公开(公告)号：US09673367B2

公开(公告)日：2017-06-06

申请号：US15022557

申请日：2014-09-17

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Tae Hwan Song

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L23/544 ,  H01L23/00 ,  H01L33/54 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L23/544 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L33/486 ,  H01L33/54 ,  H01L33/647 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/08238 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81207 ,  H01L2224/81424 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/00015 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/19107 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A chip mounting substrate including a plurality of conductive portions to apply an electrode voltage to a mounted chip having electrode portions, at least one insulation portion configured to electrically isolate conductive portions, a cavity depressed inward of the conductive portions and providing a space in which the chip is mounted and bumps formed on surfaces of the conductive portions having the cavity and bonded to the electrode portions. In the case of a metal substrate, a tight bonding is enabled between the chip and the substrate by bonding a plating layer formed on the electrode portions of the chip using bumps formed on the metal substrate.

公开(公告)号：US20160084787A1

公开(公告)日：2016-03-24

申请号：US14864184

申请日：2015-09-24

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12 ,  H05B3/28 ,  H05B3/03

CPC classification number: H05B3/03 ,  G01N27/12 ,  H05B3/262 ,  H05B2203/014 ,  H05B2203/017

Abstract: A micro heater and a micro sensor is capable of providing a heater having a small thermal capacity by forming an air gap which surrounds the heater wire, and forming the heater wire on a porous substrate.

Abstract translation: 微加热器和微型传感器能够通过形成围绕加热丝的气隙来形成具有小热容量的加热器，并且在多孔基底上形成加热丝。

公开(公告)号：US20140374783A1

公开(公告)日：2014-12-25

申请号：US14365408

申请日：2012-10-04

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Seung Ho Park

IPC: H01L27/15 ,  H01L33/64 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L27/15 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/005 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05B33/0803 ,  H05B33/0806 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to an optical device integrated with a driving circuit and a power supply circuit, a method for manufacturing an optical device substrate used therein, and a substrate thereof, which are capable of reducing the overall size and facilitating the handling and management thereof by mounting a plurality of optical elements, driving circuits thereof, and power supply circuits thereof on a single substrate for an optical device having a vertical insulating layer. The objective of the present invention is to provide the optical device integrated with the driving circuit and the power supply circuit, the method for manufacturing the optical device substrate used therein, and the substrate thereof which are capable of reducing the overall size and facilitating the handling and the management thereof by mounting the plurality of optical elements, the driving circuits thereof, and the power supply circuits thereof on the single substrate for the optical device having the vertical insulating layer.

Abstract translation: 本发明涉及与驱动电路和电源电路集成的光学器件，其中使用的光学器件衬底的制造方法及其基板，其能够减小总体尺寸并且便于其处理和管理 通过将多个光学元件，其驱动电路及其电源电路安装在具有垂直绝缘层的光学器件的单个基板上。 本发明的目的是提供与驱动电路和电源电路集成的光学装置，其中使用的光学器件基板的制造方法及其基板，其能够减小总体尺寸并便于处理 并且通过将多个光学元件及其驱动电路及其电源电路安装在具有垂直绝缘层的光学器件的单个基板上来进行管理。