公开(公告)号：US20180086924A1

公开(公告)日：2018-03-29

申请号：US15275085

申请日：2016-09-23

Applicant: Tyco Electronics Corporation

Inventor： Megan Hoarfrost Beers ,  Jialing Wang ,  Quentin F. Polosky ,  Jaydip Das ,  Ting Gao ,  Vishrut Vipul Mehta

IPC: C09D5/24 ,  B29C67/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D109/06 ,  C09D177/00 ,  H01B1/20

CPC classification number: C09D5/24 ,  B29C64/106 ,  B29C64/118 ,  B29C64/165 ,  B29K2101/12 ,  B29K2105/16 ,  B29K2505/08 ,  B29K2505/10 ,  B29K2995/0005 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08K3/08 ,  C08K5/098 ,  C08K2003/085 ,  C08K2003/385 ,  C08K2201/001 ,  C09D109/06 ,  C09D177/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24

Abstract: A method of forming a composite article, wherein the method includes providing a composite formulation, the composite formulation including a polymer matrix and at least one additive distributed in the polymer matrix at a concentration of between 10% and 50%, by volume, the at least one additive having a molar percentage of carbon that is equal to or less than 90%, feeding the composite formulation to a printing head of an additive manufacturing device, heating the composite formulation to form a heated composite formulation, extruding the heated composite formulation through a nozzle in the printing head, and depositing the heated composite formulation onto a platform to form the composite article. Also provided is a composite article produced from a composite formulation having at least one additive distributed in a polymer matrix.

公开(公告)号：US20180079647A1

公开(公告)日：2018-03-22

申请号：US15822795

申请日：2017-11-27

Applicant: Dongjin Semichem Co., Ltd.

Inventor： Sunchan Park ,  Hyeonseong Choe ,  Soo Yeon Lee ,  Seon Yeong Gong

IPC: C01B32/194 ,  C01B32/198 ,  C07C211/03 ,  C07C211/09 ,  C08K3/04

CPC classification number: C01B32/194 ,  C01B32/198 ,  C01B2204/30 ,  C07C211/03 ,  C07C211/09 ,  C07C211/18 ,  C07C211/51 ,  C07C2601/14 ,  C08J2300/22 ,  C08J2300/24 ,  C08K3/042 ,  C08K2201/001 ,  C08L67/02

Abstract: Disclosed is a functionalized graphene containing two or more amines having excellent electrical, thermal and mechanical properties by allowing good interfacial bonding force and uniform dispersion with a thermoplastic polymer, and a method for preparing the functional graphene. The functionalized graphene comprises a carbon material selected from the group consisting of graphene, reduced graphene, graphene oxide, and mixture thereof; and a monovalent amine group and a bivalent or higher amine group which are bonded to the carbon material.

公开(公告)号：US20180061519A1

公开(公告)日：2018-03-01

申请号：US15692492

申请日：2017-08-31

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takatoshi ABE ,  Tomoaki SAWADA

IPC: H01B1/12 ,  C08F12/08 ,  C08F20/14 ,  C08F20/44

CPC classification number: H01B1/125 ,  C08F12/08 ,  C08F20/14 ,  C08F20/44 ,  C08F2500/01 ,  C08K3/08 ,  C08K9/06 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L33/14

Abstract: The present invention relates to a conductive resin composition comprising, as essential components, a resin (A), a curing agent (B) reacting with the resin (A), and a conductive filler (C), wherein the resin (A) has a functional group, a functional group equivalent of 400 g/eq or more and 10,000 g/eq or less, a Tg (glass transition temperature) or a softening point of 40° C. or less, or an elastic modulus of less than 1.0 GPa at 30° C., and wherein the conductive filler (C) is made of a conductive material having a volume specific resistivity of 1×10−4 Ω·cm or less at room temperature.

