公开(公告)号：US12105323B2

公开(公告)日：2024-10-01

申请号：US18358033

申请日：2023-07-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chung-Ming Weng ,  Hua-Kuei Lin ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Cheng-Chieh Hsieh ,  Hung-Yi Kuo ,  Tsung-Yuan Yu ,  Che-Hsiang Hsu ,  Chewn-Pu Jou ,  Cheng-Tse Tang

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/4201 ,  G02B2006/12061

Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

公开(公告)号：US11988844B2

公开(公告)日：2024-05-21

申请号：US15931184

申请日：2020-05-13

Applicant: Metalenz, Inc.

Inventor： Gilbert N. Riley, Jr. ,  Robert Devlin ,  Adam Erlich ,  Pawel Latawiec ,  John Graff

IPC: G02B27/09 ,  G02B1/00 ,  G02B6/24 ,  G02B6/42 ,  G02B27/10 ,  G02B27/12 ,  H01L27/146 ,  H01S5/026 ,  H01S5/40 ,  H01S5/42 ,  H01L31/0232 ,  H01L33/58 ,  H01S5/00

CPC classification number: G02B27/0916 ,  G02B1/002 ,  G02B6/24 ,  G02B6/42 ,  G02B6/4201 ,  G02B6/4274 ,  G02B6/428 ,  G02B27/09 ,  G02B27/0922 ,  G02B27/0927 ,  G02B27/10 ,  G02B27/1006 ,  G02B27/106 ,  G02B27/12 ,  G02B27/123 ,  H01L27/14625 ,  H01S5/026 ,  H01S5/4012 ,  H01S5/423 ,  H01L31/02327 ,  H01L33/58 ,  H01S5/0085

Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.

公开(公告)号：US20230367062A1

公开(公告)日：2023-11-16

申请号：US18358033

申请日：2023-07-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chung-Ming Weng ,  Hua-Kuei Lin ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Cheng-Chieh Hsieh ,  Hung-Yi Kuo ,  Tsung-Yuan Yu ,  Che-Hsiang Hsu ,  Chewn-Pu Jou ,  Cheng-Tse Tang

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/4201 ,  G02B2006/12061

Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

公开(公告)号：US20230290698A1

公开(公告)日：2023-09-14

申请号：US17896299

申请日：2022-08-26

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kazuya OHIRA ,  Hideto FURUYAMA

IPC: H01L23/12 ,  H01L23/40 ,  H01L23/48 ,  H01L23/528 ,  G02B6/42

CPC classification number: H01L23/12 ,  H01L23/4006 ,  H01L23/481 ,  H01L23/528 ,  G02B6/4201

Abstract: A semiconductor device includes a holding member including a component placement part; a back plate; a substrate including a mounting surface facing the holding member, and a back surface facing the back plate; a plurality of mounting pads located at the mounting surface; a package component including a terminal placement surface facing the mounting surface; and a plurality of package terminals located at the terminal placement surface. The substrate is held between the holding member and the back plate. The package component is located in the component placement part, and held between the holding member and the substrate. The package terminals are in direct contact with the mounting pads.

公开(公告)号：US11754780B2

公开(公告)日：2023-09-12

申请号：US17319102

申请日：2021-05-13

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chung-Ming Weng ,  Hua-Kuei Lin ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Cheng-Chieh Hsieh ,  Hung-Yi Kuo ,  Tsung-Yuan Yu ,  Che-Hsiang Hsu ,  Chewn-Pu Jou ,  Cheng-Tse Tang

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/4201 ,  G02B2006/12061

Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

公开(公告)号：US20190204514A1

公开(公告)日：2019-07-04

申请号：US16298989

申请日：2019-03-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Tai-Hsuan TU ,  Yi-Min CHIN ,  Wei Lun WANG ,  Jia-Hao ZHANG

IPC: G02B6/42 ,  G02B6/255

CPC classification number: G02B6/4214 ,  G02B6/2552 ,  G02B6/305 ,  G02B6/4201 ,  G02B6/4204

Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (μm).

公开(公告)号：US10001598B2

公开(公告)日：2018-06-19

申请号：US15347131

申请日：2016-11-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Russell A. Budd ,  Effendi Leobandung ,  Ning Li ,  Jean-Olivier Plouchart ,  Devendra K. Sadana

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/42 ,  H01L31/0216 ,  H01L31/103 ,  H01L31/18 ,  G02B6/132

CPC classification number: G02B6/12004 ,  G02B6/12002 ,  G02B6/122 ,  G02B6/132 ,  G02B6/4201 ,  G02B6/428 ,  G02B2006/12121 ,  G02B2006/12123 ,  G02B2006/12176 ,  H01L31/02161 ,  H01L31/1035 ,  H01L31/1828 ,  H01L31/184

Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.

公开(公告)号：US09991149B2

公开(公告)日：2018-06-05

申请号：US14933694

申请日：2015-11-05

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert ,  John Spann ,  Stephen Krasulick

IPC: H01L21/683 ,  H01L21/027 ,  H01L23/00 ,  H01L21/762 ,  G02B6/42 ,  H01L21/20

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

公开(公告)号：US09960525B2

公开(公告)日：2018-05-01

申请号：US15785065

申请日：2017-10-16

Applicant: Molex, LLC

Inventor： Kent E. Regnier ,  Jerry A. Long

IPC: H01R13/60 ,  H01R13/533 ,  G02B6/42 ,  F28F3/02 ,  H05K7/20

CPC classification number: H01R13/533 ,  F28F3/02 ,  G02B6/4201 ,  H05K7/20509

Abstract: A receptacle connector defines a port. The port is provided with spring fingers that are configured to engage a mating module. The spring fingers are thermally coupled to a heat transfer plate that can be configured to provide part of a cage that defines the port. Fins can be mounted on or integrated into the heat transfer plate. In operation, thermal energy from an inserted module is transferred from the module to spring fingers and then to the heat transfer plate and then to a thermal dissipation system.

公开(公告)号：US20180114885A1

公开(公告)日：2018-04-26

申请号：US15784243

申请日：2017-10-16

Applicant: Rohm Co., Ltd.

Inventor： Koji Saito

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/56 ,  H01L33/20 ,  H01L33/58 ,  H01L33/62 ,  H01L33/38 ,  H01L33/50 ,  F21V8/00

CPC classification number: H01L33/54 ,  G02B6/0001 ,  G02B6/4201 ,  G02B6/4253 ,  G02B6/4259 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/20 ,  H01L33/385 ,  H01L33/486 ,  H01L33/501 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058

Abstract: A side surface type optical semiconductor device includes a substrate made of an insulating material and having a main surface and a back surface, which face opposite sides to each other in a thickness direction. The substrate includes a first concave portion recessed in the thickness direction and a second concave portion recessed further toward the back surface than the first concave portion, a semiconductor optical element is disposed across the first concave portion and the second concave portion, a hollow portion is formed between the semiconductor optical element and the second concave portion, and the hollow portion is used as a light guide path of the semiconductor optical element.