公开(公告)号：US20130032844A1

公开(公告)日：2013-02-07

申请号：US13651110

申请日：2012-10-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok PARK

IPC: H01L33/58

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a cross-sectional shape of the screen member is substantially rectangular, and a width of the cross-sectional shape of the screen member being larger than a height of the cross sectional shape of the screen member, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.

Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 电路层上的金层; 电连接在发光器件和金层之间的线; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光器件的透镜，其中所述屏幕部件的截面形状基本上是矩形的，并且所述屏幕部件的横截面形状的宽度大于所述屏幕部件的横截面形状的高度 其中，所述屏幕部件的底面位于比所述发光装置高的位置，并且所述屏部件的整个最上表面与所述透镜接触。

公开(公告)号：US08138507B2

公开(公告)日：2012-03-20

申请号：US13182393

申请日：2011-07-13

Applicant: Park Jun Seok

Inventor： Park Jun Seok

IPC: H01L29/267

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor light emitting package is discussed, which includes a base having a top surface with a flat portion; a semiconductor light emitting device on the base; an electrical circuit layer electrically connected to the semiconductor light emitting device; a screen member having an opening and disposed on the base around the semiconductor light emitting device, the screen member shaped into a substantially circle; and an optical member formed of a light transmissive material such that light emitted from the semiconductor light emitting device passes therethrough, wherein a bottom surface of the screen member is positioned higher than the semiconductor light emitting device, an edge portion of the optical member is in contact with the screen member, a top surface of the optical member is substantially parallel to the flat portion of the base.

Abstract translation: 讨论了半导体发光封装，其包括具有平坦部分的顶表面的基座; 基底上的半导体发光器件; 电连接到半导体发光器件的电路层; 屏幕构件，其具有开口并且设置在所述基底周围所述半导体发光器件，所述屏蔽构件成形为大致圆形; 以及由透光性材料形成的光学部件，使得从半导体发光元件射出的光通过其中，其中，所述荧光屏部件的底面位于比所述半导体发光器件高的位置，所述光学部件的边缘部分为 与屏幕构件接触，光学构件的顶表面基本上平行于基底的平坦部分。

公开(公告)号：US08134161B2

公开(公告)日：2012-03-13

申请号：US13182389

申请日：2011-07-13

Applicant: Park Jun Seok

Inventor： Park Jun Seok

IPC: H01L29/267

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting device; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.

Abstract translation: 一种半导体发光封装，包括具有平坦部分的顶表面的基座，该基部成形为大致圆形; 基底上的多个半导体发光器件; 电连接到所述多个半导体发光器件的电路层; 在基座上的多个屏幕构件; 以及多个由透光材料形成的光学部件，使得从至少一个半导体发光器件发射的光通过其中，其中每个屏蔽部件具有围绕至少一个半导体发光器件的开口，每个 筛部件的开口成形为大致圆形，基部的直径大于筛部件的开口直径，并且光学部件的边缘部分与一个筛网部件接触。

公开(公告)号：US20100314652A1

公开(公告)日：2010-12-16

申请号：US12860792

申请日：2010-08-20

Applicant: Park Jun Seok

Inventor： Park Jun Seok

IPC: H01L33/58

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract translation: 本发明公开了一种发光器件封装，包括：金属基底; 电路层，设置在所述金属基座的上侧，用于提供导电路径; 安装在具有比所述金属基底上的第一区域更小的厚度的第二区域中的发光器件; 绝缘层，夹在元基体和电路层之间; 设置在所述电路层的上侧的电极层; 以及用于电连接电极层和发光器件的导线。 此外，提供了一种发光器件封装，其由于将发光器件放置在金属基底的小厚度部分上而提高了发光效率。