公开(公告)号：US20180053703A1

公开(公告)日：2018-02-22

申请号：US15554304

申请日：2015-07-16

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyoung Chul BAE ,  Dong Hwan LEE

IPC: H01L23/29 ,  C08K3/22 ,  C08K3/36

CPC classification number: H01L23/295 ,  C08G59/621 ,  C08G59/686 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/006 ,  C08K2201/011 ,  C09D163/00 ,  H01L23/293 ,  C08L63/00

Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).

公开(公告)号：US20180051158A1

公开(公告)日：2018-02-22

申请号：US15528213

申请日：2015-11-19

Applicant: DUPONT-MITSUI FLUOROCHEMICALS CO., LTD.

Inventor： PHAM HOAI NAM ,  MINEYUKI NODA ,  KAZUHIKO NAKA ,  OSAMU HAYAKAWA

IPC: C08K3/38 ,  C08L27/12 ,  C08J3/00 ,  C08J3/20 ,  C08J5/18 ,  C09K5/14

CPC classification number: C08K3/38 ,  C08J3/005 ,  C08J3/203 ,  C08J5/18 ,  C08J2327/12 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/014 ,  C08K2201/016 ,  C08L27/12 ,  C08L2205/18 ,  C09K5/14 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention is a polymer composition, containing: 30 to 60 volume % of a melt processable fluoropolymer; and 40 to 70 volume % of boron nitride particles; wherein the boron nitride particles are made from particles (A) and particles (B), the particles (A) are spherical aggregate particles with an average particle diameter of 55 μm to 100 μm, and an aspect ratio of 1 to 2, the particles (B) are particles with an average particle diameter of 8 μm to 55 μm, and the volume ratio of the particles (A) to the total amount of boron nitride is 80 to 99 volume %. The polymer compositions have excellent moldability, insulation properties, heat conductivity, and heat resistance, and are suitable as raw materials for a sufficiently strong molded products, such as thin films.

公开(公告)号：US20180044498A1

公开(公告)日：2018-02-15

申请号：US15551910

申请日：2016-02-26

Applicant: ZEON CORPORATION

Inventor： Masahiro SHIGETA ,  Tsutomu NAGAMUNE ,  Arinobu KATADA

IPC: C08K3/04 ,  H01B1/18 ,  C08K7/24

CPC classification number: C08K3/041 ,  B82Y5/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/04 ,  C08K7/06 ,  C08K7/24 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/006 ,  C08K2201/011 ,  C08L83/04 ,  H01B1/18 ,  Y10S977/75 ,  Y10S977/753 ,  Y10S977/843 ,  Y10S977/932

Abstract: Disclosed is a silicone rubber composition and a vulcanized product thereof, which show high levels of flexibility and electrical conductivity at the same time. The disclosed silicone rubber composition comprises a silicone rubber and fibrous carbon nanostructures including carbon nanotubes, wherein the fibrous carbon nanostructures exhibit a convex upward shape in a t-plot obtained from an adsorption isotherm. The disclosed vulcanized product is obtainable by vulcanization of the silicone rubber composition.

公开(公告)号：US20180044485A1

公开(公告)日：2018-02-15

申请号：US15557497

申请日：2016-03-11

Applicant: Total Research & Technology Feluy

Inventor： Dimitri Rousseaux ,  Olivier Lhost ,  Phillippe Lodefier ,  Eddi Scandino

IPC: C08J3/22 ,  H01B1/24 ,  C08K3/04

CPC classification number: C08J3/226 ,  C08J3/203 ,  C08J2323/04 ,  C08J2323/08 ,  C08J2323/10 ,  C08J2323/12 ,  C08J2367/04 ,  C08J2423/04 ,  C08J2423/10 ,  C08J2423/12 ,  C08K3/041 ,  C08K7/24 ,  C08K2201/001 ,  C08K2201/011 ,  C08L23/04 ,  C08L23/142 ,  H01B1/24

Abstract: The present invention relates to a masterbatch for use in a process of preparing a composite material comprising a blend of a first semi-crystalline polymer with at least 5 wt % carbon nanotubes. Good dispersion of the carbon nanotube is obtained within the masterbatch and evidenced by the blending of the masterbatch with a second semi-crystalline polymer miscible with the first one in respective proportions to obtain a composite material containing about 1 wt % of carbon nanotubes wherein said composite material yields an agglomerate area fraction U % lower than 2 and a surface resistivity lower than 105 ohm/sq.

