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公开(公告)号:US20240361650A1
公开(公告)日:2024-10-31
申请号:US18765292
申请日:2024-07-07
Applicant: Samsung Display Co., Ltd.
Inventor: Sujeong KIM , Hanho PARK , Sangwon YEO , Daegeun LEE , Joonsam KIM
IPC: G02F1/1345 , G06F3/044 , H01L23/00 , H05K1/11 , H10K59/129 , H10K59/131 , H10K59/40 , H10K77/10 , H10K102/00
CPC classification number: G02F1/13458 , H01L24/06 , H10K59/129 , H10K59/131 , H10K59/40 , H10K77/111 , G06F3/044 , H01L2224/0217 , H01L2224/0603 , H01L2224/0605 , H01L2224/06132 , H01L2924/12044 , H05K1/111 , H05K2201/09409 , H05K2201/10128 , H10K2102/311
Abstract: A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.
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公开(公告)号:US20240355557A1
公开(公告)日:2024-10-24
申请号:US18359010
申请日:2023-07-26
Applicant: WISTRON CORP.
Inventor: SHIH TING TING , Yuyin Liu , ZI-FENG HUANG , ZHI-YANG XIAN , YULUN CHIANG
CPC classification number: H01H13/023 , H01H13/14 , H01H13/83 , H05K1/18 , H01H2219/016 , H01H2219/037 , H01H2219/04 , H01H2219/046 , H01R12/79 , H05K2201/09072 , H05K2201/10053 , H05K2201/10128 , H05K2201/10189 , H05K2201/10537 , H05K2201/10545
Abstract: A key module includes a circuit assembly, a support assembly and a display assembly. The support assembly is movably disposed on the circuit assembly. The display assembly includes a digital display unit. The digital display unit is supported on the circuit assembly by the support assembly, and the digital display unit is electrically connected to the circuit assembly.
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公开(公告)号:US12111527B2
公开(公告)日:2024-10-08
申请号:US17477695
申请日:2021-09-17
Applicant: Samsung Display Co., Ltd.
Inventor: Hyeon Deuk Hwang , Yunjeong Cho , Kyunghoon Chae , Simhee Ryu , Je Yoon Yoo , Sung Soo Lee
IPC: G02F1/1333 , G02F1/13 , H01L33/00 , H01L33/54 , H05K1/18
CPC classification number: G02F1/133351 , G02F1/1303 , G02F1/133354 , H01L33/0095 , H01L33/54 , H05K1/189 , H05K2201/10128
Abstract: A manufacturing method of a display device includes providing a display module including a display panel, a first flexible circuit board disposed at a first side edge of the display panel, a window disposed on the display panel, and an optical film disposed between the display panel and the window on the stage; aligning the display module such that the first side edge is disposed under the bonding unit; moving the position detection sensor along the first side edge of the display module to sense a first coating path; moving the resin supply unit along the sensed first coating path to coat a first filling agent between the window and the display panel; and moving the light irradiation unit along the sensed first coating path to cure the coated first filling agent to form a first filling layer.
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公开(公告)号:US12089324B2
公开(公告)日:2024-09-10
申请号:US17823038
申请日:2022-08-29
Applicant: Beijing Xiaomi Mobile Software Co., Ltd.
CPC classification number: H05K1/028 , G04G17/045 , H05K1/0298 , H05K1/115 , H05K1/118 , H05K2201/10128
Abstract: The disclosure provides a display module and a wearable device. The display module includes a flexible display screen and a flexible printed circuit board. The flexible display screen includes a first side in a first direction and a second side in a second direction, the first side and the second side being each electrically connected to the flexible printed circuit board; and the flexible printed circuit board includes a first functional circuit and a second functional circuit, the first side being connected to the first functional circuit, and the second side being connected to the second functional circuit. The first direction is different from the second direction.
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公开(公告)号:US12075566B2
公开(公告)日:2024-08-27
申请号:US17851246
申请日:2022-06-28
Applicant: InnoLux Corporation
Inventor: Yu-Ting Liu , Yeong-E Chen , Chean Kee
CPC classification number: H05K1/113 , H05K1/028 , H05K1/11 , H05K1/18 , H05K2201/0338 , H05K2201/10128
Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.
