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公开(公告)号:US20210072528A1
公开(公告)日:2021-03-11
申请号:US16680812
申请日:2019-11-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: XIAO-MEI MA , SHIN-WEN CHEN , KUN LI , LONG-FEI ZHANG
Abstract: A lens module includes a printed circuit board, a lens component, and at least two electric conductors. The lens component includes a first lens and a microscope base, the first lens is formed on the microscope base, the microscope base is formed on the printed circuit board, and the first lens is electrically conductive and deforms under voltage. The first lens is electrically connected to the printed circuit board by the electric conductors. The printed circuit board outputs a voltage to the first lens through the electric conductors; the first lens deforms according to the voltage thereby changing a focal distance of light passing through the first lens. The disclosure also relates to an electronic device using the lens module. The lens module can has a zoom function and has a litter volume.
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102.
公开(公告)号:US20210055500A1
公开(公告)日:2021-02-25
申请号:US16738171
申请日:2020-01-09
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHUAI-PENG LI , JING-WEI LI , SHENG-JIE DING , SHIN-WEN CHEN
IPC: G02B7/02
Abstract: A camera module comprising components held stably without glue includes a substrate and a lens assembly thereon. The lens assembly includes a lens holder, an optical filter, and a lens. The lens holder includes first and second holder portions, and a fixing block. The first holder portion includes a peripheral wall and a protruding flange; and the second holder portion is disposed on the first holder portion. The fixing block is on the flange away from the second holder portion, causing the fixing block and the flange to cooperatively form a clamping slot. The optical filter is disposed on the flange away from the second holder portion, an edge portion thereof being received in the clamping slot. The lens is disposed in the second holder portion. An electronic device and a method for making camera module are also provided.
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公开(公告)号:US20210021739A1
公开(公告)日:2021-01-21
申请号:US16536436
申请日:2019-08-09
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: A lens module includes a circuit board, a photosensitive chip, a filter, and a lens unit. The photosensitive chip is fixed on one surface of the circuit board. The filter faces the photosensitive chip. The lens unit includes a lens holder and a lens. The lens faces the filter. The lens holder is adhered to the circuit board and covers the photosensitive chip and the filter. The filter is fixed to an inner wall of a receiving hole defined in the lens holder.
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公开(公告)号:US20200348509A1
公开(公告)日:2020-11-05
申请号:US16438654
申请日:2019-06-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHENG-JIE DING , SHIN-WEN CHEN , JING-WEI LI , JIAN-CHAO SONG , SHUAI-PENG LI
Abstract: A camera module includes a lens base, a lens group, and a switching mechanism. The lens base defines a through hole. The lens group is received within the through hole. The switching mechanism includes a switching base, an optical path conversion member, and a driving member. The switching base is mounted on the lens base and defines a light guide cavity communicating with the through hole. The switching base defines a front aperture and a rear aperture. The front aperture and the rear aperture communicate with the light guide cavity. The optical path conversion member includes a reflective surface. The driving member is mounted within the light guide cavity. The driving member drives the optical light conversion member to rotate to cause the reflective surface to reflect light entering through the front aperture or the rear aperture to the lens group.
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公开(公告)号:US20200304692A1
公开(公告)日:2020-09-24
申请号:US16410061
申请日:2019-05-13
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHUAI-PENG LI , KUN LI , LONG-FEI ZHANG , SHIN-WEN CHEN
IPC: H04N5/225
Abstract: A lens module capable of simpler and more efficient manufacture includes a circuit board, a photosensitive chip fixed on the circuit board, a plurality of electronic components, and metal wires mounted on the circuit board. A light-absorbing first adhesive layer is applied to the circuit board, a lens module is fixed to the first adhesive layer, and a filter is installed to face the photosensitive ship. The first adhesive layer envelops the electronic components and the metal wires. An electronic device applying such a lens module is also provided.
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106.
公开(公告)号:US20200285139A1
公开(公告)日:2020-09-10
申请号:US16435994
申请日:2019-06-10
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: XIAO-MEI MA , SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI
Abstract: A light projecting module structured to prevent the risk of eye injury caused by high-intensity light includes a circuit board, a seat, a transparent conductive film, at least one conductive ball, at least one conductive layer, and at least one insulating colloid. The seat is mounted on the circuit board and includes a first surface away from the circuit board. The conductive film is mounted on the first surface. The conductive layer is formed on the seat and includes first and second end portions. The first end portion is electrically connected to the transparent conductive film by the conductive ball. The second end portion is electrically connected to the circuit board. The insulating colloid is formed at a junction of the transparent conductive film, the first end portion, and the conductive ball. An electronic device using such a module is also provided.
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公开(公告)号:US20200274999A1
公开(公告)日:2020-08-27
申请号:US16545238
申请日:2019-08-20
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: XIAO-MEI MA , SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI
IPC: H04N5/225 , H02K41/035 , H02P7/025 , G02B7/08
Abstract: A voice coil motor strongly attached to the base of a camera module comprises the base and a casing. The casing and the base are interlocked with each other. The casing is a hollow structure. The casing comprises a top surface and a side wall surrounding the top surface. The side wall and the base are engaged with each other. The side wall is extended in parts to form at least one extending leg. The extending leg extends to a side of the base away from the top surface and is bent toward the base.
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108.
公开(公告)号:US20200218027A1
公开(公告)日:2020-07-09
申请号:US16390134
申请日:2019-04-22
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , JIAN-CHAO SONG , SHENG-JIE DING , JING-WEI LI
Abstract: A photosensitive chip includes a photosensitive region, a non-photosensitive region and an adhesive layer. The non-photosensitive region protrudes from a periphery of the photosensitive region to surround the photosensitive region. The adhesive layer covers the non-photosensitive region to absorb light and reduce an intensity of light reflected from the adhesive layer. The disclosure also provides a lens module having the photosensitive chip, and an electronic device having the lens module.
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公开(公告)号:US20200186684A1
公开(公告)日:2020-06-11
申请号:US16547841
申请日:2019-08-22
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , SHENG-JIE DING , JING-WEI LI , JIAN-CHAO SONG
Abstract: A circuit board assembly for a twin-camera module to avoid any heat-induced misalignments in manufacture is disclosed, to improve the production yield of the camera module. The circuit board assembly comprises at least two daughter boards and at least one first flexible printed circuit board. Each of the flexible printed circuit boards connects to adjacent two of the daughter boards. The disclosure also provides the twin-camera module comprising the circuit board assembly, and an electronic device comprising the camera module.
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公开(公告)号:US20200135778A1
公开(公告)日:2020-04-30
申请号:US16222012
申请日:2018-12-17
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: YU-SHUAI LI , SHIN-WEN CHEN , KUN LI , KE-HUA FAN
IPC: H01L27/146 , H04N5/225 , H04N5/335 , H05K1/02
Abstract: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.
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