公开(公告)号：US20190123032A1

公开(公告)日：2019-04-25

申请号：US16219896

申请日：2018-12-13

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/00 ,  H01L33/62 ,  H01L33/42 ,  H01L27/12 ,  H01L25/00 ,  H01L33/06 ,  H01L33/44 ,  H01L33/54 ,  H01L23/31 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US20190096846A1

公开(公告)日：2019-03-28

申请号：US16117414

申请日：2018-08-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L33/62

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：US10183396B2

公开(公告)日：2019-01-22

申请号：US15364199

申请日：2016-11-29

Applicant: Apple Inc.

Inventor： Paul Argus Parks ,  Nile Alexander Light ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl

IPC: B25J7/00 ,  B25J18/00 ,  B25J9/00

Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.

公开(公告)号：US10043784B2

公开(公告)日：2018-08-07

申请号：US15426947

申请日：2017-02-07

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/07 ,  H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62 ,  H01L33/06 ,  H01L33/36

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US09922966B2

公开(公告)日：2018-03-20

申请号：US15417015

申请日：2017-01-26

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  H01L25/16 ,  H01L31/16 ,  H01L31/0216 ,  H01L25/075 ,  H01L23/538 ,  H01L33/62 ,  H01L33/44 ,  G06F1/16 ,  G04G9/10

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US20170271192A1

公开(公告)日：2017-09-21

申请号：US15616676

申请日：2017-06-07

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L21/683 ,  B32B38/18 ,  B81C99/00 ,  H01L21/266 ,  H01L21/308 ,  H01L21/762 ,  H01L23/00 ,  H01L29/06 ,  H02N13/00 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78 ,  H01L29/872

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US20170162553A1

公开(公告)日：2017-06-08

申请号：US15438587

申请日：2017-02-21

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kelly McGroddy

IPC: H01L25/16 ,  H01L27/32 ,  H01L51/52 ,  H01L25/075

CPC classification number: H01L25/167 ,  G02F1/133603 ,  G02F1/133617 ,  G02F2001/133614 ,  G09F9/00 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/322 ,  H01L27/3246 ,  H01L33/38 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L51/5281 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.

公开(公告)号：US09620695B2

公开(公告)日：2017-04-11

申请号：US15192936

申请日：2016-06-24

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Kevin K. C. Chang ,  Andreas Bibl

IPC: H01L29/06 ,  H01L33/62 ,  H01L25/075 ,  H01L33/60 ,  H01L33/06 ,  H01L33/32 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/04 ,  H01L33/06 ,  H01L33/08 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/83005 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US20170072559A1

公开(公告)日：2017-03-16

申请号：US15364199

申请日：2016-11-29

Applicant: Apple Inc.

Inventor： Paul Argus Parks ,  Nile Alexander Light ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl

IPC: B25J7/00 ,  B25J18/00 ,  B25J9/00

CPC classification number: B25J7/00 ,  B25J9/0015 ,  B25J18/007 ,  H01L2224/7565 ,  H01L2224/75822 ,  Y10T74/20354

Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.

Abstract translation: 公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。 在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。 远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。 在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。

公开(公告)号：US20170015006A1

公开(公告)日：2017-01-19

申请号：US15282225

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC: B25J15/00 ,  H02N13/00 ,  H01L23/00 ,  B81C99/00 ,  H01L21/67

CPC classification number: B25J15/0085 ,  B81C99/002 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/7598 ,  H02N13/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，传质工具包括铰接传送头组件，载体衬底保持器和致动器组件，以调节关节式传送头组件和载体衬底保持器之间的空间关系。 铰接传送头组件可以包括静电电压源连接和支撑静电转印头阵列的基片。