公开(公告)号：US20140293531A1

公开(公告)日：2014-10-02

申请号：US13851750

申请日：2013-03-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Robert J. Brooks ,  Scott Michael Fehringer

IPC: G06F1/16 ,  H05K3/00 ,  G06F1/20

CPC classification number: H05K3/00 ,  G06F1/18 ,  G06F1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F2200/201 ,  H05K1/148 ,  H05K7/1487 ,  H05K2201/047 ,  H05K2201/10159 ,  Y10T29/4913

Abstract: According to an example, a server node may include a base module and a plurality of face modules rotatably coupled to the base module to form an enclosure. The base module and a face module of the plurality of face modules may each include an inner surface that includes an electrical component. A flexible printed circuit interconnect may communicatively interconnect the electrical component on the inner surface of the base module to the electrical component on the inner surface of the face module.

Abstract translation: 根据示例，服务器节点可以包括基本模块和可旋转地联接到基本模块以形成外壳的多个面模块。 多个面部模块的基座模块和面部模块可以各自包括包括电气部件的内表面。 柔性印刷电路互连可以将基座模块的内表面上的电气部件可通信地互连到面部模块的内表面上的电气部件。

公开(公告)号：US08827547B2

公开(公告)日：2014-09-09

申请号：US13795030

申请日：2013-03-12

Applicant: International Business Machines Corporation

Inventor： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC: G01K1/12 ,  G01K1/16 ,  G01K13/10 ,  G01K17/06

CPC classification number: G06F17/5009 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20609 ,  H05K7/20745

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract translation: 提供了设备和方法，以便于模拟电子子系统，电子机架或电子机架行的热气流排气。 该装置包括热模拟器，其包括空气移动装置和流体对空气热交换器。 空气移动装置建立从热模拟器的空气入口到空气出口侧的气流，其被定制成与要模拟的电子子系统，机架或行架排的加热气流排气相关联。 流体对空气热交换器通过热模拟器加热气流，使来自模拟器的气流的温度被调整为与正在模拟的电子子系统，机架或行架的加热气流排气的温度相关。 该装置还包括流体分配装置，其包括与流体模拟器分离设置的流体分配单元，并向热模拟器的流体对空气热交换器提供热流体。

公开(公告)号：US08739856B2

公开(公告)日：2014-06-03

申请号：US12215320

申请日：2008-06-26

Applicant: Andrei G. Fedorov

Inventor： Andrei G. Fedorov

IPC: F28F7/00 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F13/00 ,  F28F13/003 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y02D10/16 ,  H01L2924/00

Abstract: Briefly described, embodiments of this disclosure include heat management devices, heat management systems, methods of heat management, and the like.

Abstract translation: 简而言之，本公开的实施例包括热管理装置，热管理系统，热管理方法等。

公开(公告)号：US20140146465A1

公开(公告)日：2014-05-29

申请号：US13711490

申请日：2012-12-11

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： CHAO-KE WEI

IPC: G06F1/20 ,  H05K5/02

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20172 ,  H05K7/20263 ,  H05K7/20736 ,  H05K7/20781

Abstract: A container data center includes a container and a server cabinet received in the container. The server cabinet includes a rack and a number of heat dissipation devices mounted to a rear side of the rack. Each heat dissipation device includes a case fixed to the rack, a fan mounted to an outer side of the case, and a heat dissipation plate received in the case and aligning with the fan. The heat dissipation plate defines a vent. The fan draws heat air through the vent of the heat dissipation plate from the rack, and the heat air is cooled by refrigerant received in the heat dissipation plate to become cool air. The cool air flows in the container, and circularly flows into the cabinet from a front side of the cabinet.

Abstract translation: 容器数据中心包括容器和容纳在容器中的服务器柜。 服务器机柜包括一个机架和一些安装在机架背面的散热装置。 每个散热装置包括固定到机架的壳体，安装在壳体的外侧的风扇和容纳在壳体中并与风扇对准的散热板。 散热板定义了通风口。 风扇通过散热板的通风口从机架吸入热空气，热空气由散热板中接收的制冷剂冷却成冷空气。 冷空气在容器内流动，并从机柜的前侧循环流入机柜。

公开(公告)号：US20140126141A1

公开(公告)日：2014-05-08

申请号：US13931730

申请日：2013-06-28

Applicant: Silicon Graphics International Corp.

