Glue for repair or attachment free of organotin
    106.
    发明授权
    Glue for repair or attachment free of organotin 有权
    不含有机锡的修复或附着胶

    公开(公告)号:US08785537B2

    公开(公告)日:2014-07-22

    申请号:US13384784

    申请日:2010-07-09

    Abstract: The invention relates to an adhesive composition, including: 10 to 95% of a moisture cross-linkable polymer (A), the main chain includes 2 silyl terminal groupings, each of which includes at least one hydrolyzable group bonded to the silicon atom; 1 to 60% of a mineral filler (B) in the form of particles having a size of between 1 nm and 0.2 mm; and 0.2 to 7% of a crosslinking catalyst (C) consisting of titanium tetraisopropoxide. The invention also relates to the use of said composition as glue for repair or attachment.

    Abstract translation: 本发明涉及一种粘合剂组合物,包括:10〜95%的水分交联聚合物(A),主链包括2个甲硅烷基末端基团,每个含有至少一个与硅原子键合的可水解基团; 1至60%的矿物填料(B),其尺寸为1nm至0.2mm; 和0.2〜7%的由四异丙氧基钛组成的交联催化剂(C)。 本发明还涉及所述组合物作为修补或附着的胶水的用途。

    TWO-COMPONENT CURABLE COMPOSITION
    109.
    发明申请
    TWO-COMPONENT CURABLE COMPOSITION 审中-公开
    两组分可固化组合物

    公开(公告)号:US20130280530A1

    公开(公告)日:2013-10-24

    申请号:US13838447

    申请日:2013-03-15

    Abstract: In the context of a curable agent based on at least one silyl-terminated polymer, the adhesion spectrum for bonding plastics, and the speed at which adhesion builds up, are to be improved. This is achieved by making available a curable agent containing two components (1) and (2) that are not in mutual contact, where component (1) contains at least one polymer having at least one terminal group of formula (I) -An-CH2—SiXYZ (I), in which A is a divalent bonding group, X, Y, Z are, mutually independently, are C1 to C8 alkyl, C1 to C8 alkoxy, or C1 to C8 acyloxy groups, where at least one of the substituents is a C1 to C8 alkoxy or C1 to C8 acyloxy group, and n is 0 or 1; and component (2) contains at least water and at least one silanol condensation catalyst. A further subject of the present invention is the use of the agent according to the present invention as an adhesive and/or sealant.

    Abstract translation: 在基于至少一种甲硅烷基封端的聚合物的可固化剂的上下文中,用于粘合塑料的粘合光谱以及附着力积聚的速度将得到改善。 这是通过提供含有两种不相互接触的组分(1)和(2)的可固化剂来实现的,其中组分(1)含有至少一种具有至少一个具有式(I)的端基的聚合物-An- 其中A为二价键合基​​团的X 1,Y,Z相互独立地为C 1至C 8烷基,C 1至C 8烷氧基或C 1至C 8酰氧基的CH 2 -Si XYZ(I),其中至少一个 取代基是C1至C8烷氧基或C1至C8酰氧基,n为0或1; 和组分(2)至少含有水和至少一种硅烷醇缩合催化剂。 本发明的另一个主题是根据本发明的试剂作为粘合剂和/或密封剂的用途。

    MOISTURE-CURING REACTIVE HOT MELT ADHESIVE COMPOSITION
    110.
    发明申请
    MOISTURE-CURING REACTIVE HOT MELT ADHESIVE COMPOSITION 审中-公开
    水分固化反应热熔胶组合物

    公开(公告)号:US20130150530A1

    公开(公告)日:2013-06-13

    申请号:US13701564

    申请日:2011-05-26

    Abstract: Provided is a curable composition prepared using a less toxic reactive silyl group-containing polymer, wherein the curable composition is useful as a reactive hot melt adhesive having an excellent balance between storage stability at high temperatures and curability at room temperature. The moisture-curing reactive hot melt adhesive composition comprises either: (A1) an organic polymer containing a reactive silicon group having two hydrolyzable groups and, as a curing catalyst, (B1) a metal carboxylate and/or a carboxylic acid; or (A2) an organic polymer containing a reactive silicon group having three hydrolyzable groups and, as a curing catalyst, (B2) a tetravalent tin compound.

    Abstract translation: 本发明提供使用毒性较低的含甲硅烷基的聚合物制备的可固化组合物,其中可固化组合物可用作在高温下的储存稳定性和室温下的固化性之间具有优异平衡的反应性热熔粘合剂。 湿固化反应性热熔粘合剂组合物包含:(A1)含有具有两个可水解基团的反应性硅基团的有机聚合物,作为固化催化剂,(B1)金属羧酸盐和/或羧酸; 或(A2)含有具有三个可水解基团的反应性硅基团和作为固化催化剂的(B2)四价锡化合物的有机聚合物。

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