WAFER BONDING METHOD FOR TRANSFERING THIN FILMS TO A SUBSTRATE

    公开(公告)号:US20230402816A1

    公开(公告)日:2023-12-14

    申请号:US18207731

    申请日:2023-06-09

    CPC classification number: H01S5/0215 H01S5/22

    Abstract: Embodiments of the present invention relate to a wafer bonding method for heterogenous integration of multiple wafers to a carrier substrate and bonding multiple functional wafers to the substrate to transfer semiconductor thin films. A routing layer for electrical or optical signals is defined on the substrate before a first wafer is bonded to the substrate and is optionally buried with subsequent planarization. Functional ridges are lithographically defined and etched after the first wafer is bonded to the substrate and a thin film is transferred to the substrate. A portion of the wafer surface is then cleared to expose the initial bonding surface on the substrate. A second wafer is bonded to the resulting material by etching pockets in the second functional wafer at the locations of the functional ridges from the first wafer bond.

    OPTICAL SENSOR READOUT AND INTERROGATING AN OPTICAL SENSOR

    公开(公告)号:US20230358575A1

    公开(公告)日:2023-11-09

    申请号:US18144787

    申请日:2023-05-08

    CPC classification number: G01D5/35306 G01B9/02008

    Abstract: An optical sensor readout Interrogates an optical sensor and includes: a microcavity sensor that receives an optical frequency comb, produces a post-sensor optical frequency comb from the optical frequency comb based on a physical perturbation subjected to the microcavity sensor, and communicates the post-sensor optical frequency comb to a photo detector; an electro optic modulator in optical communication with the microcavity sensor and that receives input light and a radiofrequency drive signal, produces the optical frequency comb from the input light based on the radiofrequency drive signal, and communicates the optical frequency comb to the microcavity sensor; and the photo detector in optical communication with the microcavity sensor and that: receives the post-sensor optical frequency comb from the microcavity sensor; receives frequency shifted light; and produces a radiofrequency interferogram from interference between the post-sensor optical frequency comb and the frequency shifted light.

    TEMPORAL MAGNIFICATION SPECTROMETER AND PERFORMING SPECTROSCOPIC TEMPORAL MAGNIFICATION

    公开(公告)号:US20230349821A1

    公开(公告)日:2023-11-02

    申请号:US18142365

    申请日:2023-05-02

    CPC classification number: G01N21/31 G01N2201/06113

    Abstract: A temporal magnification spectrometer includes a dual-chirp comb source, a signal leg, a local oscillator leg, an optical detector, and a temporal magnification analyzer. The dual-chirp comb source produces optical carrier laser light. A signal comb having signal linearly chirped waveforms interacts with a sample to produce a transmitted signal comb. The local oscillator leg produces a local oscillator comb having local oscillator linearly chirped waveforms. The optical detector receives the transmitted signal and local oscillator combs and produces an RF domain signal. The analyzer receives and Fourier transforms the RF domain signal to produce an RF comb, which is sampled to produce sampled RF comb lines, which are normalized to produce temporally magnified sample frequency domain data. Intermediate sample temporal data are normalized to produce a steady-state sample spectral response.

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