公开(公告)号：US3128332A

公开(公告)日：1964-04-07

申请号：US1875960

申请日：1960-03-30

Applicant: HUGHES AIRCRAFT CO

Inventor： BURKIG JACK W ,  RICHARDSON JOHN E

IPC: H02B1/20 ,  H05K1/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4076 ,  H02B1/207 ,  H05K1/0289 ,  H05K3/467 ,  H05K2201/0317 ,  H05K2201/09945 ,  H05K2203/175

公开(公告)号：US2994846A

公开(公告)日：1961-08-01

申请号：US3194660

申请日：1960-05-26

Applicant: LOCKHEED AIRCRAFT CORP

Inventor： QUINN ROSS A

IPC: H01C1/16 ,  H01C7/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/167 ,  H01C1/16 ,  H01C7/00 ,  H05K1/182 ,  H05K3/4046 ,  H05K3/4076 ,  H05K2201/0317 ,  H05K2201/09981 ,  H05K2201/10174 ,  H05K2201/10651 ,  H05K2203/0315

公开(公告)号：US10057979B2

公开(公告)日：2018-08-21

申请号：US14301896

申请日：2014-06-11

Applicant: LG CHEM, LTD.

Inventor： Beom Mo Koo ,  Ji Young Hwang ,  Song Ho Jang ,  Jin Woo Park ,  Chung Wan Kim ,  Seung Heon Lee

IPC: G06F3/041 ,  H05K1/02 ,  H01B1/08 ,  H05K3/10 ,  H01L31/0236 ,  H05K7/02 ,  G06F3/044 ,  G06F3/045 ,  H01L31/05 ,  H01L31/18 ,  H05K1/09 ,  H05K3/16 ,  H05K3/46 ,  H03K17/96 ,  H05K1/03 ,  H02S40/38

CPC classification number: H05K1/0274 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/08 ,  H01L31/02366 ,  H01L31/05 ,  H01L31/18 ,  H02S40/38 ,  H03K17/962 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/10 ,  H05K3/16 ,  H05K3/4644 ,  H05K7/02 ,  H05K2201/0317 ,  Y10T29/49155 ,  Y10T428/24802

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

公开(公告)号：US09930779B2

公开(公告)日：2018-03-27

申请号：US15581606

申请日：2017-04-28

Applicant: TDK CORPORATION

Inventor： Kenichi Yoshida ,  Tatsuya Harada

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/42 ,  H05K3/16

CPC classification number: H05K1/115 ,  C23C28/02 ,  H01L21/768 ,  H01L23/147 ,  H01L23/48 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/16 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0317 ,  H05K2201/09563 ,  H05K2201/0959

Abstract: A through wiring substrate comprises a substrate having a pair of principal surfaces and a through hole penetrating between the pair of principal surfaces, the pair of principal surfaces and an inner surface of the through hole being electrically insulative; a through electrode provided on the inner surface of the through hole; a first wiring layer provided on one of the principal surfaces and connected to the through electrode; a second wiring layer provided on the other of the principal surfaces and connected to the through electrode; an underlying metal layer provided between the one of the principal surfaces and the first wiring layer; and catalyst metal particles existing between the underlying metal layer and the first wiring layer and between the through electrode and the inner surface of the through hole.

公开(公告)号：US09883588B2

公开(公告)日：2018-01-30

申请号：US15533195

申请日：2015-12-11

Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION

Inventor： Keiichi Kimura ,  Tomohiro Uno ,  Kazuaki Kaneko

IPC: H05K1/09 ,  H05K1/05 ,  H05K3/38 ,  H05K3/06 ,  H05K3/02 ,  H05K1/03

CPC classification number: H05K1/09 ,  C22C9/00 ,  C22F1/00 ,  C22F1/08 ,  H01B1/02 ,  H01B5/02 ,  H05K1/0393 ,  H05K1/05 ,  H05K3/022 ,  H05K3/06 ,  H05K3/38 ,  H05K2201/0154 ,  H05K2201/0317

Abstract: According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a main orientation so that the area percentage of a preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm3 to 12000 precipitates/μm3; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board.

公开(公告)号：US09848496B2

公开(公告)日：2017-12-19

申请号：US14978709

申请日：2015-12-22

Applicant: SAE MAGNETICS (H.K.) LTD.

Inventor： Akio Nakao

IPC: H05K1/14 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K3/284 ,  H01L21/561 ,  H01L21/568 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/15159 ,  H01L2924/15313 ,  H05K1/0218 ,  H05K3/0097 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/09145 ,  H05K2201/09845

Abstract: An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof. It obtains improved electromagnetic wave shielding effect and improved manufacturing efficiency.