公开(公告)号：US20180044191A1

公开(公告)日：2018-02-15

申请号：US15555859

申请日：2016-03-03

Applicant: HITACHI CHEMICAL COMPANY, LTD. ,  NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Shihui SONG ,  Keiji FUKUSHIMA ,  Yoshitaka TAKEZAWA ,  Yuji HOTTA ,  Yusuke IMAI ,  Daisuke SHIMAMOTO ,  Yuichi TOMINAGA

IPC: C01B33/42 ,  C07C211/63 ,  C08K9/04 ,  C08J5/18 ,  C08K3/36 ,  H01B3/02 ,  C08K3/38 ,  C09K5/14 ,  C01B33/44 ,  B32B15/08 ,  B32B15/20 ,  C07C209/90 ,  C08K3/22

CPC classification number: C01B33/42 ,  B32B15/08 ,  B32B15/20 ,  B32B2264/107 ,  B32B2307/304 ,  C01B33/44 ,  C07C209/90 ,  C07C211/63 ,  C08J5/18 ,  C08J2361/12 ,  C08K3/22 ,  C08K3/36 ,  C08K3/38 ,  C08K9/04 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08L101/00 ,  C09K5/14 ,  H01B3/02

Abstract: A method of producing a complex of a lamellar inorganic compound and an organic compound includes: heat-treating a particular non-swelling lamellar inorganic compound within a pyrolysis temperature range of the non-swelling lamellar inorganic compound; and intercalating an organic compound into the non-swelling lamellar inorganic compound in a dispersion liquid in which the heat-treated non-swelling lamellar inorganic compound is dispersed in a medium, thereby inserting the organic compound into an interlamellar space of the non-swelling lamellar inorganic compound.

公开(公告)号：US20180030327A1

公开(公告)日：2018-02-01

申请号：US15642082

申请日：2017-07-05

Applicant: Honeywell International Inc.

Inventor： Liqiang Zhang ,  Huifeng Duan ,  Kai Zhang ,  Ya Qun Liu ,  Ling Shen ,  Wei Jun Wang ,  Haigang Kang

IPC: C09K5/14 ,  H05K7/20 ,  C08K3/22

CPC classification number: C09K5/14 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/014 ,  H05K7/2039

Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

公开(公告)号：US20170372815A1

公开(公告)日：2017-12-28

申请号：US15538298

申请日：2016-01-08

Applicant: Momentive Performance Materials GmbH

Inventor： Beatrice Grau ,  Lada Bemert ,  Harry Zumaque ,  Oliver Safarowski

IPC: H01B3/46 ,  C08J3/24 ,  C08L83/04 ,  C08K3/04 ,  H02G15/04 ,  G01N27/14

CPC classification number: H01B3/46 ,  C08J3/24 ,  C08J2383/07 ,  C08K3/04 ,  C08K3/36 ,  C08K5/14 ,  C08K5/56 ,  C08K2201/001 ,  C08K2201/006 ,  C08L83/00 ,  C08L83/04 ,  C08L2203/202 ,  G01N27/14 ,  H01B3/004 ,  H01B3/006 ,  H02G15/04 ,  H02G15/064 ,  H02G15/103 ,  H02G15/184

Abstract: The invention relates to a silicone rubber composition having specific dielectric properties which can be used as insulator material in high voltage direct current applications and a method for the manufacture of cable accessories like cable joints. The invention comprises as well a method for the determination of the optimum dielectric properties and the related amount of dielectric active additives.