Inventor： Steven J. Dean ,  Richard B. Salmonson ,  Russell E. Stacy ,  Roger Ramseier ,  Mark Maloney

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

Abstract translation: 高性能计算系统包括一个或多个具有冷却歧管并且被配置为保持多个计算刀片的刀片式外壳，以及具有包括两个计算板的至少一个计算刀片的每个刀片机箱中的多个计算刀片。 该系统还包括两个或更多个冷却板，其中每个冷却板位于计算刀片内的两个对应的计算板之间，以及流体连接，其连接到冷却板并与流体冷却歧管流体连通。

公开(公告)号：US20140071620A1

公开(公告)日：2014-03-13

申请号：US14017347

申请日：2013-09-04

Applicant: FUJITSU LIMITED

Inventor： EIJI WAJIMA

IPC: H05K7/20

CPC classification number: H05K7/20281 ,  G06F1/20 ,  G06F1/26 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A power-supply controlling system includes an integrated circuit that outputs a first instruction signal, which instructs an electricity-supply unit to supply electricity to a device that releases heat, a detecting unit that detects an operating status of a cooling unit that cools the device, a state signal generating unit that generates a state signal in accordance with the detected operating status, the state signal indicating whether or not the cooling unit is being driven, and an output unit that generates a second instruction signal by using the first instruction signal and the state signal, and outputs the second instruction signal to the electricity-supply unit, the second instruction signal giving an instruction to supply electricity to the device.

Abstract translation: 电源控制系统包括：集成电路，其输出指示电力供应单元向放热装置供电的第一指示信号;检测单元，其检测冷却装置的冷却单元的运行状态; 状态信号生成单元，其根据检测到的运行状态生成状态信号，表示是否正在驱动冷却单元的状态信号，以及通过使用第一指示信号生成第二指示信号的输出单元， 状态信号，并且将第二指令信号输出到电力供应单元，第二指令信号给出向设备供电的指令。

公开(公告)号：US08665592B2

公开(公告)日：2014-03-04

申请号：US13280864

申请日：2011-10-25

Applicant: Anthony C. Mowry ,  David G. Farber ,  Michael J. Austin ,  John E. Moore

Inventor： Anthony C. Mowry ,  David G. Farber ,  Michael J. Austin ,  John E. Moore

IPC: H05K7/20 ,  G06F1/00

CPC classification number: G06F1/206 ,  G06F2200/201 ,  Y02D10/16

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract translation: 多核微处理器提供输出端子上每个核心的功率管理状态的指示。 响应于各个核心的功率管理状态的指示来响应于各个核心的功率管理状态的指示来调节内核的冷却，其中在处于更活跃状态的情况下向这些核心提供额外的冷却，并且在较不活跃状态下提供给那些核心的冷却

公开(公告)号：US08655501B2

公开(公告)日：2014-02-18

申请号：US12540479

申请日：2009-08-13

Applicant: Wade D. Vinson ,  Robert B. Curtis ,  David W. Sherrod

Inventor： Wade D. Vinson ,  Robert B. Curtis ,  David W. Sherrod

IPC: G05D23/00

CPC classification number: G05D23/19 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

Abstract: Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.

Abstract translation: 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵和泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。

公开(公告)号：US08654530B1

公开(公告)日：2014-02-18

申请号：US11873246

申请日：2007-10-16

Applicant: Zhihai Zack Yu

Inventor： Zhihai Zack Yu

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20336 ,  H01L2924/00

Abstract: A heat transfer apparatus and method are provided for transferring heat between integrated circuits. In use, a heat transfer medium is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit. Furthermore, a single casting formed about the heat transfer medium and defining at least one heat sink is provided for thermal communication with the first integrated circuit or the second integrated circuit.

Abstract translation: 提供了用于在集成电路之间传递热量的传热装置和方法。 在使用中，传热介质设置有与第一集成电路热连通的第一端和与第二集成电路热连通的第二端。 此外，提供围绕传热介质形成且限定至少一个散热器的单个铸造件，用于与第一集成电路或第二集成电路进行热连通。

公开(公告)号：US08584737B2

公开(公告)日：2013-11-19

申请号：US12649299

申请日：2009-12-29

Applicant: Xian-Xiu Tang

Inventor： Xian-Xiu Tang

IPC: F28F7/00 ,  H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2215/04 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20809

Abstract: A heat dissipation device includes a heat pipe, a first fin unit, a second fin unit, and a centrifugal fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit. The heat pipe includes an evaporation section, a first condensing section and a second condensing section. The first fin unit includes a plurality of stacked first fins with a first channel defined between adjacent first fins. A notch is defined in the first fin unit receiving the evaporation section, and a canal is defined in the first fin unit receiving the first condensing section of the heat pipe. The second channel includes a plurality of stacked second fins. A second channel is defined between adjacent second fins perpendicular to the first channels. A passage is defined in the second fin unit receiving the second condensing section of the heat pipe.

Abstract translation: 一种散热装置，包括设置在第一散热片单元上的热管，第一散热片，第二散热片和离心式风扇，用于将空气从第一散热片单元吸入第二散热片。 热管包括蒸发部，第一冷凝部和第二冷凝部。 第一翅片单元包括多个堆叠的第一翅片，其中第一通道限定在相邻的第一翅片之间。 在接收蒸发部的第一翅片单元中限定有凹口，并且在第一翅片单元中限定了容纳热管的第一冷凝部的通道。 第二通道包括多个堆叠的第二散热片。 在垂直于第一通道的相邻第二鳍片之间限定第二通道。 通道被限定在接收热管的第二冷凝部的第二翅片单元中。