公开(公告)号：US20170332489A1

公开(公告)日：2017-11-16

申请号：US15533195

申请日：2015-12-11

Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION

Inventor： Keiichi KIMURA ,  Tomohiro UNO ,  Kazuaki KANEKO

IPC: H05K1/09 ,  H05K3/02 ,  H05K3/38 ,  H05K1/03 ,  H05K3/06 ,  H05K1/05

CPC classification number: H05K1/09 ,  C22C9/00 ,  C22F1/00 ,  C22F1/08 ,  H01B1/02 ,  H01B5/02 ,  H05K1/0393 ,  H05K1/05 ,  H05K3/022 ,  H05K3/06 ,  H05K3/38 ,  H05K2201/0154 ,  H05K2201/0317

Abstract: According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a main orientation so that the area percentage of a preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm3 to 12000 precipitates/μm3; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board.

公开(公告)号：US20170238413A1

公开(公告)日：2017-08-17

申请号：US15098775

申请日：2016-04-14

Applicant: LG CHEM, LTD.

Inventor： Jin Hyong LIM ,  Song Ho JANG ,  Jin Woo PARK ,  Ki-Hwan KIM ,  In-Seok HWANG ,  Chung Wan KIM ,  Seung Heon LEE ,  Beom Mo KOO ,  Ji Young HWANG

IPC: H05K1/02 ,  G06F3/044 ,  H05K3/10 ,  H05K1/03 ,  H03K17/96

CPC classification number: H05K1/0274 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/08 ,  H01L31/02366 ,  H01L31/05 ,  H01L31/18 ,  H02S40/38 ,  H03K17/962 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/10 ,  H05K3/16 ,  H05K3/4644 ,  H05K7/02 ,  H05K2201/0317 ,  Y10T29/49155 ,  Y10T428/24802

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

公开(公告)号：US09510490B2

公开(公告)日：2016-11-29

申请号：US14190640

申请日：2014-02-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tomoki Kobayashi

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0075 ,  H01L2224/48091 ,  H05K1/0233 ,  H05K1/0243 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/086 ,  H05K2201/10098 ,  H05K2203/095 ,  H05K2203/1476 ,  H01L2924/00014

Abstract: There is provided an electronic device. The electronic device includes: a wiring board; a first electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a first frequency band; a second electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a second frequency band; a first magnetic thin film covering the wiring board, the first electronic component and the second electronic component, wherein the first magnetic thin film has a composition corresponding to the first frequency band; and a second magnetic thin film covering the first magnetic thin film, wherein the second magnetic thin film has a composition corresponding to the second frequency band.

Abstract translation: 提供电子设备。 电子设备包括：接线板; 第一电子部件，安装在所述布线基板上，并配置为发射具有第一频带的电磁波; 安装在所述布线板上并被配置为发射具有第二频带的电磁波的第二电子部件; 覆盖所述布线板的第一磁性薄膜，所述第一电子部件和所述第二电子部件，其中所述第一磁性薄膜具有对应于所述第一频带的组成; 以及覆盖所述第一磁性薄膜的第二磁性薄膜，其中所述第二磁性薄膜具有对应于所述第二频带的组成。

公开(公告)号：US09462698B2

公开(公告)日：2016-10-04

申请号：US13993463

申请日：2011-12-02

Applicant: Naoto Takahashi ,  Yasuyuki Yamamoto ,  Emi Ushioda

Inventor： Naoto Takahashi ,  Yasuyuki Yamamoto ,  Emi Ushioda

IPC: H05K1/09 ,  H05K3/06 ,  H05K3/10 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K3/06 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/108 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0341 ,  Y10T428/24967 ,  Y10T428/265

Abstract: The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (10); a titanium nitride layer (20) on the sintered substrate (10); an adhesion layer (30) on the titanium nitride layer (20); and a copper plating layer (40) on or above the adhesion layer (30), wherein the adhesion layer (30) contains copper and titanium, and has a thickness of no less than 0.1 μm and no more than 5 μm.

Abstract translation: 本发明提供一种金属化基板的制造方法，能够更容易地形成精细图案， 通过该方法制造的金属化基板; 以及该方法中使用的金属糊剂组合物。 金属化基板具有：烧结氮化物陶瓷基板（10）; 在所述烧结基板（10）上的氮化钛层（20）; 在氮化钛层上的粘合层（30）; 以及在所述粘合层（30）上或上方的镀铜层（40），其中所述粘合层（30）含有铜和钛，并且具有不小于0.1μm且不大于5μm的厚度。