公开(公告)号：US10964871B2

公开(公告)日：2021-03-30

申请号：US16904102

申请日：2020-06-17

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

公开(公告)号：US10886446B2

公开(公告)日：2021-01-05

申请号：US16526702

申请日：2019-07-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L33/62

Abstract: The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.

公开(公告)号：US10710102B2

公开(公告)日：2020-07-14

申请号：US15699681

申请日：2017-09-08

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01M6/18 ,  B05B1/18 ,  C25D11/04 ,  C23C16/455 ,  B05B1/00 ,  C25D11/26 ,  C25D11/34

Abstract: A fluid permeable member includes a support body provided in a lower portion thereof with a support plate having a fluid permeable through-hole, and a fluid permeable anodic oxide film disposed on the support plate.

公开(公告)号：US20190355610A1

公开(公告)日：2019-11-21

申请号：US16414347

申请日：2019-05-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Dong Hyeok Seo

IPC: H01L21/683 ,  H01L21/677

Abstract: The present invention relates to a micro LED grip body for vacuum-sucking micro LEDs. More particularly, the present invention relates to a micro LED grip body provided with a mask below a porous member to increase vacuum pressure for vacuum-sucking micro LEDs such that the micro LEDs are transferred without deviation.

公开(公告)号：US10241094B2

公开(公告)日：2019-03-26

申请号：US15344672

申请日：2016-11-07

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N33/00 ,  H05B3/06 ,  H05B3/26 ,  H05B3/03 ,  G01N27/12

Abstract: A micro heater includes a substrate formed of an anodized film and a heater electrode formed on the substrate and provided with a heat generation wiring line. The heat generation wiring line is formed in a laminated state. Also disclosed are a micro sensor and a micro sensor manufacturing method.

公开(公告)号：US10170731B2

公开(公告)日：2019-01-01

申请号：US15491351

申请日：2017-04-19

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L51/00 ,  H01L51/50 ,  H01L51/56

Abstract: A mask for forming a pattern on a substrate is provided. The mask includes an anodic oxide film formed by anodizing metal, at least one transmission hole configured to vertically penetrate the anodic oxide film and formed in a corresponding relationship with the pattern, a plurality of pores formed in the anodic oxide film so as to have a smaller diameter than the transmission hole, and a magnetic material provided in each of the pores.

公开(公告)号：US10062812B2

公开(公告)日：2018-08-28

申请号：US14986092

申请日：2015-12-31

Applicant: Point Engineering Co., Ltd.

Inventor： Ki Myung Nam ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/56 ,  H01L25/075

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.

公开(公告)号：US10014446B2

公开(公告)日：2018-07-03

申请号：US15363261

申请日：2016-11-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A chip substrate includes conductive layers, an insulation layer configured to electrically isolate the conductive layers, and a cavity composed of a groove formed at a predetermined depth in a region including the insulation layer. One side of the cavity includes a first surface and a second surface continuously extending from the first surface, the first surface is formed to vertically extend from a lower portion of the cavity and the second surface is formed so as to have the same slope as the other side of the cavity, whereby the distance between one side of the lower portion of the cavity and the insulation layer is increased.

公开(公告)号：US10008638B2

公开(公告)日：2018-06-26

申请号：US14400196

申请日：2013-05-09

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Ki Myung Nam

IPC: H05K3/30 ,  H01L33/48 ,  H05K1/18 ,  H05K3/34 ,  H01L23/00 ,  H01L25/13 ,  H05K3/00 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L25/13 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12041 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/10106 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.Provided is a method of manufacturing an optical device for a back light unit, the method comprising: (a) preparing an original substrate having vertical insulating layers interposed therebetween; (b) partially cutting the original substrate to a predetermined depth from an upper surfaces thereof such that the cut portion is orthogonal at least to the vertical insulation layers, and exposing a region where a plating layer for soldering is to be formed; (c) performing plating; (d) mounting optical device chips on a plurality of chip substrate regions divided to include the vertical insulating layers; and (e) cutting each chip substrate region.

公开(公告)号：US20180129039A1

公开(公告)日：2018-05-10

申请号：US15800522

申请日：2017-11-01

Applicant: Point Engineering Co., Ltd.

Inventor： Seung Ho Park ,  Moon Hyun Kim ,  Tae Hwan Song

IPC: G02B27/00

CPC classification number: G02B27/0006 ,  G02B5/00 ,  G02B7/00 ,  H01L25/0753 ,  H01L33/62

Abstract: An optical device substrate includes a substrate body having a mounting space formed thereon, and a lamination layer formed on the substrate body. A groove for connecting the mounting space and the outside of the substrate body is patterned in the lamination layer.