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    Optical encoder system including a structured code wheel
    91.
    发明授权
    Optical encoder system including a structured code wheel 有权
    光学编码器系统包括结构化码盘

    公开(公告)号：US09091568B2

    公开(公告)日：2015-07-28

    申请号：US14518197

    申请日：2014-10-20

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Jens Geiger ,  Daniel Reymann

    IPC: G01J1/00 ,  G01D5/347

    CPC classification number: G01D5/34707 ,  G01D5/34715 ,  G01D5/3473

    Abstract: An optical encoder system includes a module that has a light emitting element and a light detecting element, wherein the light detecting element is operable to detect light at a wavelength emitted by the light emitting element. The optical encoder system also includes a code wheel that has facets on its surface. Each facet has a surface that provides diffuse reflectance, with adjacent facets being inclined by different amounts. The code wheel can be disposed with respect to the module so that at least some light emitted by the light emitting element is reflected by the facets back toward the module, wherein an amount of reflected light detected by the light detecting element in the module depends at least in part on the rotational position of the code wheel.

    Abstract translation: 光学编码器系统包括具有发光元件和光检测元件的模块，其中光检测元件可操作以检测由发光元件发射的波长的光。 光学编码器系统还包括在其表面上具有刻面的编码轮。 每个小面具有提供漫反射率的表面，其中相邻小面倾斜不同的量。 代码轮可以相对于模块设置，使得由发光元件发射的至少一些光被小面反射回模块，其中由模块中的光检测元件检测到的反射光的量取决于 至少部分地在码轮的旋转位置。

    Optical Module, in particular Opto-Electronic Module, and Method of Manufacturing the Same
    92.
    发明申请
    Optical Module, in particular Opto-Electronic Module, and Method of Manufacturing the Same 审中-公开
    光模块，特别是光电模块及其制造方法

    公开(公告)号：US20150204511A1

    公开(公告)日：2015-07-23

    申请号：US14413887

    申请日：2013-07-09

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Markus Rossi

    IPC: F21V7/00 ,  F21V13/02 ,  G01J1/04 ,  G02B7/182 ,  G01J1/02

    CPC classification number: F21V7/0033 ,  F21V13/02 ,  G01J1/0271 ,  G01J1/0407 ,  G01J3/0205 ,  G01J3/0256 ,  G01J3/0262 ,  G01J3/0264 ,  G01J3/0291 ,  G01J3/1804 ,  G02B5/10 ,  G02B7/003 ,  G02B7/021 ,  G02B7/182 ,  G02B17/023 ,  G02B27/4244 ,  H01L27/14601 ,  H01L31/02325 ,  Y10T29/49826

    Abstract: The optical module (1) comprises—a first member (O) having a first face (F1) which is substantially planar;—a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face;—a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4);—a mirror element (31′; 31′″) present on the second face (F2); and—an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31′. . . ) are present; c) providing a third wafer, wherein the third wafer is comprised in the first wafer or is comprised in the second wafer or is distinct from these, and wherein the third wafer comprises openings (4); e) forming a wafer stack comprising these wafers; wherein at least one of the first wafer and the second wafer comprises transparent portions (t) through which light can pass.

    Abstract translation: 光学模块（1）包括：具有基本上平面的第一面（F1）的第一构件（O）; - 具有面向第一面（F1）的第二面（F2）的第二构件（P） 基本上平面且基本上平行于第一面排列; - 包括在第一构件（O）中或包含在第二构件（P）中或与之不同的第三构件（S），其包括开口（4） ）; - 存在于所述第二面（F2）上的镜子元件（31'; 31“）; 和存在于所述第二面（F2）上的电连接到所述第二构件（P）的有源光学部件（26）。 其中所述第一和第二构件中的至少一个包括光可以通过的一个或多个透明部分（t）。 制造光学模块（1）的方法包括以下步骤：a）提供第一晶片; b）提供其上存在镜子元件（31'）的第二晶片; c）提供第三晶片，其中所述第三晶片包括在所述第一晶片中或包含在所述第二晶片中或与所述第三晶片不同，并且其中所述第三晶片包括开口（4）; e）形成包括这些晶片的晶片堆叠; 其中所述第一晶片和所述第二晶片中的至少一个包括光可以通过的透明部分（t）。

    Testing of optical devices
    93.
    发明授权
    Testing of optical devices 有权
    光学器件测试

    公开(公告)号：US09013687B2

    公开(公告)日：2015-04-21

    申请号：US14220690

    申请日：2014-03-20

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Matthias Gloor

    IPC: G01M1/00 ,  G01M11/00 ,  G01R31/28 ,  G01D18/00 ,  G01N21/55 ,  G01S17/02 ,  G01S7/497

    CPC classification number: G01M11/00 ,  G01D18/00 ,  G01N21/55 ,  G01R31/282 ,  G01S7/497 ,  G01S17/026

    Abstract: The present disclosure describes techniques for testing optical devices in a manner that, in some implementations, simulates the environment in which the devices will be used when they are integrated into the end-product or system. For example, one aspect includes providing a transparent sheet that is positioned near the optical device in a manner that simulates at least some aspects of the environment when the device is incorporated into the end-product or system. The testing can be performed, for example, while the optical devices are in production or at some other time prior to their being integrated into an end-product or system.

