公开(公告)号：US20200303328A1

公开(公告)日：2020-09-24

申请号：US16394537

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Richard Dischler ,  Johanna M. Swan ,  Victor J. Prokoff

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US20200294940A1

公开(公告)日：2020-09-17

申请号：US16397923

申请日：2019-04-29

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Henning Braunisch ,  Johanna M. Swan ,  Telesphor Kamgaing

IPC: H01L23/66 ,  G02B6/30 ,  H01P11/00 ,  H01P3/16

Abstract: Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US20200273824A1

公开(公告)日：2020-08-27

申请号：US16369836

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Hyung-Jin Lee ,  Henning Braunisch ,  Richard Dischler

IPC: H01L23/66 ,  H01L23/00 ,  H01L21/48

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate and a signal interconnect coupled with the face of the package substrate. The microelectronic package may further include a ground interconnect coupled with the face of the package substrate. The ground interconnect may at least partially surround the signal interconnect. Other embodiments may be described or claimed.

公开(公告)号：US20190287908A1

公开(公告)日：2019-09-19

申请号：US15963066

申请日：2018-04-25

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Johanna M. Swan

IPC: H01L23/538 ,  H01L23/66 ,  H01L25/065

Abstract: Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

公开(公告)号：US20190097293A1

公开(公告)日：2019-03-28

申请号：US16186103

申请日：2018-11-09

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini ,  Henning Braunisch ,  Gilbert W. Dewey ,  Telesphor Kamgaing ,  Hyung-Jin Lee ,  Johanna M. Swan

IPC: H01P3/127 ,  H01P3/10 ,  H01P5/103

Abstract: There is disclosed in one example an electromagnetic wave launcher apparatus, including: an interface to an electromagnetic waveguide; a first launcher configured to launch a high-frequency electromagnetic signal onto a first cross-sectional portion of the waveguide; and a second launcher configured to launch a lower-frequency electromagnetic signal onto a second cross-sectional portion of the waveguide.

公开(公告)号：US12261097B2

公开(公告)日：2025-03-25

申请号：US18366734

申请日：2023-08-08

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H01L23/427 ,  H01L23/31 ,  H01L23/373 ,  H01L23/38 ,  H01L23/48 ,  H01L23/66 ,  H01L25/16 ,  H03H9/46

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US12255158B2

公开(公告)日：2025-03-18

申请号：US16911543

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Neelam Prabhu Gaunkar ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Diego Correas-Serrano ,  Henning Braunisch

IPC: H01L23/66 ,  H01L23/498 ,  H01P3/00 ,  H01P3/08

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US12126068B2

公开(公告)日：2024-10-22

申请号：US16912027

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16

CPC classification number: H01P3/16

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US12007170B2

公开(公告)日：2024-06-11

申请号：US16533235

申请日：2019-08-06

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: F28D15/04 ,  H01L23/367 ,  H01L23/38 ,  H01L23/427

CPC classification number: F28D15/046 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/38 ,  H01L23/427

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US11990419B2

公开(公告)日：2024-05-21

申请号：US16905202

申请日：2020-06-18

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Feras Eid ,  Adel Elsherbini ,  David Johnston ,  Jyothi Bhaskarr Velamala ,  Rachael Parker

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/498 ,  H04L9/32

CPC classification number: H01L23/544 ,  H01L23/49838 ,  H01L24/73 ,  H04L9/3278 ,  H01L2223/54413 ,  H01L2224/73204

Abstract: Techniques and mechanisms for providing physically unclonable function (PUF) circuitry at a substrate which supports coupling to an integrated circuit (IC) chip. In an embodiment, the substrate comprises an array of electrodes which extend in a level of metallization at a side of the insulator layer. A cap layer, disposed on the array, is in contact with the electrodes and with a portion of the insulator layer which is between the electrodes. A material of the cap layer has a different composition or microstructure than the metallization. Regions of the cap layer variously provide respective impedances each between a corresponding two electrodes. In other embodiments, the substrate includes (or couples to) integrated circuitry that is operable to determine security information based on the detection of one or more such impedances.