Display module and wearable device

    公开(公告)号:US12089324B2

    公开(公告)日:2024-09-10

    申请号:US17823038

    申请日:2022-08-29

    Inventor: Jinze Li Ming Zhao

    Abstract: The disclosure provides a display module and a wearable device. The display module includes a flexible display screen and a flexible printed circuit board. The flexible display screen includes a first side in a first direction and a second side in a second direction, the first side and the second side being each electrically connected to the flexible printed circuit board; and the flexible printed circuit board includes a first functional circuit and a second functional circuit, the first side being connected to the first functional circuit, and the second side being connected to the second functional circuit. The first direction is different from the second direction.

    Bonding pad structure
    5.
    发明授权

    公开(公告)号:US12075566B2

    公开(公告)日:2024-08-27

    申请号:US17851246

    申请日:2022-06-28

    Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

    DISPLAY DEVICE and ELECTRONIC DEVICE
    6.
    发明公开

    公开(公告)号:US20240284595A1

    公开(公告)日:2024-08-22

    申请号:US18651739

    申请日:2024-05-01

    Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.

    DISPLAY MODULE AND DISPLAY APPARATUS
    7.
    发明公开

    公开(公告)号:US20240284589A1

    公开(公告)日:2024-08-22

    申请号:US18649021

    申请日:2024-04-29

    CPC classification number: H05K1/0215 H05K1/189 H05K3/363 H05K2201/10128

    Abstract: A display module and a display apparatus are described. The display module includes display panel, backplane, and printed circuit board electrically connected to display panel. The backplane includes body and tongue protruding from body. The printed circuit board is fixed to tongue and includes first grounding region and second grounding region. The first grounding region is located on a side of the printed circuit board adjacent to the tongue. The tongue includes a first surface and a second surface opposite to the first surface. The first surface faces a side of the printed circuit board, and the first grounding region is electrically connected to the first surface of the tongue. The second grounding region is electrically connected to the second surface of the tongue and/or the body of the backplane. The printed circuit board is better fixed. A grounding impedance of the printed circuit board is reduced and meets requirements.

    FOLDABLE DISPLAY DEVICE
    9.
    发明公开

    公开(公告)号:US20240260216A1

    公开(公告)日:2024-08-01

    申请号:US17909112

    申请日:2021-11-08

    Abstract: The present disclosure relates to a foldable display device and belongs to the field of display. The foldable display device includes a flexible display panel, a flexible cover plate and a flexible printed circuit. The flexible display panel includes a first foldable region and a first side edge. The first foldable region includes a first sub-region, and a part of the first side edge is a boundary of the first sub-region. The flexible cover plate is bonded to a first surface of the flexible display panel and includes a second foldable region. An orthographic projection of the second foldable region on the first surface is within the first foldable region, the second foldable region is bonded to the first foldable region, and the orthographic projection of the second foldable region on the first surface is not overlapped with the first sub-region. The flexible printed circuit is bonded to the first side edge, and an orthographic projection of the flexible printed circuit on the first surface is not overlapped with an orthographic projection of the first foldable region on the first surface. Thus, the problem that wrinkles are generated in the flexible cover plate during bending is addressed.

    Electronic device
    10.
    发明授权

    公开(公告)号:US12041722B2

    公开(公告)日:2024-07-16

    申请号:US17935257

    申请日:2022-09-26

    Inventor: Hsin-Li Chen

    CPC classification number: H05K1/189 H05K2201/0338 H05K2201/10128

    Abstract: An electronic device is provided. The electronic device includes a flexible circuit board and a conductive adhesive material. The flexible circuit board includes a first conductive layer, an adhesive layer, and a cover layer. The first conductive layer has a top surface, a bottom surface parallel to the top surface and a first side connected between the top surface and bottom surface. The adhesive layer is disposed on the top surface of the first conductive layer. The cover layer is disposed on the adhesive layer. The conductive adhesive material is disposed on the first conductive layer. In addition, the conductive adhesive material is in contact with the first side.

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