Ho ,  Chong Wang ,  Justin Lii

IPC: H01S3/04 ,  H04B10/40

CPC classification number: H01S3/04 ,  H01S5/02208 ,  H01S5/02415 ,  H01S5/0683 ,  H01S5/0687 ,  H01S5/12 ,  H01S5/4012 ,  H01S5/4087 ,  H04B10/2503 ,  H04B10/40 ,  H04B10/506 ,  H04B10/572

Abstract: A temperature controlled multi-channel transmitter optical subassembly (TOSA) may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers optically coupled to an optical multiplexer, such as an arrayed waveguide grating (AWG), to combine multiple optical signals at different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers and separately raising local temperatures of individual lasers in response to monitored wavelengths associated with the lasers. A temperature control device, such as a TEC cooler coupled to the laser array, may provide the global temperature and individual heaters, such as resistors adjacent respective lasers, may provide the local temperatures. The optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

Abstract translation: 温度控制多通道发射机光学组件（TOSA）可用于多通道光收发器。 温度控制的多通道TOSA通常包括光学耦合到诸如阵列波导光栅（AWG）的光学多路复用器的激光器阵列，以组合在不同信道波长处的多个光信号。 激光器可以通过针对激光器阵列建立全局温度并且响应于与激光器相关联的被监视的波长单独提高各个激光器的局部温度而将激光器热调谐到通道波长。 耦合到激光器阵列的诸如TEC冷却器的温度控制装置可以提供全局温度和单独的加热器，例如与相应激光器相邻的电阻器，可以提供局部温度。 光收发器可以用在波分复用（WDM）光学系统中，例如在WDM无源光网络（PON）中的光线路终端（OLT）中。

公开(公告)号：US20140161455A1

公开(公告)日：2014-06-12

申请号：US13708064

申请日：2012-12-07

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： I-Lung Ho ,  Luohan Peng ,  Justin Lii

IPC: H04J14/02

CPC classification number: H04B10/40 ,  H04J14/0254 ,  H04J14/0282

Abstract: A temperature controlled multi-channel transmitter optical subassembly (TOSA) may be used in a multi-channel optical transceiver. The multi-channel TOSA generally includes an array of lasers optically coupled to an arrayed waveguide grating (AWG) to combine multiple optical signals at different channel wavelengths. A temperature control system may be used to control the temperature of both the array of lasers and the AWG with the same temperature control device, e.g., a thermoelectric cooler (TEC). The multi-channel optical transceiver may also include a multi-channel receiver optical subassembly (ROSA). The optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

Abstract translation: 温度控制多通道发射机光学组件（TOSA）可用于多通道光收发器。 多通道TOSA通常包括光学耦合到阵列波导光栅（AWG）的激光器阵列，以组合在不同沟道波长处的多个光信号。 温度控制系统可以用相同温度控制装置（例如热电冷却器（TEC））来控制激光器阵列和AWG阵列的温度。 多通道光收发器还可以包括多通道接收器光学子组件（ROSA）。 光收发器可以用在波分复用（WDM）光学系统中，例如在WDM无源光网络（PON）中的光线路终端（OLT）中。

公开(公告)号：US20040013154A1

公开(公告)日：2004-01-22

申请号：US10196059

申请日：2002-07-16

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： Jun Zheng

IPC: H01S003/08

CPC classification number: H01S5/18383 ,  H01S5/02461 ,  H01S5/041 ,  H01S5/141 ,  H01S5/2022

Abstract: An optically-pumped (OP) multiple quantum well (MQW) active region is disposed in an optical cavity of an OP VCSEL, which generates laser light at a lasing wavelength. The OP VCSEL receives pump light at a first end of the optical cavity. A plurality of quantum well (QW) groups are equally spaced within the active region to correspond in position with antinodes of a standing wave of the lasing wavelength in the optical cavity. The QW groups include a first QW group that is closest to the first end of the optical cavity, and a last QW group that is farthest from the first end of the optical cavity. A plurality of equally thick intermediate absorbing layers are disposed between adjacent QW groups. A last absorbing layer is disposed adjacent to the side of the last QW group farthest away from the first end of the optical cavity. A first absorbing layer is disposed adjacent to the side of the first QW group closest to the first end of the optical cavity. The first absorbing layer has a thickness at least two times smaller than that of the intermediate absorbing layers, thereby leading to improved pump power distribution uniformity across QW groups of the active region.

Abstract translation: 光学泵浦（OP）多量子阱（MQW）有源区域设置在产生激光波长的激光的OP VCSEL的光腔中。 OP VCSEL在光腔的第一端处接收泵浦光。 多个量子阱（QW）组在有源区域内等间隔，以与光腔中的激光波长驻波的波腹位置对应。 QW组包括最接近光学腔的第一端的第一QW组以及距离光学腔的第一端最远的最后一个QW组。 在相邻的QW组之间设置多个相等厚的中间吸收层。 最后一个吸收层被布置成与离开光腔第一端最远的最后一个QW组相邻。 第一吸收层被布置为与最靠近光腔的第一端的第一QW组的一侧相邻。 第一吸收层具有比中间吸收层的厚度小至少两倍的厚度，从而导致在有源区的QW组上的泵功率分布均匀性得到改善。

公开(公告)号：US20030201066A1

公开(公告)日：2003-10-30

申请号：US10134891

申请日：2002-04-29

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： Brian Ishaug ,  Chung-Yung Wang ,  Hung-Lun Chang

IPC: B32B001/00

CPC classification number: H01L21/67132 ,  B26D1/035 ,  B26D1/095 ,  Y10S156/941 ,  Y10S438/976 ,  Y10T156/1057 ,  Y10T156/1082 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1967

Abstract: Demounting workpieces attached to an adhesive surface of an adhesive film with a workpiece demounting apparatus having a base and a plurality of substantially parallel blades mounted to the base. Each of the blades has a substantially linear blade edge, each blade edge lying within a blade-edge plane that is substantially perpendicular to the blades. The spacing between the blades is small enough to support said workpieces and large enough to permit the adhesive film to pass between the blades after being cut by said blade edges during a workpiece demounting operation. The plurality of blade edges thus provides a substantially planar blade-edge surface, in the blade-edge plane, for cutting the adhesive film and for supporting the workpieces while the adhesive film is pulled free from said workpieces.

Abstract translation: 用工件拆卸装置将附着到粘合剂膜的粘合剂表面上的工件拆卸，所述工件拆卸装置具有安装到基座的基部和多个基本上平行的叶片。 每个叶片具有基本上线性的叶片边缘，每个叶片边缘位于基本上垂直于叶片的叶片边缘平面内。 叶片之间的间隔足够小以支撑所述工件并且足够大以允许粘合膜在工件拆卸操作期间被所述叶片边缘切割之后在刀片之间通过。 因此，多个叶片边缘在叶片边缘平面中提供基本平坦的叶片边缘表面，用于切割粘合剂膜并且在粘合膜被拉离所述工件时支撑工件。