Abstract:
In an automotive headlamp, a light-emitting module is configured such that a light-emitting element and a control circuit unit for controlling the lighting of the light-emitting element are structured integrally with each other. A control circuit unit in a position anterior to the light-emitting element in a lamp unit is located below a shade section so that the control circuit unit can be clear of the path of light used to form a low beam light distribution pattern of the light emitted by the light-emitting element. In this setting, the light-emitting element is so located that a main optical axis Ax2 is perpendicular respect to an optical axis Ax1 of the lamp unit and that a light-emitting portion of the light-emitting element protrudes higher than the control circuit unit in the direction of the main optical axis Ax2.
Abstract:
A semiconductor device includes: a first nitride semiconductor layer; a second nitride semiconductor layer formed over the first nitride semiconductor layer; and a gate electrode facing the second nitride semiconductor layer via a gate insulating film. Because the second nitride semiconductor layer is formed by stacking plural semiconductor layers with their Al composition ratios different from each other, the Al composition ratio of the second nitride semiconductor layer changes stepwise. The semiconductor layers forming the second nitride semiconductor layer are polarized in the same direction so that, among the semiconductor layers, a semiconductor layer nearer to the gate electrode has higher (or lower) intensity of polarization. In other words, the intensities of polarization of the semiconductor layers change with an inclination based on their distances from the gate electrode so that, at each interface between two semiconductor layers, the amount of negative charge becomes larger than that of positive charge.
Abstract:
In a group III nitride-type field effect transistor, the present invention reduces a leak current component by conduction of residual carriers in a buffer layer, and achieves improvement in a break-down voltage, and enhances a carrier confinement effect (carrier confinement) of a channel to improve pinch-off characteristics (to suppress a short channel effect). For example, when applying the present invention to a GaN-type field effect transistor, besides GaN of a channel layer, a composition-modulated (composition-gradient) AlGaN layer in which aluminum composition reduces toward a top gradually or stepwise is used as a buffer layer (hetero buffer). To gate length Lg of a FET to be prepared, a sum a of layer thicknesses of an electron supply layer and a channel layer is selected so as to fulfill Lg/a≧5, and in such a case, the layer thickness of the channel layer is selected in a range of not exceeding 5 times (about 500 Å) as long as a de Broglie wavelength of two-dimensional electron gas accumulated in the channel layer in room temperature.
Abstract:
Provided is: a cell culture membrane, which is free from materials derived from living organisms, can easily be industrially mass-produced, exhibits superior long-term storage properties and chemical resistance, has excellent cell adhesion properties and long-term culture properties and is capable of replicating a cell adhesion morphology that is similar to that of collagen derived from living organisms and being used for conventional cell cultivation. Also provided are a cell culture substrate, and a method for manufacturing the cell culture substrate. In the present invention, as a cell adhesion layer, a polymer membrane represented by formula (I) is formed on the base of a cell culture substrate so as to have a membrane thickness equal to or greater than 0.2 μm (in the formula, R1 and R2 represent a —(CH2)n—NH2 moiety (n is an integer of 1-10 inclusive.) or H, with at least one of R1 and R2 being a —(CH2)n—NH2 moiety. Moreover, l and m are positive integers expressing polymerization degree).
Abstract:
Optical information and topographic information of the surface of a sample are measured at a nanometer-order resolution and with high reproducibility without damaging a probe and the sample by combining a nanometer-order cylindrical structure with a nanometer-order microstructure to form a plasmon intensifying near-field probe having a nanometer-order optical resolution and by repeating approach/retreat of the probe to/from each measurement point on the sample at a low contact force.
Abstract:
A light control device 1 includes a light source 10, a prism 20, a spatial light modulator 30, a drive unit 31, a control unit 32, a lens 41, an aperture 42, and a lens 43. The spatial light modulator 30 is a phase modulating spatial light modulator, includes a plurality of two-dimensionally arrayed pixels, is capable of phase modulation in each of these pixels in a range of 4π, and presents a phase pattern to modulate the phase of light in each of the pixels. This phase pattern is produced by superimposing a blazed grating pattern for light diffraction with a phase modulation range of 2π or less and a phase pattern having a predetermined phase modulation distribution with a phase modulation range of 2π or less.
Abstract:
A light source device 1 includes a laser light source 10 and an optical phase modulator 15 or the like. The optical phase modulator 15 inputs coherent light output from the laser light source 10 and transmitted through a beam splitter 14, phase-modulates the light according to the position on a beam cross section of the light, and outputs the phase-modulated light to the beam splitter 14. When (p+1) areas sectioned by p circumferences centered on a predetermined position are set on a beam cross section of light input to the optical phase modulator 15, the more outside each of the (p+1) areas is, the wider the radial width of the area, the amount of phase modulation is constant in each of the (p+1) areas, and the amounts of phase modulation differ by π between two adjacent areas out of the (p+1) areas.
Abstract:
Disclosed is an HJFET 110 which comprises: a channel layer 12 composed of InyGa1-yN (0≦y≦1); a carrier supply layer 13 composed of AlxGa1-xN (0≦x≦1), the carrier supply layer 13 being provided over the channel layer 12 and including at least one p-type layer; and a source electrode 15S, a drain electrode 15D and a gate electrode 17 which are disposed facing the channel layer 12 through the p-type layer, and provided over the carrier supply layer 13. The following relational expression is satisfied: 5.6×1011x
Abstract translation:公开了一种HJFET 110,其包括:由In y Ga 1-y N(0 @ y 1)组成的沟道层12; 由Al x Ga 1-x N(0 @ x 1)构成的载流子供给层13,载流子供给层13设置在沟道层12上并且包括至少一个p型层; 以及源极电极15S,漏极电极15D和栅极电极17,其通过p型层面对沟道层12,并且设置在载流子供给层13上。满足以下关系式:5.6×10×11× NA×eta×t [cm-2] <5.6×1013x,其中x表示载体供给层的Al组成比,t表示所述p型层的厚度,NA表示杂质浓度,eta表示活化 比。
Abstract:
A semiconductor device capable of suppressing the occurrence of a punch-through phenomenon is provided. A first n-type conductive layer (2′) is formed on a substrate (1′). A p-type conductive layer (3′) is formed thereon. A second n-type conductive layer (4′) is formed thereon. On the under surface of the substrate (1′), there is a drain electrode (13′) connected to the first n-type conductive layer (2′). On the upper surface of the substrate (1′), there is a source electrode (11′) in ohmic contact with the second n-type conductive layer (4′), and a gate electrode (12′) in contact with the first n-type conductive layer (2′), p-type conductive layer (3′), the second n-type conductive layer (4′) through an insulation film (21′). The gate electrode (12′) and the source electrode (11′) are alternately arranged. The p-type conductive layer (3′) includes In.
Abstract:
A granulating method is a method in which powder containing a water-soluble component is granulated. In the disclosed granulating method, a dispersion element, wherein fine water droplets are dispersed in superheated steam, is expelled from a nozzle, and thus the dispersion element and powder in a flowing state come into contact with one another. It is preferable that the mass ratio of superheated steam contained in the dispersion element, as a mass ratio found from the theoretical flow amount of superheated steam expelled from the nozzle, and the actual flow amount of water supplied to the nozzle, be set in a range of 20-70 mass %.