Abstract:
The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.
Abstract:
The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.
Abstract:
A polyamide moulding compound consisting of the following components (A)-(E): (A) 40-70 wt. % of at least one partially crystalline, partially aromatic polyamide, made up of: (a1) 60 to 75 wt. % of 6T units, formed from 1,6-hexanediamine and terephthalic acid; (a2) 20 to 35 wt. % of 6I units, formed from 1,6-hexanediamine and isophthalic acid; (a3) 3 to 15 wt. % of 612 units, formed from 1,6-hexanediamine and dodecanedioic acid; and (a4) 0 to 5 wt. % of one of the following units: 66 units, formed from 1,6-hexanediamine and adipic acid; 68 units, formed from 1,6-hexane-diamine and suberic acid; 69 units formed from 1,6-hexanediamine and azelaic acid; 610 units formed from 1,6-hexanediamine and sebacic acid; 6 units formed from ε-caprolactam; or a mixture of such units; wherein the sum of the components (a1) to (a4) makes up 100 wt. % of the polyamide (A); (B) 30-60 wt. % of fibrous reinforcing materials; (C) 0-30 wt. % of particulate fillers different from (B), (D) and (E); (D) 0-2.0 wt. % of heat stabilizers; and (E) 0-6 wt. % of auxiliary agents and/or additives, different from (A)-(D); wherein the sum of the components (A)-(E) makes up 100 wt. % is described, as well as corresponding moulded bodies and applications of such moulded bodies in particular as hollow bodies for contact with coolant liquid in the automotive sector.
Abstract:
The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.
Abstract:
The present invention relates to polyamide moulding compounds which are distinguished by excellent flame-retardant properties and by very good long-term heat-ageing resistance. The moulding compounds according to the invention comprise a partially aromatic polyamide, caprolactam, a heat stabiliser, possibly a flame retardant and optionally further additives and admixtures. The polyamide moulding compound is thereby free of metal salts and/or metal oxides of a transition metal of group VB, VIB, VIIB or VIIIB of the periodic table.