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    LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL MEMBER
    2.
    发明申请
    LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL MEMBER 审中-公开

    公开(公告)号：US20190131504A1

    公开(公告)日：2019-05-02

    申请号：US16231821

    申请日：2018-12-24

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jun Seok PARK

    IPC: H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  H01L27/15 ,  H01L33/56 ,  H01L33/58 ,  H01L33/54 ,  H01L33/40

    Abstract: A light emitting device package can include a base including a flat top surface; first and second electrical circuit components disposed on the flat top surface of the base; a light emitting diode disposed on the flat top surface of the base, an optical member comprising a light transmissive material; and a guiding member disposed on the flat top surface of the base and having a closed loop shape for guiding the optical member, in which the first and second electrical circuit components respectively include first and second portions disposed between the flat top surface of the base and a bottom surface of the guiding member, the first electrical circuit component includes a first extension portion that extends from the first portion to a first location outside of an outer edge of the guiding member in a first direction, and a second extension portion that extends from the first extension portion to a second location outside of the outer edge of the guiding member in a second direction different than the first direction, the first direction and the second direction being disposed on a horizontal plane parallel to the flat top surface of the base.

    LIGHT EMITTING DEVICE PACKAGE
    3.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开
    发光装置包装

    公开(公告)号：US20160104828A1

    公开(公告)日：2016-04-14

    申请号：US14512148

    申请日：2014-10-10

    Applicant: LG Innotek Co., Ltd.

    Inventor： Jun Seok PARK ,  Wan Ho KIM

    IPC: H01L33/62 ,  H01L33/50 ,  H01L33/52 ,  H01L33/48

    CPC classification number: H01L33/385 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

    Abstract translation: 提供发光器件封装。 发光器件封装包括封装主体，其包括第一腔体和连接到第一腔体的第二腔体; 第一引线电极，其至少一部分设置在所述第二腔内; 第二引线电极，其至少一部分设置在第一腔内; 设置在所述第二腔内的发光器件; 设置在所述第二腔内的第一线，所述第一线将所述发光器件电连接到所述第一引线电极; 以及将所述发光器件电连接到所述第二引线电极的第二线。

    LIGHT EMITTING DEVICE PACKAGE
    8.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开
    发光装置包装

    公开(公告)号：US20150311396A1

    公开(公告)日：2015-10-29

    申请号：US14794563

    申请日：2015-07-08

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jun Seok PARK ,  Wan Ho KIM

    IPC: H01L33/38 ,  H01L33/56 ,  H01L33/08 ,  H01L33/58

    CPC classification number: H01L33/385 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A light emitting device including a package body having a cavity; a first electrode and a second electrode in the package body; a plurality of light emitting chips on the first electrode; and a resin material in the cavity. Further, wherein the first electrode and the second electrode are separated by the package body, the package body includes a stepped portion exposed between the first electrode and the second electrode, the first electrode includes a bottom surface, a top surface and an inclined surface between the bottom surface and the top surface, and the top surface of the first electrode comprises an end portion in contact with the stepped portion.

    Abstract translation: 一种发光器件，包括具有空腔的封装主体; 第一电极和第二电极; 在所述第一电极上的多个发光芯片; 和空腔中的树脂材料。 此外，其中第一电极和第二电极被封装主体分开，封装主体包括暴露在第一电极和第二电极之间的阶梯部分，第一电极包括底表面，顶表面和位于 底表面和顶表面以及第一电极的顶表面包括与阶梯部分接触的端部。

    LIGHT EMITTING MODULE AND LIGHT EMITTING DEVICE HAVING THE SAME
    9.
    发明申请
    LIGHT EMITTING MODULE AND LIGHT EMITTING DEVICE HAVING THE SAME 有权
    发光模块和具有该发光模块的发光装置

    公开(公告)号：US20140369044A1

    公开(公告)日：2014-12-18

    申请号：US14302937

    申请日：2014-06-12

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jun Seok PARK

    IPC: F21K99/00

    CPC classification number: F21K9/20 ,  F21V19/001 ,  F21V23/002 ,  F21V23/06 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: Disclosed are a light emitting module and a light emitting device. The disclosed light emitting module includes a plurality of light emitting devices and a wire connecting the light emitting devices with each other and having at least a first end portion coupled with each light emitting device. The wire has a length longer than a distance between the light emitting devices, and is located higher than bottom surfaces of the light emitting devices. Each light emitting device includes a body including an insulating material, a first lead frame making contact with the body and having a first coupling part, a second lead frame making contact with the body and having a second coupling part, and a light emitting chip on at least one of the first and second lead frames. The first and second coupling parts are located higher than the bottom surfaces of the light emitting devices, and the wire is coupled with the first and second coupling parts of the light emitting devices.

    Abstract translation: 公开了一种发光模块和发光装置。 所公开的发光模块包括多个发光装置和将发光装置彼此连接并且具有与每个发光装置耦合的至少第一端部的导线。 导线的长度长于发光器件之间的距离，并且位于比发光器件的底表面高。 每个发光器件包括：主体，其包括绝缘材料;第一引线框架，与主体接触并且具有第一耦合部分;与主体接触并具有第二耦合部分的第二引线框架;以及发光芯片， 所述第一和第二引线框架中的至少一个。 第一和第二耦合部分位于比发光器件的底表面高的位置，并且导线与发光器件的第一和第二耦合部分耦合。

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