公开(公告)号：US10207508B2

公开(公告)日：2019-02-19

申请号：US15704483

申请日：2017-09-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Brett E. Dahlgren

IPC: B41J2/165 ,  B41J2/14 ,  B41J2/16

Abstract: In some examples, a print cartridge includes a monolithic molding, and a printhead die embedded into a molding. The printhead die has a front surface exposed outside the molding to dispense fluid drops through nozzles and an opposing back surface covered by the molding except at a channel in the molding through which fluid is to pass directly to the back surface. The printhead die also has a nozzle health sensor molded into the molding to detect defective nozzles in the printhead die.

公开(公告)号：US20190009537A1

公开(公告)日：2019-01-10

申请号：US15748888

申请日：2015-10-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/155 ,  B41J2/16

Abstract: A printhead may include a non-epoxy mold compound layer and a number of slivers overmolded into the non-epoxy mold compound layer. A media wide array may include a number of printhead dies and a layer of moldable material, wherein the moldable material includes a non-epoxy mold compound overmolded onto the number of printhead dies.

公开(公告)号：US20190001676A1

公开(公告)日：2019-01-03

申请号：US15748914

申请日：2015-10-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/155 ,  B41J2/16

Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.

公开(公告)号：US20180372543A1

公开(公告)日：2018-12-27

申请号：US16062356

申请日：2016-04-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Zhizhang Chen ,  Chien-Hua Chen ,  James Elmer Abbott, JR.

IPC: G01J3/44 ,  G01N21/65 ,  B01L3/00

Abstract: In an example, a lab-on-chip Raman spectroscopy system is described. The lab-on-chip system includes a housing having a fluid channel formed thereon. The fluid channel is coupled to an inlet and to an outlet. A surface-enhanced Raman spectroscopy substrate is positioned inside the fluid channel. The surface-enhanced Raman spectroscopy substrate includes a plasmonic nanostructure and a sacrificial, conformal passivation coating deposited over at least the plasmonic nanostructure.

公开(公告)号：US20180361744A1

公开(公告)日：2018-12-20

申请号：US16110346

申请日：2018-08-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/045 ,  B41J2/14

Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

公开(公告)号：US20180269125A1

公开(公告)日：2018-09-20

申请号：US15763865

申请日：2015-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/29 ,  B41J2/14

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

公开(公告)号：US20180264813A1

公开(公告)日：2018-09-20

申请号：US15761202

申请日：2015-11-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/145

CPC classification number: B41J2/1433 ,  B41J2/14 ,  B41J2/145 ,  B41J2/155 ,  B41J2/16 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1637 ,  B41J2002/14491 ,  B41J2202/20

Abstract: Examples include a glass-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises nozzles for dispensing printing material. The glass-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.

公开(公告)号：US20180226316A1

公开(公告)日：2018-08-09

申请号：US15745743

申请日：2015-08-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L23/552 ,  H01L23/48 ,  H01L23/373 ,  B41J2/155

CPC classification number: H01L23/3135 ,  B41J2/155 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2202/20 ,  H01L23/3737 ,  H01L23/48 ,  H01L23/552 ,  H01L2224/96 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49401 ,  H01L2924/00012

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US09902162B2

公开(公告)日：2018-02-27

申请号：US14770049

申请日：2013-02-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/155 ,  B41J2/16

CPC classification number: B41J2/17526 ,  B41J2/14072 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/17553 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In one example, a print bar includes multiple printhead dies molded into an elongated, monolithic body. The dies are arranged generally end to end along a length of the body and the body has a channel therein through which fluid may pass directly to the dies.

公开(公告)号：US09895888B2

公开(公告)日：2018-02-20

申请号：US15303316

申请日：2014-04-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Diane R Hammerstad

IPC: B41J2/14

CPC classification number: B41J2/1433 ,  B41J2/1404 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In one example, a fluid flow structure includes a fluid dispensing micro device embedded in a molding having a channel therein through which fluid may flow directly to the device. The device contains multiple fluid ejectors and multiple fluid chambers each near an ejector. Each chamber has an inlet through which fluid from the channel may enter the chamber and an outlet through which fluid may be ejected from the chamber. A perimeter of the channel surrounds the inlets but is otherwise unconstrained in size by the size of the device.