公开(公告)号：US20230220176A1

公开(公告)日：2023-07-13

申请号：US18004420

申请日：2021-06-25

Applicant: Yuka Mizoguchi ,  Taichi Nemoto ,  Hideki Sugiura ,  Shinya Nakayama ,  Hiroshi Yamashita

Inventor： Yuka Mizoguchi ,  Taichi Nemoto ,  Hideki Sugiura ,  Shinya Nakayama ,  Hiroshi Yamashita

IPC: C08J9/12 ,  C08J9/00 ,  C08J5/18 ,  C08K3/36 ,  C08K9/00 ,  C08G63/08

CPC classification number: C08J9/122 ,  C08J9/0066 ,  C08J9/009 ,  C08J5/18 ,  C08K3/36 ,  C08K9/00 ,  C08G63/08 ,  C08J2203/06 ,  C08J2367/04 ,  C08K2201/005 ,  C08K2201/011 ,  C08G2101/00

Abstract: A foamed body includes a polylactic acid resin. An amount of the polylactic acid resin is 99.5% by mass or greater relative to a total amount of organic matter in the foamed body. A gel fraction of the foamed body is 0.1% or less. An expansion ratio of the foamed body is 5 times or greater.

公开(公告)号：US20230174837A1

公开(公告)日：2023-06-08

申请号：US17913620

申请日：2021-03-26

Applicant: TOYOBO CO., LTD.

Inventor： Motonobu KAMIYA ,  Takahiro SHIMIZU

IPC: C09K5/14 ,  C08K7/00 ,  C08G63/183

CPC classification number: C09K5/14 ,  C08K7/00 ,  C08G63/183 ,  C08K2201/001 ,  C08K2201/005

Abstract: The present invention relates to a thermally conductive resin composition excellent in toughness and thermal conductivity. The thermally conductive resin composition comprises a thermoplastic resin (A) and scale-like graphite (B), and is free from a polyester elastomer, wherein a content of the thermoplastic resin (A) is 45 to 60 parts by mass and a content of the scale-like graphite (B) is 40 to 55 parts by mass (based on 100 parts by mass in total of the thermoplastic resin (A) and the scale-like graphite (B)), the scale-like graphite (B) comprises scale-like graphite (B1) having a mean particle diameter D50 of 150 to 400 μm and scale-like graphite (B2) having a mean particle diameter D50 of 10 to 40 μm, a mass ratio B1:B2 is 94:6 to 60:40, and thermal conductivity in a plane direction of a molded article obtained from the thermally conductive resin composition is 8 W/(m·K) or more.

公开(公告)号：US20230167347A1

公开(公告)日：2023-06-01

申请号：US17958894

申请日：2022-10-03

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Wataru TOYA

IPC: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08G77/08 ,  C08K3/28 ,  C08K3/22

CPC classification number: C09K5/14 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/282 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/005

Abstract: The present invention is a thermal conductive silicone composition comprises (C) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 4 µm or more and less than 50 µm; (D) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 50 µm or more and 150 µm or less; and (E) an inorganic particle having an average particle size of 0.1 µm or more and less than 4.0 µm. This provides a thermal conductive silicone composition ensuring both high thermal conductivity and shift resistance.

公开(公告)号：US11655355B2

公开(公告)日：2023-05-23

申请号：US17662865

申请日：2022-05-11

Applicant: Akron Polymer Solutions, Inc.

Inventor： Douglas Paschall ,  Adel F. Halasa

IPC: C08L9/00 ,  C08K3/04 ,  C08L23/22

CPC classification number: C08L9/00 ,  C08K3/042 ,  C08L23/22 ,  C08K2201/005 ,  C08L2205/035

Abstract: The introduction of graphene as an additive in rubber compounds is disclosed. The product shows increased barrier protection for tire innerliners, with no tradeoffs in other characteristics. A rubber compound is disclosed herein including butyl rubber and graphene plate, wherein the graphene plate has a thickness of less than about 3.2 nm, a particle size of between about 50 nm and about 10 μm, and contains greater than about 95% carbon.

公开(公告)号：US20230151188A1

公开(公告)日：2023-05-18

申请号：US17985179

申请日：2022-11-11

Applicant: Taiyuan University of Technology

Inventor： Wei HUANG ,  Kai YANG ,  Qian ZHANG ,  Jianwei LIU ,  Zenglin GAO ,  Zeguang HAO

IPC: C08K11/00 ,  C08K3/36 ,  C08K9/04 ,  C08F36/08

CPC classification number: C08K11/005 ,  C08F36/08 ,  C08K3/36 ,  C08K9/04 ,  C08K2201/005

Abstract: A rubber reinforcing filler and a method for preparing rubber reinforcing filler by activation and modification of coal gangue are provided. The method includes the following steps: providing coal gangue raw material; crushing coal gangue raw materials; the crushed coal gangue raw materials are ultrafine grinding to obtain coal gangue particles; coal gangue particles were obtained by air flow classification. Activation of coal gangue particles; the activated gangue particles were surface modified and ground to obtain the modified gangue particles. The invention relates to the field of comprehensive utilization of coal gangue and the technical field of rubber filler. The method is simple and effective, which can complete the blending modification of coupling agent and activated coal gangue particles for surface modification at low cost, so as to avoid the waste of materials in the traditional modification process and realize the preparation of high quality rubber reinforcing filler.