    Abstract translation: 本公开描述了以下方式测试光学设备的技术：在一些实现中，模拟当设备将被集成到终端产品或系统中时将被使用的环境。 例如，一个方面包括提供一种位于光学装置附近的透明片材，以便在该装置被结合到最终产品或系统中时模拟环境的至少一些方面。 例如，可以在光学装置正在生产中或在将其集成到最终产品或系统之前的某个其他时间进行测试。

    Opto-electronic module
    94.
    发明授权
    Opto-electronic module 有权
    光电模块

    公开(公告)号：US08975108B2

    公开(公告)日：2015-03-10

    申请号：US14303968

    申请日：2014-06-13

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser

    IPC: H01L21/00 ,  H01L31/167 ,  H01L31/12 ,  G01S7/481 ,  H01L31/0232 ,  H01L31/173 ,  G01S17/02

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME
    96.
    发明申请
    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME 有权
    用于制造被动光学元件的方法，以及包括其的装置

    公开(公告)号：US20140347747A1

    公开(公告)日：2014-11-27

    申请号：US14288755

    申请日：2014-05-28

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

    IPC: B29D11/00 ,  G02B3/00 ,  G02B13/00 ,  G02B5/20

    CPC classification number: G02B3/0031 ,  B29D11/00307 ,  B29D11/00375 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2063/00 ,  B29L2011/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).

    Abstract translation: 一种装置包括至少一个包括至少一个透明部分（t）和至少一个阻挡部分（b）的光学元件（O）。 所述至少一个透明部分（t）由对于至少一个特定光谱范围的光基本上透明的一种或多种材料制成，称为透明材料，并且所述至少一个阻挡部分（b）由一个或多个 对于特定光谱范围的光而言，材料基本上不透明，被称为不透明材料。 透明部分（t）包括至少一个无源光学部件（L）。 所述至少一个无源光学部件（L）包括透明元件（6），所述透明元件（6）具有大致垂直于垂直方向的两个相对的大致平坦表面，所述近似平面大致等于所述至少一个阻挡部分（b）的厚度， 至少一个光学结构（5），连接到透明元件（6）。

    Opto-electronic module
    97.
    发明授权
    Opto-electronic module 有权
    光电模块

    公开(公告)号：US08791489B2

    公开(公告)日：2014-07-29

    申请号：US13827264

    申请日：2013-03-14

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

    IPC: H01L33/00 ,  H01L31/12

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    Micro-Optical System and Method of Manufacture Thereof
    99.
    发明申请
    Micro-Optical System and Method of Manufacture Thereof 有权
    微光学系统及其制造方法

    公开(公告)号：US20130088845A1

    公开(公告)日：2013-04-11

    申请号：US13644682

    申请日：2012-10-04

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： Hartmut Rudmann ,  Michel Barge

    IPC: G03B15/02 ,  F21V8/00

    CPC classification number: G03B15/02 ,  B29D11/00307 ,  B29D11/00365 ,  B29D11/00663 ,  B29D11/00692 ,  G02B6/0011 ,  G02B13/0085 ,  G02B19/0061

    Abstract: The optical system comprises a base plate having a first plate side and a second plate side, a light guide element located substantially on said first plate side and a lens element located on said second plate side. The base plate and the light guide element are integrally formed or are distinct parts, and the base plate is at least partially transparent The optical system forms a light path for light passing through said lens element, across said base plate and through said light guide element, and wherein said base plate comprises at least one mechanical guiding element. The method for manufacturing such an optical system comprises providing a wafer comprising a multitude of said base plates.

    Abstract translation: 光学系统包括具有第一板侧和第二板侧的基板，基本上位于所述第一板侧的导光元件和位于所述第二板侧的透镜元件。 基板和导光元件整体形成或不同的部分，并且基板至少部分透明。光学系统形成光通过所述透镜元件的光，穿过所述基板并通过所述导光元件 ，并且其中所述基板包括至少一个机械引导元件。 制造这种光学系统的方法包括提供包括多个所述基板的晶片。

    Spectrometer calibration
    100.
    发明授权
    Spectrometer calibration 有权

    公开(公告)号：US11112304B2

    公开(公告)日：2021-09-07

    申请号：US16610238

    申请日：2018-05-03

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Kotaro Ishizaki ,  Javier Miguel-Sánchez ,  Peter Roentgen

    IPC: G01J3/42 ,  G01J3/02 ,  G01N21/27

    Abstract: Calibrating a spectrometer module includes performing measurements using the spectrometer module to generate wavelength-versus-operating parameter calibration data for the spectrometer module, performing measurements using the spectrometer module to generate optical crosstalk and dark noise calibration data for the spectrometer module, and performing measurements using the spectrometer module to generate full system response calibration data, against a known reflectivity standard, for the spectrometer module. The method further includes storing in memory, coupled to the spectrometer module, a calibration record that incorporates the wavelength-versus-operating parameter calibration data, the optical crosstalk and dark noise calibration data, and the full system response calibration data, and applying the calibration record to measurements by the spectrometer module.

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