公开(公告)号：US10170524B2

公开(公告)日：2019-01-01

申请号：US15190526

申请日：2016-06-23

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shingo Eguchi

IPC: H01L27/00 ,  H01L27/32 ,  G06F1/16 ,  G02F1/1333 ,  G06F3/044 ,  G06F3/0488 ,  H01L27/12 ,  G06F3/047 ,  H01L29/786 ,  H01L51/52

Abstract: A display device includes a display panel, a member, a first fixing portion, a second fixing portion, and a roll-up portion. The display device has a function that enables selection between a first state in which an image is displayed with the display panel not folded and a second state in which an image is displayed with the display panel folded. The display panel is fixed to the first fixing portion and the second fixing portion. One end of the member is fixed to the first fixing portion. The other end of the member is connected to the roll-up portion. The roll-up portion has a function that enables rolling up of the member from the other end of the member. The display panel is folded by rolling up the member. The display panel is unfolded by pulling out the rolled-up member from the roll-up portion.

公开(公告)号：US20180212006A1

公开(公告)日：2018-07-26

申请号：US15927436

申请日：2018-03-21

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Masahiro Katayama ,  Shingo Eguchi ,  Yoshiaki Oikawa ,  Ami Nakamura ,  Satoshi Seo ,  Kaoru Hatano

IPC: H01L27/32 ,  H05B33/12 ,  H05B33/04 ,  H05B33/02 ,  H01L51/52 ,  H01L27/12 ,  H01L51/00 ,  H01L29/786

CPC classification number: H01L27/3246 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/7869 ,  H01L51/003 ,  H01L51/52 ,  H01L51/524 ,  H01L51/5253 ,  H01L2251/5338 ,  H05B33/02 ,  H05B33/04 ,  H05B33/12

Abstract: Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are fowled over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element faulted over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.

公开(公告)号：US10003047B2

公开(公告)日：2018-06-19

申请号：US15484451

申请日：2017-04-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Shingo Eguchi

IPC: H01L29/04 ,  H01L51/52 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5256 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.

公开(公告)号：US09925749B2

公开(公告)日：2018-03-27

申请号：US14468818

申请日：2014-08-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu Ohno ,  Yoshiharu Hirakata ,  Shingo Eguchi ,  Yasuhiro Jinbo ,  Hisao Ikeda ,  Kohei Yokoyama ,  Hiroki Adachi ,  Satoru Idojiri

IPC: B32B37/00 ,  B32B37/12 ,  B32B38/18 ,  B32B17/10 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B32B38/00

CPC classification number: B32B37/0046 ,  B32B17/10431 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B32B37/0015 ,  B32B37/003 ,  B32B37/1284 ,  B32B38/0008 ,  B32B38/18 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2309/68 ,  B32B2457/14 ,  B32B2457/20 ,  H01L2224/01 ,  Y10T156/15 ,  Y10T156/1798

Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.

公开(公告)号：US09865837B2

公开(公告)日：2018-01-09

申请号：US15046753

申请日：2016-02-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Yasuhiro Jinbo ,  Shingo Eguchi

IPC: H01L33/00 ,  H01L51/52 ,  H01L51/00 ,  H01L27/32 ,  H01L33/56

CPC classification number: H01L51/5246 ,  H01L27/323 ,  H01L27/3244 ,  H01L33/56 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/5256 ,  H01L2251/5338 ,  H01L2251/5361 ,  Y02E10/549

Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.

公开(公告)号：US09865665B2

公开(公告)日：2018-01-09

申请号：US14700527

申请日：2015-04-30

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shingo Eguchi ,  Shunpei Yamazaki

IPC: G06F3/045 ,  H01L27/32 ,  G06F3/047 ,  H01L51/52 ,  G09G5/00 ,  G06F3/044

CPC classification number: H01L27/3253 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04102 ,  G06F2203/04103 ,  G09G5/003 ,  G09G2300/0426 ,  H01L27/323 ,  H01L27/3248 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A flexible input/output device and an input/output device having high resistance to repeated bending are provided. The input/output device includes a first flexible substrate, a first insulating layer over the first substrate, a first transistor over the first insulating layer, a light-emitting element over and electrically connected to the first transistor and including an EL layer between first and second electrodes, a first bonding layer over the light-emitting element, a sensing element and a second transistor over the first bonding layer and electrically connected to each other, a second insulating layer over the sensing element and the second transistor, and a second flexible substrate over the second insulating layer. In the input/output device, B/A is greater than or equal to 0.7 and less than or equal to 1.7, where A is a thickness between the EL layer and the first insulating layer and B is a thickness between the EL layer and the second insulating layer.

公开(公告)号：US09627648B2

公开(公告)日：2017-04-18

申请号：US14802642

申请日：2015-07-17

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Shingo Eguchi

IPC: H01L29/08 ,  H01L51/52 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5256 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.

