Side loading enclosure for a rack mount type storage unit
    101.
    发明授权
    Side loading enclosure for a rack mount type storage unit 有权
    用于机架安装型存储单元的侧装式机箱

    公开(公告)号:US09395767B2

    公开(公告)日:2016-07-19

    申请号:US14011081

    申请日:2013-08-27

    CPC classification number: G06F1/187 G11B33/125 G11B33/128 H05K7/1487

    Abstract: A side loading enclosure for a rack mount type storage unit is provided. The enclosure provides for easier access to hard disk drives (HDDs) for maintenance and repair as well as the ability to increase the number of HDDs that can be mounted in a single enclosure. The enclosure may include a bottom plate, a pair of side plates, and a pair of end plates. Located within the enclosure are a first row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a first printed circuit board and a second row, extending perpendicularly between the pair of end plates, having one or more stacks of HDDs mounted to a second printed circuit board. The one or more stacks of HDDS in the first row is separate from and located parallel to the one or more stacks of HDDs in the second row.

    Abstract translation: 提供了一种用于机架安装型存储单元的侧装式外壳。 机箱提供了更容易访问硬盘驱动器(HDD)进行维护和修复,以及增加可以安装在单个机箱中的HDD数量的能力。 外壳可包括底板,一对侧板和一对端板。 位于外壳内的是第一排,垂直地延伸在一对端板之间,具有一个或多个安装到第一印刷电路板的HDD堆叠和第二排,其垂直地延伸在该对端板之间,具有一个或多个 堆叠的HDD安装到第二印刷电路板。 第一行中的一个或多个HDDS堆叠与第二行中的一个或多个HDD堆叠分离并且位于其中并且位于其中。

    Insertion and removal assembly for installing and removing data storage drives in an enclosure
    102.
    发明授权
    Insertion and removal assembly for installing and removing data storage drives in an enclosure 有权
    插入和拆卸组件,用于在机箱中安装和删除数据存储驱动器

    公开(公告)号:US09042094B2

    公开(公告)日:2015-05-26

    申请号:US13782911

    申请日:2013-03-01

    Abstract: An insertion and removal assembly for installing and removing hard drives from an enclosure, such as a computer chassis, is provided. The insertion and removal assembly includes a sliding member configured to receive a hard drive, a lever handle rotatably connected to the sliding member and an attachment wall having a plurality of protrusions defining a plurality of slots, each slot configured to receive one sliding member. A user reveals a slot for accepting the installation of the hard drive in the enclosure by pushing a tab on the attachment wall near a distal portion of the lever handle to release the lever handle and then pulling the lever handle outward exposing the sliding member. A hard drive is inserted into the sliding member and pushed inwardly into the chassis. Conversely, the sliding member can contain a hard drive which is partially ejected by unlatching and subsequently pulling the lever.

    Abstract translation: 提供了用于从诸如计算机机箱的外壳安装和移除硬盘驱动器的插入和拆卸组件。 插入和拆卸组件包括构造成接收硬盘驱动器的滑动构件,可旋转地连接到滑动构件的杆手柄和具有限定多个狭槽的多个突起的附接壁,每个狭槽构造成接收一个滑动构件。 用户通过推动杆手柄的远端附近的附件壁上的突出部分露出用于接受硬盘驱动器在壳体中的安装的插槽,以释放杠杆手柄,然后将杠杆手柄向外拉出以暴露滑动构件。 将硬盘驱动器插入滑动构件并向内推入底盘。 相反,滑动构件可以容纳通过解锁并随后拉动杆部分地弹出的硬盘驱动器。

    SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST
    103.
    发明申请
    SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST 有权
    通过使用耐蚀材料的结构同时选择性的宽带划分

    公开(公告)号:US20140251663A1

    公开(公告)日:2014-09-11

    申请号:US14205337

    申请日:2014-03-11

    Abstract: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

    Abstract translation: 提供了具有选择性地定位在第一介电层中的第一电介质层和第一电镀抗蚀剂的多层印刷电路板。 可以将第二电镀抗蚀剂选择性地定位在第一电介质层或第二电介质层中,第二电镀抗蚀剂与第一电镀抗蚀剂分离。 通孔延伸穿过第一电介质层,第一电镀抗蚀剂和第二电镀抗蚀剂。 除了沿第一电镀抗蚀剂和第二电镀抗蚀剂之间的长度之外,通孔的内表面镀有导电材料。 这形成了具有与第二通孔段电隔离的第一通路段的分隔电镀通孔。

    Dis-aggregated switching and protocol configurable input/output module

    公开(公告)号:US12132670B2

    公开(公告)日:2024-10-29

    申请号:US17515004

    申请日:2021-10-29

    CPC classification number: H04L49/254 H04L49/256 H04L49/30 H05K5/0204

    Abstract: An input/output module (IOM) for use within a network storage system mounted within a rack enclosure. The IOM includes a switching component configured to provide top-of-rack (TOR) switching for data to be routed from input connectors to data storage devices within the rack enclosure. The IOM also includes a protocol interface configured to convert a protocol of the data from an input data protocol (e.g., Ethernet, Fibre Channel or InfiniBand™) to a protocol for use with the storage devices (e.g., nonvolatile memory express (NVMe) and Peripheral Component Interconnect Express (PCIe)). Among other features, the IOM allows switching to be dis-aggregated from a TOR switch and distributed throughout the data network of the rack.

    ACOUSTIC ATTENUATION DEVICE
    105.
    发明公开

    公开(公告)号:US20230228283A1

    公开(公告)日:2023-07-20

    申请号:US17574535

    申请日:2022-01-12

    CPC classification number: F04D29/664 F04D19/002 F04D29/541 H05K7/20172

    Abstract: One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.

    Simultaneous and selective wide gap partitioning of via structures using plating resist

    公开(公告)号:US11304311B2

    公开(公告)日:2022-04-12

    申请号:US17080524

    申请日:2020-10-26

    Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

    Laminate structures with hole plugs and methods of forming laminate structures with hole plugs

    公开(公告)号:US11246226B2

    公开(公告)日:2022-02-08

    申请号:US16298896

    申请日:2019-03-11

    Abstract: Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.

    SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST

    公开(公告)号:US20210153360A1

    公开(公告)日:2021-05-20

    申请号:US17080524

    申请日:2020-10-26

    Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

    SYSTEM AND METHOD FOR OBTAINING HEALTH DATA USING PHOTOPLETHYSMOGRAPHY

    公开(公告)号:US20210137464A1

    公开(公告)日:2021-05-13

    申请号:US17142999

    申请日:2021-01-06

    Abstract: A photoplethysmography (PPG) circuit or non-contact camera obtains PPG signals at a plurality of wavelengths. A signal processing module obtains at least a first spectral response around a first wavelength and a second spectral response around a second wavelength. The signal processing device generates PPG input data using the PPG signals, wherein the PPG input data includes one or more parameters obtained from each of the first spectral response and the second spectral response. A neural network processing device generates an input vector including the PPG input data and determines an output vector including health data, wherein the health data includes for example, an oxygen saturation level, a heart rate, or indication of a septic condition.

Patent Agency Ranking