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公开(公告)号:US20240284595A1
公开(公告)日:2024-08-22
申请号:US18651739
申请日:2024-05-01
Applicant: Japan Display Inc.
Inventor: Youhei IWAI , Hideaki ABE
IPC: H05K1/14 , G02F1/1345 , H05K1/02 , H10K59/131
CPC classification number: H05K1/14 , H05K1/028 , G02F1/13452 , H05K2201/10128 , H10K59/131
Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
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公开(公告)号:US20240284589A1
公开(公告)日:2024-08-22
申请号:US18649021
申请日:2024-04-29
Inventor: Ningyang ZHENG , Sihan QIU , Xuhui PENG , Chengxu MA , Pengbo LI
CPC classification number: H05K1/0215 , H05K1/189 , H05K3/363 , H05K2201/10128
Abstract: A display module and a display apparatus are described. The display module includes display panel, backplane, and printed circuit board electrically connected to display panel. The backplane includes body and tongue protruding from body. The printed circuit board is fixed to tongue and includes first grounding region and second grounding region. The first grounding region is located on a side of the printed circuit board adjacent to the tongue. The tongue includes a first surface and a second surface opposite to the first surface. The first surface faces a side of the printed circuit board, and the first grounding region is electrically connected to the first surface of the tongue. The second grounding region is electrically connected to the second surface of the tongue and/or the body of the backplane. The printed circuit board is better fixed. A grounding impedance of the printed circuit board is reduced and meets requirements.
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公开(公告)号:US12063812B2
公开(公告)日:2024-08-13
申请号:US17126928
申请日:2020-12-18
Applicant: LG Display Co., Ltd.
Inventor: Hak-Yeol Kwon
CPC classification number: H10K50/87 , B60K35/50 , B60K35/60 , H05K1/189 , B60K35/223 , H05K2201/10128 , H10K2102/311
Abstract: A display apparatus includes a display panel, a heat dissipation plate disposed on a rear surface of the display panel, and a guide holder disposed on a rear surface of the heat dissipation plate and configured such that a printed circuit board connected to the display panel is coupled to a rear surface of the heat dissipation plate. The guide holder is formed through double injection-molding such that at least a portion of the guide holder is formed of different materials.
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公开(公告)号:US20240260216A1
公开(公告)日:2024-08-01
申请号:US17909112
申请日:2021-11-08
Inventor: Xuan LUO , Xiaoxia HUANG , Ren XIONG , Bing ZHANG
CPC classification number: H05K5/03 , H05K1/189 , G06F3/041 , G06F2203/04102 , H05K2201/10128
Abstract: The present disclosure relates to a foldable display device and belongs to the field of display. The foldable display device includes a flexible display panel, a flexible cover plate and a flexible printed circuit. The flexible display panel includes a first foldable region and a first side edge. The first foldable region includes a first sub-region, and a part of the first side edge is a boundary of the first sub-region. The flexible cover plate is bonded to a first surface of the flexible display panel and includes a second foldable region. An orthographic projection of the second foldable region on the first surface is within the first foldable region, the second foldable region is bonded to the first foldable region, and the orthographic projection of the second foldable region on the first surface is not overlapped with the first sub-region. The flexible printed circuit is bonded to the first side edge, and an orthographic projection of the flexible printed circuit on the first surface is not overlapped with an orthographic projection of the first foldable region on the first surface. Thus, the problem that wrinkles are generated in the flexible cover plate during bending is addressed.
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公开(公告)号:US12041722B2
公开(公告)日:2024-07-16
申请号:US17935257
申请日:2022-09-26
Applicant: InnoLux Corporation
Inventor: Hsin-Li Chen
IPC: H05K1/18
CPC classification number: H05K1/189 , H05K2201/0338 , H05K2201/10128
Abstract: An electronic device is provided. The electronic device includes a flexible circuit board and a conductive adhesive material. The flexible circuit board includes a first conductive layer, an adhesive layer, and a cover layer. The first conductive layer has a top surface, a bottom surface parallel to the top surface and a first side connected between the top surface and bottom surface. The adhesive layer is disposed on the top surface of the first conductive layer. The cover layer is disposed on the adhesive layer. The conductive adhesive material is disposed on the first conductive layer. In addition, the conductive adhesive material is in contact with the first side.
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