Abstract:
A side loading enclosure for a rack mount type storage unit is provided. The enclosure provides for easier access to hard disk drives (HDDs) for maintenance and repair as well as the ability to increase the number of HDDs that can be mounted in a single enclosure. The enclosure may include a bottom plate, a pair of side plates, and a pair of end plates. Located within the enclosure are a first row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a first printed circuit board and a second row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a second printed circuit board. The one or more stacks of HDDS in the first row is separate from and located parallel to the one or more stacks of HDDs in the second row.
Abstract:
An insertion and removal assembly for installing and removing hard drives from an enclosure, such as a computer chassis, is provided. The insertion and removal assembly includes a sliding member configured to receive a hard drive, a lever handle rotatably connected to the sliding member and an attachment wall having a plurality of protrusions defining a plurality of slots, each slot configured to receive one sliding member. A user reveals a slot for accepting the installation of the hard drive in the enclosure by pushing a tab on the attachment wall near a distal portion of the lever handle to release the lever handle and then pulling the lever handle outward exposing the sliding member. A hard drive is inserted into the sliding member and pushed inwardly into the chassis. Conversely, the sliding member can contain a hard drive which is partially ejected by unlatching and subsequently pulling the lever.
Abstract:
A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
Abstract:
An input/output module (IOM) for use within a network storage system mounted within a rack enclosure. The IOM includes a switching component configured to provide top-of-rack (TOR) switching for data to be routed from input connectors to data storage devices within the rack enclosure. The IOM also includes a protocol interface configured to convert a protocol of the data from an input data protocol (e.g., Ethernet, Fibre Channel or InfiniBand™) to a protocol for use with the storage devices (e.g., nonvolatile memory express (NVMe) and Peripheral Component Interconnect Express (PCIe)). Among other features, the IOM allows switching to be dis-aggregated from a TOR switch and distributed throughout the data network of the rack.
Abstract:
One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.
Abstract:
A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
Abstract:
Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.
Abstract:
A network-attached storage device is provided comprising a network card with an embedded operating system that provides autonomous operation of the network card, the network card including a network port to communicate with an external device and a peripheral component interconnect express (PCIe) interface to couple to a first PCIe device in the absence of a system host processor.
Abstract:
A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
Abstract:
A photoplethysmography (PPG) circuit or non-contact camera obtains PPG signals at a plurality of wavelengths. A signal processing module obtains at least a first spectral response around a first wavelength and a second spectral response around a second wavelength. The signal processing device generates PPG input data using the PPG signals, wherein the PPG input data includes one or more parameters obtained from each of the first spectral response and the second spectral response. A neural network processing device generates an input vector including the PPG input data and determines an output vector including health data, wherein the health data includes for example, an oxygen saturation level, a heart rate, or indication of a septic condition.