Printed circuit board assembly
    96.
    发明授权

    公开(公告)号:US09961773B2

    公开(公告)日:2018-05-01

    申请号:US14929127

    申请日:2015-10-30

    Inventor: Dongwan Choi

    Abstract: A printed circuit board assembly includes: a first signal terminal row including a plurality of first signal terminals connected to a plurality of signal wirings of a flexible printed circuit board (FPCB), respectively; a first ground terminal row spaced from the first signal terminal row and including a plurality of first ground terminals connected to a plurality of ground wirings of the FPCB, respectively; a second signal terminal row including a plurality of second signal terminals connected to a plurality of signal wirings of a printed circuit board (PCB), respectively; and a second ground terminal row spaced from the second signal terminal row and including a plurality of second ground terminals connected to a plurality of ground wirings of the PCB, respectively. The first ground terminal row is closer to an end portion of the FPCB than the first signal terminal row.

    METHOD OF INSTALLING ELECTRONIC COMPONENT, DISPLAY DEVICE AND DISPLAY SYSTEM

    公开(公告)号:US20180088389A1

    公开(公告)日:2018-03-29

    申请号:US15717769

    申请日:2017-09-27

    Inventor: Kaoru FURUTA

    Abstract: A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

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