Abstract:
Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.
Abstract:
Provided is a circuit board in which visibility of an alignment mark is improved.In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.
Abstract:
A transparency having a bus bar system includes a non-conductive substrate having a major surface. At least one conductive coating is located over at least a portion of the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is located over at least a portion of the conductive coating. A metallic member, such as a metallic foil or metallic braid, is located over the isotropically conductive adhesive.
Abstract:
Provided is a transparent flexible printed wiring board which is excellent in flexibility, heat resistance and adhesion between a transparent film and a transparent conductive film.A transparent polyimide film, whose dimension change rate in association with a baking process is not larger than ±0.2%, is prepared. ITO ink containing ITO fine particles and a binder is printed in the form of a predetermined pattern on the transparent polyimide film by an ink-jet method. The ITO ink is then baked at 230 to 300° C., thereby forming a transparent conductive film with a binder ratio of 5 to 10 wt %.
Abstract:
A process for manufacturing a transparent body for a touch screen panel is described. The process includes: depositing a first transparent layer stack over a flexible transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the first refractive index; providing a transparent conductive film over the first transparent layer stack; depositing a layer of a conductive material over the transparent conductive film; providing a polymer layer over the layer of a conductive material; imprinting a pattern, e.g. a 3D pattern, on the polymer layer; etching the layer of the conductive material based upon the pattern to form conductive paths for the touch screen panel; and etching the transparent conductive film based upon the pattern to form a structured transparent conductive pattern for touch detection.
Abstract:
The invention relates to a glass substrate having enhanced optical properties for optoelectronic devices, wherein said substrate is totally or partially textured, by means of a chemical attack, on at least one of the surfaces thereof with a set of geometric patterns such that the arctangent of the ratio of the mean height of the patterns, Rz, to half the mean distance between the peaks of two contiguous patterns, RSm, is at least equal to an angle of 35° and at most equal to an angle of 80°.
Abstract:
A touch-sensitive device includes a transparent substrate, a touch-sensing structure, a decorative layer, a trace layer, a passivation layer and a sheltering layer. The touch-sensing structure is disposed on the transparent substrate and located in a touch-sensitive region. The decorative layer is disposed on the transparent substrate and located in a non-touch-sensitive region, and the trace layer is disposed on the decorative layer. The passivation layer is disposed on the transparent substrate and at least covers the touch-sensing structure and the trace layer. The sheltering layer is disposed at least on the passivation layer and located in the non-touch-sensitive region.
Abstract:
The transparent electroconductive film is provided with: a transparent substrate formed from a film-shaped polymer resin; a first hard coat layer laminated on one surface of the substrate; and a first transparent conductor layer laminated on the upper side of the first hard coating layer. The substrate has a film thickness of 2 to 250 μm. The first hard coating layer is formed from a curable resin containing an inorganic oxide, and has a film thickness of 0.01 μm to less than 0.5 μm, or more than 6 μm to 10 μm. The first transparent conductor layer is formed from at least one material selected from the group consisting of an inorganic oxide, a metal, and carbon, has a film thickness of 10 nm to 2 μm, and is patterned so as to have formed thereon a patterned section and a non-patterned section.
Abstract:
A conductor for a flexible substrate, used for a flexible flat cable or disposed inside a flexible printed-circuit board, according to the present invention comprises: a base conductor made of Cu or Cu-alloy; a plating film made of Sn or Sn-alloy formed on a surface of the base conductor; and a surface oxide film formed on a surface of the plating film, in which the surface oxide film includes oxide of an element other than Sn or a mixture of Sn oxide and oxide of an element other than Sn.
Abstract:
A planar thermal dissipation patch comprises a polymer substrate; an adhesive layer attached under the polymer substrate; a protection sheet over the adhesive layer, the protection sheet is removed from the adhesive layer before attaching the planar thermal dissipation patch; a thermal dissipation layer formed on the polymer substrate; wherein the thermal dissipation layer is formed of CNT, conductive polymer, graphite or the combination thereof.