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    PRINTBAR AND METHOD OF FORMING SAME
    115.
    发明申请
    PRINTBAR AND METHOD OF FORMING SAME 有权
    PRINTBAR及其形成方法

    公开(公告)号：US20160221341A1

    公开(公告)日：2016-08-04

    申请号：US15021522

    申请日：2013-09-20

    Applicant: HEWLETT-PACKARD DEVELOPMENT, COMPANY L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie

    IPC: B41J2/16 ,  B41J2/14

    CPC classification number: B41J2/1637 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2002/14419 ,  B41J2202/19

    Abstract: A printbar module and method of forming the same are described. In an example, a printbar module includes a printed circuit board (PCB), a plurality of printhead die slivers, and a manifold. The printhead die slivers are embedded in molding and attached to the PCB. The molding has a plurality of slots in fluidic communication with fluid feed holes of the printhead die slivers. The manifold is in direct fluidic communication with the slots to supply fluid thereto.

    Abstract translation: 描述了印刷模块及其形成方法。 在一个示例中，打印头模块包括印刷电路板（PCB），多个打印头芯片和歧管。 打印头芯片嵌入模制中并连接到PCB。 模制件具有与打印头芯片的流体供给孔流体连通的多个槽。 歧管与槽直接流体连通以向其供应流体。

    MOLDED PRINTHEAD
    116.
    发明申请
    MOLDED PRINTHEAD 有权
    模制打印

    公开(公告)号：US20160001558A1

    公开(公告)日：2016-01-07

    申请号：US14770762

    申请日：2013-12-13

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie

    IPC: B41J2/16

    CPC classification number: B41J2/1637 ,  B41J2/14 ,  B41J2/16 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20

    Abstract: In one example, a molded printhead includes a printhead die embedded in a molding and an external electrical contact electrically connected to the printhead die and exposed outside the molding to connect to circuitry external to the printhead. The molding has a channel therein through which fluid may pass to the back part of the die. The front part of the die is exposed outside the molding and the back part of the die is covered by the molding except at the channel and the thickness of the molding varies from a lesser thickness around the die to a greater thickness away from the die.

    Abstract translation: 在一个示例中，模制打印头包括嵌入模制件中的打印头模头和电连接到打印头模具的外部电触头，并暴露在模制件外部以连接到打印头外部的电路。 模制件具有通道，流体可以通过该通道传递到模具的后部。 模具的前部暴露在模制件的外部，并且模具的后部由模具覆盖，除了在通道之外，模制件的厚度从模具周围的较小厚度变化到离模具更大的厚度。

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