公开(公告)号：US09570329B2

公开(公告)日：2017-02-14

申请号：US15204091

申请日：2016-07-07

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shingo Eguchi ,  Yohei Monma ,  Atsuhiro Tani ,  Misako Hirosue ,  Kenichi Hashimoto ,  Yasuharu Hosaka

IPC: H01L31/18 ,  H01L21/67 ,  H01L27/12 ,  H01L21/683 ,  B32B43/00 ,  H01L31/20

CPC classification number: H01L27/1266 ,  B32B43/006 ,  G02F1/1303 ,  G02F1/13306 ,  G06K19/0772 ,  H01L21/67132 ,  H01L21/6835 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/156 ,  H01L31/1892 ,  H01L31/206 ,  H01L33/005 ,  H01L51/003 ,  H01L51/0097 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68386 ,  H01L2221/68395 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10T29/41

Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.

Abstract translation: 为了在从用于制造半导体元件的基板剥离包含半导体元件的元件形成层而被除去形成有元件形成层和剥离层的基板和薄膜之间的间隙中时，为了消除放电， 加压辊。 该膜附着在加压辊之间的元件形成层上，加压辊的一侧的加压辊的弯曲表面沿加压辊的弯曲表面弯曲并收集。 在元件形成层和剥离层之间产生剥离，并且元件形成层被转印到膜上。 通过喷嘴将液体顺序地供给到通过剥离产生的元件形成层和剥离层之间的间隙，使得在元件形成层和剥离层的表面上产生的电荷被液体扩散。

公开(公告)号：US09455418B2

公开(公告)日：2016-09-27

申请号：US14468808

申请日：2014-08-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu Ohno ,  Kohei Yokoyama ,  Satoru Idojiri ,  Hisao Ikeda ,  Yasuhiro Jinbo ,  Hiroki Adachi ,  Yoshiharu Hirakata ,  Shingo Eguchi

IPC: B29C63/00 ,  H01L51/52 ,  B32B17/06 ,  H01L51/56 ,  B65G49/06

CPC classification number: B65G49/068 ,  B32B17/06 ,  B32B37/025 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/00 ,  B32B2457/14 ,  B32B2457/20 ,  B65G49/069 ,  B65G2249/04 ,  B65H3/0816 ,  B65H3/48 ,  B65H16/00 ,  B65H35/0006 ,  H01L21/673 ,  H01L21/67333 ,  H01L21/67715 ,  H01L21/68 ,  H01L27/3244 ,  H01L51/5237 ,  H01L51/56 ,  H01L2221/68318 ,  H01L2227/323 ,  Y10T29/53091 ,  Y10T29/5317 ,  Y10T156/1121 ,  Y10T156/1137 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1917 ,  Y10T156/1922 ,  Y10T156/1939 ,  Y10T156/1967

Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.

Abstract translation: 提供了一种用于提供具有干净表面的支撑件的装置。 或者，提供一种用于制造包括支撑体的堆叠的装置和其一个表面层被分离的被处理构件的剩余部分。 包括定位部分，狭缝形成部分和剥离部分。 定位部设置有包括支撑体和隔板的层叠膜的第一传送机构和用于固定层叠膜的台。 狭缝形成部设置有能够形成不通过隔板的狭缝的切割器。 剥离部设置有第二传送机构和剥离机构，其使隔板延伸，然后剥离隔膜。 此外，包括激活支撑表面的预处理部分。

公开(公告)号：US09240525B2

公开(公告)日：2016-01-19

申请号：US14162042

申请日：2014-01-23

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Kaoru Hatano ,  Masahiro Katayama ,  Shingo Eguchi ,  Yoshiaki Oikawa ,  Ami Nakamura

IPC: H01L27/14 ,  H01L29/04 ,  H01L29/15 ,  H01L31/036 ,  H01L33/48 ,  H01L51/52 ,  H05B33/04 ,  H05B33/10 ,  H05B33/22 ,  H01L27/146 ,  H01L27/32 ,  H01L33/08

CPC classification number: H01L51/5246 ,  H01L27/14609 ,  H01L27/1463 ,  H01L27/14689 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3276 ,  H01L33/08 ,  H01L33/48 ,  H01L51/5243 ,  H01L51/5253 ,  H01L51/5278 ,  H01L2227/323 ,  H01L2251/5338 ,  H01L2251/5361 ,  H05B33/04 ,  H05B33/10 ,  H05B33/22

Abstract: It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.

Abstract translation: 本发明的目的是以简单的方式提供具有高可靠性的柔性发光装置。 此外，其目的是提供一种每个安装有发光装置的电子装置或照明装置。 通过使用具有以下结构的发光装置，可以获得高可靠性的发光装置：包括发光元件的元件部分介于具有柔性的基板和相对于 可见光和金属基板; 并且设置在元件部分之上和之下的绝缘层在元件部分的外周彼此接触以密封元件部分。 此外，通过使用具有这种结构的发光装置安装电子装置或照明装置，可以获得具有高可靠性的电子装置或照明装置。