公开(公告)号：US20230151182A1

公开(公告)日：2023-05-18

申请号：US17906830

申请日：2020-10-23

Applicant: I.S.T CORPORATION

Inventor： Akimasa YOSHIMOTO

IPC: C08K3/04 ,  C08G73/10 ,  C08K7/18 ,  G03G15/20

CPC classification number: C08K3/04 ,  C08G73/1042 ,  C08G73/1071 ,  C08G73/1032 ,  C08K7/18 ,  G03G15/2057 ,  C08K2201/001 ,  C08K2201/005

Abstract: An objective of the present invention is to provide a fixing belt having excellent thermal conductivity and capable of suppressing a torque increase in long-term use. The fixing belt of this invention has a base layer including a polyimide resin, a thermal conductive filler, and a wear-resistant filler, the old Mohs hardness of the wear-resistant filler is 5 or more, the thermal conductivity of the base layer is 0.7 W/mK or more, and the inner surface roughness Rz of the base layer in a sliding direction is 2.0 μm or less.

公开(公告)号：US11649383B2

公开(公告)日：2023-05-16

申请号：US16313622

申请日：2017-06-27

Applicant: UNIVERSITY OF LIMERICK

Inventor： Bin Zhao ,  Conor McCarthy

IPC: C09J11/04 ,  C09J163/00 ,  C09J9/02 ,  C08K3/04 ,  C08K3/22 ,  C08K7/06 ,  C08K7/24

CPC classification number: C09J11/04 ,  C09J9/02 ,  C09J163/00 ,  C08K3/042 ,  C08K3/22 ,  C08K7/06 ,  C08K7/24 ,  C08K2003/2275 ,  C08K2201/001 ,  C08K2201/005 ,  C09J2301/314 ,  C09J2301/412 ,  C09J2301/502 ,  C09J163/00 ,  C08K2003/2275 ,  C09J163/00 ,  C08K2201/001 ,  C09J163/00 ,  C08K7/24 ,  C09J163/00 ,  C08K3/042 ,  C08K2003/2275

Abstract: An adhesive composition degradable by dielectric heating. The adhesive composition comprises a thermosetting polymer and a material sensitive to dielectric heating. The material sensitive to dielectric heating is selected from any one or more of hollow nanospheres, nanotubes, nanorods, nanofibres, nanosheets, graphene, graphene derivatives, nano/micro hybrids and mixtures of two or more nanoscale particles. The adhesive composition may be particularly useful in the assembly and disassembly of parts, particularly parts which have complicated and/or blocked joined surfaces. A method of joining at least two parts of an article together and a method of disassembling at least two parts of an article, using the adhesive composition are also provided. The adhesive composition may provide a reworkable nano-composite adhesive. The adhesive composition may be used to reversibly bond a biomedical or dental implant to a part of a human or animal body.

公开(公告)号：US20230141757A1

公开(公告)日：2023-05-11

申请号：US17910567

申请日：2021-03-10

Applicant: SUMITOMO METAL MINING CO., LTD.

Inventor： Hiroshi Kobayashi ,  Tatsuo Kibe ,  Satoshi Kashiwaya

IPC: C08J5/18 ,  C08K3/22

CPC classification number: C08J5/18 ,  C08K3/22 ,  C08J2300/22 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005

Abstract: Provided is a thermally conductive composition that can easily be shaped into a sheet or the like, and is capable of effectively suppressing pump out. Specifically provided is a thermally conductive composition that includes a base oil composition and an inorganic powder filler, wherein: the base oil composition contains a base oil, a thermoplastic resin that has a softening point of 50-150° C., and a thixotropic agent; the inorganic powder filler contains a first inorganic powder filler having an average particle size in the range of 10-100 µm, a second inorganic powder filler, and a third inorganic powder filler; and the thermoplastic resin is included at a proportion of 50-200 parts by mass and the thixotropic agent is included at a proportion of 1-10 parts by mass per 100 parts by mass of the base oil.

公开(公告)号：US11644754B2

公开(公告)日：2023-05-09

申请号：US16618822

申请日：2018-06-04

Applicant: MERCK PATENT GMBH

Inventor： Naofumi Yoshida ,  Megumi Takahashi ,  Katsuto Taniguchi ,  Toshiaki Nonaka

IPC: C08K3/36 ,  G03F7/075 ,  C08G77/18 ,  C08K7/26 ,  C08K9/06 ,  C09D183/04 ,  G03F7/038 ,  G03F7/039 ,  C08G77/00

CPC classification number: G03F7/0757 ,  C08G77/18 ,  C08K3/36 ,  C08K7/26 ,  C08K9/06 ,  C09D183/04 ,  G03F7/038 ,  G03F7/039 ,  C08G77/80 ,  C08K2201/005 ,  C08K2201/011

Abstract: To provide a photosensitive composition capable of easily forming a cured film having a low refractive index. The present invention provides a photosensitive siloxane composition comprising: a polysiloxane, a photosensitive agent, hollow silica particles, and a solvent. The hollow silica particles contain voids inside, and have outer surfaces subjected to hydrophobic treatment.

公开(公告)号：US11643543B2

公开(公告)日：2023-05-09

申请号：US17337439

申请日：2021-06-03

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Kenji Utashima ,  Tomohiro Kondou

IPC: C08L59/00 ,  C08K3/08 ,  C08K5/01

CPC classification number: C08L59/00 ,  C08K3/08 ,  C08K5/01 ,  C08K2003/0812 ,  C08K2201/003 ,  C08K2201/005

Abstract: The present disclosure is directed to provide a resin composition which enables production of a molded product generating less formaldehyde and having excellent appearance and weather resistance, and also achieves suppression of mold deposit during molding. Presently disclosed is a polyacetal resin composition comprising 100 parts by mass of a polyacetal resin (A); and 0.1 to 10 parts by weight of an aluminum pigment (B), the aluminum pigment (B) containing 0.1 to 2.0 mass % of particles with a particle diameter of 1 μm or less with respect to a total amount of the aluminum pigment (B), and a volume average particle size of the aluminum pigment (B) being 3 to 40 μm.