HIGH TEMPERATURE-RESISTANT POLYAMIDE MOULDING COMPOUNDS
AND USES THEREOF ESPECIALLY IN THE AUTOMOTIVE SECTOR

    公开(公告)号:US20170275459A1

    公开(公告)日:2017-09-28

    申请号:US15466393

    申请日:2017-03-22

    Applicant: EMS-PATENT AG

    Abstract: A polyamide moulding compound consisting of the following components (A)-(E): (A) 40-70 wt. % of at least one partially crystalline, partially aromatic polyamide, made up of: (a1) 60 to 75 wt. % of 6T units, formed from 1,6-hexanediamine and terephthalic acid; (a2) 20 to 35 wt. % of 6I units, formed from 1,6-hexanediamine and isophthalic acid; (a3) 3 to 15 wt. % of 612 units, formed from 1,6-hexanediamine and dodecanedioic acid; and (a4) 0 to 5 wt. % of one of the following units: 66 units, formed from 1,6-hexanediamine and adipic acid; 68 units, formed from 1,6-hexane-diamine and suberic acid; 69 units formed from 1,6-hexanediamine and azelaic acid; 610 units formed from 1,6-hexanediamine and sebacic acid; 6 units formed from ε-caprolactam; or a mixture of such units; wherein the sum of the components (a1) to (a4) makes up 100 wt. % of the polyamide (A); (B) 30-60 wt. % of fibrous reinforcing materials; (C) 0-30 wt. % of particulate fillers different from (B), (D) and (E); (D) 0-2.0 wt. % of heat stabilizers; and (E) 0-6 wt. % of auxiliary agents and/or additives, different from (A)-(D); wherein the sum of the components (A)-(E) makes up 100 wt. % is described, as well as corresponding moulded bodies and applications of such moulded bodies in particular as hollow bodies for contact with coolant liquid in the automotive sector.

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